Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Underwood planting method of shiitake

A technology of shiitake mushrooms and forests, applied in botany equipment and methods, plant cultivation, plant protection, etc., can solve the problems of increasing the number of harmful spores and pests, breeding of molds and pests, ecological environment pollution, etc., and achieves simple and convenient planting methods, Soil insect pest suppression, the effect of low construction strength

Inactive Publication Date: 2019-05-10
贵州好菇粮农业科技有限公司
View PDF8 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to estimates, the national annual output is more than 7 million tons [refer to Zhao Xiaoli, Chen Zhiyi, Liu Xueming. Research progress on efficient utilization of mushroom chaff [J]. Chinese Edible Fungi, 2012(2):1-3], mushroom residues contain Rich in protein and other nutrients, improper handling of them will not only cause waste of resources, but also lead to the growth of mold and pests, increase the number of harmful spores and pests in the air, and cause pollution to the agricultural ecological environment. How to deal with a large number of mushrooms Slag waste is also becoming more and more necessary

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for planting shiitake mushrooms under a forest, comprising steps as follows:

[0025] 1) Select the site to build the shed: choose a forest with lush growth and no pests and diseases, and build a triangular shed with a height of 1.8m under the forest. Add another layer of waterproof film; spread a layer of 5cm water-holding substrate on the bottom of the shed, compact it, and spread a layer of insect-proof net; the forest is pine and Berlin, the forest floor is smooth and well-drained, and the thickness of the accumulated leaves under the forest exceeds 3cm; The insect-proof net is a polyethylene net with a density of 60 meshes; the thickness of the waterproof film is 0.08 mm; the straw is exposed to the sun for 3 days before being used; the preparation method of the water-holding matrix is: in parts by mass, corn Mix 150 parts of straw, 40 parts of sawdust, 10 parts of bamboo charcoal, 20 parts of bagasse, 50 parts of garlic straw, 50 parts of Artemisia annua ...

Embodiment 2

[0031] A method for planting shiitake mushrooms under a forest, comprising steps as follows:

[0032] 1) Select the site to build the shed: choose a forest with lush growth and no pests and diseases, and build a triangular shed with a height of 2m under the forest. Add a layer of waterproof film; sprinkle a layer of 10cm water-holding substrate on the bottom of the shed, compact it, and spread a layer of insect-proof nets; the selection criteria for the forest are pine forests, the ground of the forest is flat, the drainage is good, and the thickness of the accumulated leaves under the forest exceeds 3cm The insect-proof net is a polyethylene net with a density of 100 meshes; the thickness of the waterproof film is 0.1mm; the straw is exposed to the sun for 5 days before being used; the preparation method of the water-holding matrix is: in parts by mass, Mix 180 parts of corn stalks, 50 parts of wood chips, 20 parts of bamboo charcoal, 40 parts of bagasse, 60 parts of garlic s...

Embodiment 3

[0038] A method for planting shiitake mushrooms under a forest, comprising steps as follows:

[0039] 1) Select the site to build the shed: choose a forest with lush growth and no pests and diseases, and build a triangular shed with a height of 1.9m under the forest. Add another layer of waterproof film; spread a layer of 8cm water-holding substrate on the bottom of the shed, compact it, and spread a layer of insect-proof net; 3cm; the insect-proof net is a polyethylene net with a density of 100 mesh; the thickness of the waterproof film is 0.08mm; the straw is exposed to sunlight for 4 days before use; the preparation method of the water-holding matrix is: in parts by mass , mix 160 parts of corn stalks, 46 parts of wood chips, 16 parts of bamboo charcoal, 26 parts of bagasse, 56 parts of garlic stalks, 56 parts of artemisia stalks, and 90 parts of mushroom dregs, grind them into powder with a particle size of 2 cm, and spread the powder to a thickness It is 2cm, and it can ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of fungus cultivation and particularly relates to an underwood planting method of shiitake. The underwood planting method comprises the following steps: land selection, greenhouse construction, culture medium blending, culture medium inoculation, fruiting management and harvesting. By utilizing the characteristics that a pine-cypress forest has a pest expelling effect and underwood environmental microorganisms are relatively few, the shiitake is planted in an underwood manner, so that the disinfection step during the plantation of the shiitake can be reduced, and the cost can be lowered; a large number of carbon dioxide is produced during the growth of the shiitake, so that the underwood carbon concentration is increased, and the photosynthesisof pines and cypresses is promoted; and meanwhile, a water-retaining matrix is adopted, the nutritional ingredients of underwood soil are increased, the growth of the pines and the cypresses is promoted, and the high yield effects of the shiitake, pines and the cypresses are achieved.

Description

technical field [0001] The invention relates to the technical field of fungal cultivation, in particular to a method for planting shiitake mushrooms under forests. Background technique [0002] At present, we humans are gradually facing the severe challenges of resource depletion and environmental degradation. How to make full use of photothermal resources and space resources to realize energy and material recycling is an important research direction. [0003] my country has a large area of ​​pine and cypress planting. Pine and Berlin wood production has become one of the pillar industries of my country's rural economy. Pines and cypresses are light-loving tree species, which can grow normally only when there is enough light. After harvesting, the branches and leaves of pines and cypresses are pruned a lot. The traditional way to deal with the pruned branches and leaves is to directly burn them with low efficiency or pile them up for many years to rot and use them as fertil...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A01G18/20A01G18/50A01G18/60A01G18/69A01G18/70A01G13/10
Inventor 翟洪平夏光云李崇云
Owner 贵州好菇粮农业科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com