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Packaging technology of electronic components and modules

A technology of electronic components and packaging technology, applied in the direction of electrical components, semiconductor devices, color TV parts, etc., can solve problems such as difficult to control coupling agent, coupling agent deposition, etc. Good adhesion and easy operation

Inactive Publication Date: 2019-04-26
HUIZHOU KAIER PHOTOELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in this method, it is difficult to control the amount of coupling agent deposited on the surface of the object, and there is a risk of the coupling agent depositing on some places on the surface of the object

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Solar cells need to withstand long-term tests in the atmospheric environment, and all components of solar cells should have good water resistance, weather resistance, and corrosion resistance. In order to ensure the long-term stable performance of the solar cell backlight module, it is processed by the process of the present invention.

[0037] Step (1): Plasma treatment process containing organosilicon gas

[0038] Remove dust from the solar cell backlight module with an electrostatic air gun, put it on the hanger between the two plasma plates in the vacuum chamber, close the vacuum chamber, start vacuuming, and reduce the air pressure in the vacuum chamber from normal atmospheric pressure to At about 2Pa, rotate the hanger, open the valve of argon gas, and let in argon gas. When the air pressure rises to 5Pa, turn on the sputtering switch to adjust the current to make the vacuum chamber glow, and then quickly adjust the air pressure and current to make the air pressur...

Embodiment 2

[0046] Protect the PIN pin of the electronic transformer with a rubber jig (rubber sleeve) to coat the parylene film. The first step was carried out as in Example 1. When the first step is complete, let air into the vacuum chamber and open the vacuum chamber. After opening the vacuum chamber, take out the plasma electrode plate. The second step is then carried out as in Example 1. After completion, remove the rubber sheath to obtain an electronic transformer well-wrapped by the parylene film. This electronic transformer has good waterproof and corrosion resistance.

Embodiment 3

[0048] The exterior material of the car key includes metal part and polymer part. Protect the metal part of the car key with a rubber sleeve. Complete the first step as in Example 1. Let air in to open the vacuum chamber. When implementing the second step, the ultraviolet lamp can be turned on in the cracking area, or the ultraviolet lamp can be turned on in the vacuum chamber. The effect of turning on the ultraviolet light in the cracking area is to help the cracking of cycloaryl alkanes. The effect of turning on the UV lamp in the vacuum chamber is to increase the concentration of free radicals on the surface of the key polymer. After 15 minutes in the second step, turn off the UV lamp. In the thus obtained key coated with parylene, the parylene film has good adhesion to the polymer substrate and is not easy to fall off and delaminate.

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PUM

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Abstract

The invention discloses a packaging technology of electronic components and modules. The packaging technology comprises the following steps of 1, putting the clean electronic components or modules into a vacuum chamber, and conducting plasma treatment on the electronic components or modules under the condition of the absence of gas containing an organosilicon compound; 2, decomposing paracyclophane or halogen compounds thereof into bi-free-radical precursors through a thermal cracking or light cracking method, introducing the bi-free-radical precursors into the vacuum chamber, preparing poly-p-xylene thin film, and coating the surfaces of the electronic components or modules with the thin film. Steps applied to the packaging technology are simple, equipment is compact, the bonding enhancing effect is obvious, and the mass production stability is high; after treatment is finished, applying the poly-p-xylene thin film so that the electronic components and modules can be endowed with great leakproofness, water resistance, corrosion resistance and the like. By means of the packaging technology, the service life of the electronic components and modules is prolonged.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a preparation process for a surface protective coating of electronic components and modules, and in particular to the preparation of a parylene coating on the surface of electronic components and modules. Background technique [0002] Poly-p-xylene, trade name Parylene, is a general term for polymer films with a polyxylylene structure prepared by chemical vapor deposition. It has extremely good electrical insulation Resistance, heat resistance, weather resistance, gas and water vapor barrier properties and corrosion resistance, it is an extremely effective anti-moisture, anti-mold, anti-salt spray material and protective coating material for high-frequency components, mainly Parylene N (poly Xylene), Parylene C (poly-para-xylylene chloride), Parylene D (poly-dichloro-para-xylylene), Parylene F (poly-para-difluorotoluene), etc. It can be made into an extremely thin p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048H01F27/02H04N5/225E05B19/00
CPCH01L31/0481H01F27/022E05B19/00H04N23/50H04N23/55Y02E10/50
Inventor 黄双武韩辉升卢健陈丙青
Owner HUIZHOU KAIER PHOTOELECTRIC CO LTD
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