Processing method of surface roughness of superhard laser crystal
A surface roughness, laser crystal technology, applied in the field of laser crystal cold processing, can solve the problems of sub-surface defects, difficult to remove, difficult to process and manufacture, etc.
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Embodiment 1
[0018] A method for processing the surface roughness of a superhard laser crystal. The processing object of this embodiment is a Nd:YAG slab crystal with a specification of 128mm×6mm×6mm, and the surface roughness of 128mm×6mm is required to be less than 0.3nm. The method includes the following steps:
[0019] 1) Detect the particle size of four specifications of silicon carbide for grinding, record the maximum particle size of 180# / 240# / 320# / 500# silicon carbide, the maximum particle size of 180# silicon carbide is 100μm, and the maximum particle size of 240# silicon carbide is 70μm , 320# silicon carbide maximum particle size 50μm, 500# silicon carbide particle size 25μm;
[0020] 2) Use a single-axis machine to grind the crystal element, use 180# silicon carbide to remove 1mm, use 240# silicon carbide to remove 0.3mm, use 320# silicon carbide to remove 0.2mm, use 500# silicon carbide to remove 0.15mm , Ultrasonic cleaning, using a stylus profiler to detect the surface of th...
Embodiment 2
[0024] A method for processing the surface roughness of a superhard laser crystal. The processing object of this embodiment is a Nd:YAG slab crystal with a specification of 133mm×33mm×3mm, and the large surface roughness of 133mm×33mm is required to be less than 0.3nm. The method includes the following steps :
[0025] 1) Detect the particle size of four specifications of boron carbide for grinding, record the maximum particle size of 180# / 240# / 320# / 500# boron carbide, the maximum particle size of 180# boron carbide is 80μm, and the maximum particle size of 240# boron carbide is 63μm , 320# boron carbide maximum particle size 45μm, 500# boron carbide particle size 20μm;
[0026] 2) Use a single-axis machine to grind the crystal element, use 180# boron carbide to remove 2mm, use 240# boron carbide to remove 0.3mm, use 320# boron carbide to remove 0.2mm, use 500# boron carbide to remove 0.15mm , Ultrasonic cleaning, using a stylus profiler to detect the surface of the component...
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