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Nano composite solder with high retention rate and preparation method thereof

A nano-composite, retention rate technology, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of easy agglomeration of nano-enhanced phases, low actual retention rate, easy precipitation, etc., to achieve elongation, thermal conductivity and other properties. Effects of enhancing, stabilizing material structure, improving service performance and thermal/electromigration resistance

Active Publication Date: 2019-04-09
HOERSON ELECTRONICS TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a high-retention nanocomposite solder and its preparation method, aiming to use the self-assembly of nanoparticles to obtain a reinforced structure with a specific arrangement structure or performance, and solve the existing problems. The nano-reinforced phase in the composite solder is easy to agglomerate, easy to precipitate, and the actual retention rate is low, so as to further improve the performance and reliability of the composite solder alloy

Method used

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  • Nano composite solder with high retention rate and preparation method thereof

Examples

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Embodiment 1

[0049] Embodiment 1 A kind of high retention rate nanometer Cu / Ag particle reinforced composite Sn-Bi solder, its preparation method comprises:

[0050] (1) Select No. 3 Sn52Bi48 powder as the solder matrix, select nano-Ag particles with an average particle size of 50nm as the reinforcing phase, and use a pure Sn plate and drilling process to prepare a cavity with a wall thickness of 2mm;

[0051] (2) Use 4 wt.% formic acid alcohol solution to ultrasonically clean the solder matrix powder, nano-Ag particles and cavity respectively, the molar ratio of formic acid to solder matrix powder or nano-Ag particles is 1:1, and use absolute ethanol Ultrasonic cleaning 3 times to remove impurities on the surface of the solder matrix and cavity, as well as organic dispersants and oxides on the surface of nanoparticles, and dry at 50°C for 30 minutes under vacuum to obtain pure metal powder;

[0052] (3) Use a planetary mixer and a ball mill to mix the dried solder matrix and nanoparticles...

Embodiment 2

[0054] Embodiment 2 A kind of high retention rate nano-IMC reinforced composite solder joint, its preparation method comprises:

[0055] (1) Select a pure Sn sheet with a thickness of 40 μm as the solder matrix, and deposit Ag with a thickness of 0.25 μm on its surface by electroplating or electroless plating, in which the mass ratio of Ag is about 2%, and at the same time select a sheet with a thickness of 20 μm Al-Ni self-propagating film as a heat source for rapid local heat treatment;

[0056] (2) Sequentially use 2.5 wt.% HCl alcohol solution and absolute ethanol to ultrasonically clean the surface pads, self-propagating films and Sn sheets with Ag plating to be soldered, and dry them under vacuum at 50°C for 30 minutes. Obtain pure welding material.

[0057] (3) Based on the classic "sandwich" structure of pad-Sn sheet-self-spreading film-Sn sheet-pad, place the dried preform and self-spreading film in alignment between the device to be soldered and the pad and hot pre...

Embodiment 3

[0060] Embodiment 3 A kind of high retention rate nano-graphene reinforced bulk composite material, its preparation method comprises:

[0061] (1) Select bulk SAC305 metal ingot as the material matrix, select high-purity graphene sheet as the reinforcing phase, and use stainless steel splicing to prepare the cavity. The wall thickness of the cavity is 3mm, and the surface of the cavity is prefabricated with threaded holes;

[0062](2) SAC305 metal ingots were cut, polished, pickled with 3% HCl alcohol, and cleaned with absolute ethanol in sequence, so that the size of the obtained material matrix was consistent with the cavity, and at the same time, the inner surface of the stainless steel cavity was plated with Sn by chemical method, with a thickness of 1μm, and Ni-plated on the surface of the high-purity graphene sheet to improve the wetting and bonding force between the graphene sheet and the SAC305 substrate. After the above materials were prepared, they were ultrasonicall...

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Abstract

The invention discloses a nano composite solder with high retention rate and a preparation method thereof. The preparation method comprises the steps of providing a solder matrix, a nano-reinforcing phase and a cavity; cleaning the solder matrix, the nano-reinforcing phase and the cavity, and then performing surface treatment; mixing the obtained solder matrix with the nano-reinforcing phase to obtain a mixture, and placing the obtained mixture into the cavity to make the mixture into the a bulk material or a preformed sheet; and closing the cavity containing the bulk material or the preformedsheet, and melting and solidifying the bulk material or the preformed sheet under the external high-energy auxiliary action to obtain the nano composite solder with high retention rate. The compositesolder has a uniform and stable material structure, and has greatly improved strength, elongation, thermal conductivity and electrical conductivity, moreover can control a treatment process to promote the oriented alignment of the nano-reinforced phase to achieve targeted anisotropic strengthening of the composite solder, and has high material utilization rate and simple process, and the increaserange can reach 40-100% compared with the solder matrix.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a nanocomposite solder with high retention rate and a preparation method thereof. Background technique [0002] In the electronic information system, the solder joints that provide electrical connection, mechanical support and heat conduction channels between the units of electronic components are an indispensable key part, and their quality and integrity have an extremely important impact on the overall performance of electronic products. important influence. However, with the continuous improvement of people's requirements for the performance, size and function of electronic products, the integration of electronic products is getting higher and higher, the number of I / Os has increased significantly, and the size of solder joints has decreased rapidly, making the solder joints The current density and temperature gradient increase sharply. Under such extreme service...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 王晓婷祝温泊朱宇阳顾佳慧胡博汪敏李明雨马鑫
Owner HOERSON ELECTRONICS TECH
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