Tin-based alloy and copper strip composite material and preparation method thereof

Abstract

The invention relates to a tin-based alloy and copper strip composite material and a preparation method thereof, and belongs to the field of non-ferrous metal high-frequency brazing machining. The tin-based alloy and copper strip composite material is composed of a core material and a coating wrapping the surface of the core material; the core material is a copper strip, the coating is a tin-basedalloy, and the thickness of the single-side coating ranges from 20 [mu]m to 100 [mu]m. According to the preparation method, a high-frequency brazing principle is adopted, and a compact tin-based alloy material plating layer is formed on the surface of a copper strip; the method comprises the steps of copper base strip material surface soldering flux presetting, copper strip and brazing filler metal compounding, high-frequency induction rapid brazing, air cooling solidification, strip material axis-winding packaging and the like, and the method is simple in process and suitable for batch production. The tin-based alloy and copper strip composite material prepared through the method has the advantages of being free of solder skip and tin nodule defects, good in conductivity, high in weldability, good in corrosion resistance, good in oxidation resistance, firm in coating and the like, is mainly applied to the electronic industrial fields of electronic components, hybrid integrated circuits, solar photovoltaic modules and the like, and has wide market prospects.

Description

technical field [0001] The invention relates to a tin-based alloy and copper strip composite material and a preparation method thereof, in particular to a tin-based alloy flat copper wire and a preparation method thereof, which are mainly used in electronic components, hybrid integrated circuits, solar photovoltaic modules and other electronic components. In the field of industry, it belongs to the field of high-frequency brazing processing of non-ferrous metals. Background technique [0002] With the continuous development of mechanical and electronic equipment in the direction of miniaturization and miniaturization, copper leads with excellent performance and current carrying capacity, fast transmission speed, good heat dissipation, and low cost are gradually being widely used. Compared with pure tin-plated copper wires, tin-based alloy copper strip composite materials have greater current carrying capacity, higher reliability, better oxidation resistance and corrosion res...

AI Technical Summary

Problems solved by technology

[0003] The tin-copper strip composite material is prepared by single tin plating on the copper strip. It is easy to form copper-tin alloy during processing, and the uniformity is difficult to control. It is difficult to guarantee the thickness and solderability of the coating. Tin whisker defects are prone to occur during long-term service, and cannot meet high requirements. Requirements for the use of reliable hybrid integrated circuits or electronic components

[0004] At present, the three commonly used methods for preparing tin-copper strip composite materials are electroless plating, electroplating and hot-dip plating. It is difficult to control the alloy composition of the copper strip surface coating, and it is difficult to ensure the uniformity and consistency of the coating thickness, especially hot-dip plating. The discoloration of the copper strip will cause defects such as copper leakage, tin nodules, and tin slag, which will reduce the solderability of the solder and affect the characteristics of the copper wire itself. At the same time, the three methods have certain environmental pollution.

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