Preparation method of halogen-free high Tg and low dielectric constant copper-clad board
A copper-clad laminate and low-dielectric technology, which is applied in the field of preparation of halogen-free high-Tg low-dielectric copper-clad laminates, can solve the problems of affecting dielectric properties and high cost of inorganic phosphorus-containing flame retardants, and achieve low Water absorption, excellent halogen-free flame retardancy, effects of improving dielectric properties and reliability
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[0038] A preparation method of a halogen-free high Tg low dielectric copper clad board, the modified epoxy resin and functional additives are formulated to form an adhesive and coated on the glass fiber cloth, and then covered with copper foil and subjected to hot pressing A halogen-free high Tg low dielectric copper clad laminate was prepared.
[0039] The adhesive can be prepared by using the following components and raw materials in parts by weight: phosphazene flame retardant 2-80, isocyanate modified epoxy resin 5-80, modified polymeric anhydride 20-70, active ester curing agent 5 -50, biphenyl phenol type modified epoxy resin 5-80, metal type catalyst 0.005-1.0, imidazole catalyst 0.005-1.0, inorganic filler 10-60, silane 0.1-5.0, toughening agent 1-10, organic solvent 10-60.
[0040]Among the raw materials used above, the phosphazene flame retardant is 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphinephenanthrene-10-oxide, 10-(2,5 -Dihydroxynaphthyl)-10-hydro-9-...
Embodiment 1
[0056] 1. Prepare materials according to the formula composition
[0057] material name
Example 1
Phosphazene flame retardant (%)
16.7
Isocyanate Modified Epoxy
12.6
Modified polymeric anhydride
24.6
Active ester curing agent
10.5
Biphenyl phenol type modified epoxy
18.5
metal catalyst
0.005
2-Ethyl-4 methylimidazole
0.01
Spherical silica (%)
21.8
Silane (%)
0.11
Organic solvents(%)
20.6
Toughener (%)
3.58
[0058] Glue adjustment
[0059] 2.1 Add organic solvent, biphenyl phenol type modified epoxy resin, phosphazene flame retardant sequentially into the stirring tank according to the formula quantity, rotate at 1200 rpm, keep the tank at 30-50°C, and stir for 60 minutes;
[0060] 2.2 Add isocyanate-modified epoxy resin, modified polymeric anhydride, and active ester curing agent in sequence in the tank at a speed of 1300 rpm, and continue stirring f...
Embodiment 2
[0078] 1. Prepare materials according to the formula composition
[0079]
[0080]
[0081] Glue adjustment
[0082] 2.1 Add organic solvent, biphenyl phenol-type modified epoxy resin, and phosphazene flame retardant sequentially into the stirring tank according to the formula amount, rotate at 1100 rpm, keep the tank at 30-50°C, and stir for 110 minutes;
[0083] 2.2 Add isocyanate-modified epoxy resin, modified polymeric anhydride, and active ester curing agent in sequence in the tank at a speed of 1100 rpm, and continue stirring for 80 minutes after the addition is complete;
[0084] 2.3 Add silane, spherical silica, and toughening agent in sequence according to the formula amount in the tank and stir for 130 minutes at a speed of 1200 rpm;
[0085] 2.4 Add the metal-type catalyst and 3-ethyl-4 methylimidazole in sequence according to the formula amount in the tank, and stir at a speed of 1500 rpm for 160 minutes to prepare the adhesive.
[0086] 2. Glue and bake
...
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