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Normal-temperature nickel-free hole sealing agent

A technology of nickel sealing and normal temperature, which is applied in the direction of electrolytic coating, surface reaction electrolytic coating, coating, etc. It can solve the problems of large polymer resin molecular volume, inability to diffuse sealing performance, human body and environmental toxicity, etc., and achieve the elimination of bad Impact, energy saving, waste water non-toxic and harmless effect

Active Publication Date: 2019-02-15
广州旭奇材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The principle of boiling water or high-temperature steam sealing technology is simple. The sealing process of the membrane is the hydration process of alumina. The operating temperature is the main controlling factor of the sealing speed. The water quality will also significantly affect the appearance and sealing speed of the sealing membrane. Excessive calcium Magnesium ions will cause spots and sealing gray on the porous film; the commonly used nickel salt sealant contains Ni2+, F-has a toxic effect on the human body and the environment, and its dissolution rate is strictly limited by EU 94 / 27 / EEC nickel directive and other regulations; The molecular volume of the polymer resin is too large to diffuse into the pores to achieve good sealing performance

Method used

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Examples

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preparation example Construction

[0032] Another aspect of the present invention also provides a preparation method of the normal temperature nickel-free sealing agent, comprising the following steps:

[0033] (1) Mix the lithium salt and the sealing accelerator, add deionized water and stir evenly to obtain a solution;

[0034] (2) Add component D to the above solution, and stir for 1-1.5h under the condition of 250-300r / min to obtain a mixed solution;

[0035] (3) Add the pH buffering agent to the above mixed solution, stir and react at 30-35° C. for 2.5-3 hours to obtain a nickel-free sealing agent at room temperature.

[0036] The third aspect of the present invention also provides a method for using the normal temperature nickel-free sealing agent, comprising the following steps:

[0037] (1) Immerse the anodized aluminum alloy substrate in nickel-free sealing agent, the usage ratio is 20-40g / L, and the sealing speed is 1-1.5μm / min;

[0038] (2) Wash the residual sealing agent on the surface of the alum...

Embodiment 1

[0052] Example 1 provides a nickel-free sealing agent at room temperature. Calculated by mass percentage, the nickel-free sealing agent at room temperature includes the following components: 30% of lithium salt, 10% of pH buffer agent, 0.6% of sealing accelerator, Deionized water balance.

[0053] The normal temperature nickel-free sealing agent also includes 3% component D.

[0054] Wherein, the lithium salt is a composition of lithium acetate and lithium sulfate, the corresponding weight ratio is 1:1.35; the pH buffer is ammonium acetate; the sealing accelerator is dioctyl sodium sulfosuccinate The composition of salt and trimethylglycine, the corresponding weight ratio is 1:1; the component D is the composition of polyethylene glycol 600 and acrylic resin, the corresponding weight ratio is 1.1:1.8; The acrylic resin was purchased from Mitsubishi, Japan, and the model was BR113.

[0055] On the other hand, this embodiment also provides a preparation method of the normal te...

Embodiment 2

[0063] Example 2 provides a nickel-free sealing agent at room temperature. Calculated by mass percentage, the nickel-free sealing agent at room temperature includes the following components: 20% of lithium salt, 6% of pH buffer agent, 0.2% of sealing accelerator, Deionized water balance.

[0064] The normal temperature nickel-free sealing agent also includes 2% component D.

[0065] Wherein, the lithium salt is a composition of lithium acetate and lithium sulfate, the corresponding weight ratio is 1:1.35; the pH buffer is ammonium acetate; the sealing accelerator is dioctyl sodium sulfosuccinate The composition of salt and trimethylglycine, the corresponding weight ratio is 1:1; the component D is the composition of polyethylene glycol 600 and acrylic resin, the corresponding weight ratio is 1.1:1.8; The acrylic resin was purchased from Mitsubishi, Japan, and the model was BR113.

[0066] On the other hand, this embodiment also provides the preparation method of the nickel-f...

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Abstract

The invention discloses a normal-temperature nickel-free hole sealing agent. The normal-temperature nickel-free hole sealing agent comprises the following components: 20-40% of lithium salt, 6-15% ofa pH buffering agent, 0.2-1% of a hole sealing accelerant and the balance of deionized water. Hole sealing operation can be carried out at normal temperature, energy is saved, moreover, the hole sealing speed is high, the efficiency is also high, the closing effect is good, and white frost is not generated; and after hole sealing, a material has a smooth surface, is ash-free and is high in corrosion resistance. On the premise of ensuring that various properties can meet national standards, hole sealing ash cannot be generated, and therefore, adverse effects of hole sealing ash to final use ofthe product are eliminated. The normal-temperature nickel-free hole sealing agent does not contain heavy metallic salt such as nickel and cobalt, is safe and environmentally friendly, and completely conforms to the European Union rohs standard, treating liquid does not contain toxic substances such as nickel, cobalt or other heavy metals, wastewater is toxic-free and harmless, and thus, the normal-temperature nickel-free hole sealing agent can be widely used in the fields of buildings, furniture, 3C home appliances and the like.

Description

technical field [0001] The invention relates to the technical field of chemical surface treatment of metal materials, in particular to a nickel-free sealing agent at room temperature for sealing holes on an aluminum alloy oxide film layer. Background technique [0002] Light metal materials, such as aluminum, magnesium, zinc, titanium, aluminum alloys, magnesium alloys, zinc alloys, and titanium alloys, have the advantages of low density, strong electrical and thermal conductivity, excellent mechanical properties, and secondary processing, so they are widely used in the national economy. Has been widely used. However, light metal materials are generally easy to be corroded. Therefore, in order to make better use of light metal materials, it is usually necessary to carry out surface treatment on light metal materials to avoid corrosion of light metal materials. At present, anodic oxidation of light metal materials is commonly used. [0003] At present, aluminum and its alloy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D11/24
CPCC25D11/246
Inventor 黄健超王庭剑蔡基峰
Owner 广州旭奇材料科技有限公司
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