Tantalum oxide-protected p-type silicon photolysis water hydrogen production electrode and preparation method thereof
A technology of tantalum oxide and tantalum pentoxide, which is applied to electrodes, electrolytic components, electrolytic processes, etc., can solve the problems of heavy doping, insufficient photo-generated voltage of single-crystal silicon photocathode, instability, etc., and achieves good repeatability and improved Photolysis of water for hydrogen production activity and the effect of enhancing stability
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Embodiment 1
[0056] (1) The surface of the silicon wafer is heavily doped
[0057] a) After the silicon wafer is processed by RCA cleaning technology, it is blown dry with nitrogen gas for later use;
[0058] b) Preparation of silica latex: Take 15mL tetraethyl orthosilicate and mix with 33mL ethanol, heat to 60°C, and slowly add 2mL of 0.064% hydrochloric acid while stirring. The solution is heated to 70°C, stirred continuously, and kept warm for 2 hours to obtain the dopant solvent latex. After the preparation is completed, put it in the refrigerator at 0-5°C, and seal it for later use;
[0059] c) Phosphorus-containing dopant preparation: Take 0.0934g of phosphorus pentoxide, dissolve it in 2.5mL of silica latex, mix it evenly by ultrasonic, the dopant concentration is 0.0374mg / L, seal it for later use;
[0060] d) Spin-coating doping: Take 400 μL of phosphorus-containing dopant, set the spin-coater speed at about 3500 rpm, and spin-coating time for 30s. After the color of the film on ...
Embodiment 2
[0068] (1) The surface of the silicon wafer is heavily doped
[0069] a) After the silicon wafer is processed by RCA cleaning technology, it is blown dry with nitrogen for standby;
[0070] b) The preparation of silica latex is the same as in Example 1.
[0071] c) Phosphorus-containing dopant preparation: take 0.0934g of phosphorus pentoxide, dissolve in 5mL of silica latex, mix evenly by ultrasonic, the dopant concentration is 0.0187mg / L, and seal it for later use;
[0072] d) Spin-coating doping is the same as that in Example 1.
[0073] e) High-temperature roasting is the same as in Example 1.
[0074] (2) The preparation of the protective layer is the same as in Example 1.
[0075] (3) The deposition of platinum auxiliary agent is the same as that in Example 1.
Embodiment 3
[0077] (1) The surface of the silicon wafer is heavily doped
[0078] a) After the silicon wafer is processed by RCA cleaning technology, it is blown dry with nitrogen for standby;
[0079] b) The preparation of silica latex is the same as in Example 1.
[0080] c) Phosphorus-containing dopant preparation: take 0.1868g of phosphorus pentoxide, dissolve it in 2.5mL of silicon oxide latex, mix it uniformly by ultrasonic, the dopant concentration is 0.0747mg / L, and seal it for later use;
[0081] d) Spin-coating doping is the same as that in Example 1.
[0082] e) High-temperature roasting is the same as in Example 1.
[0083] (2) The preparation of the protective layer is the same as in Example 1.
[0084] (3) The deposition of platinum auxiliary agent is the same as that in Example 1.
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