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Photo-cured epoxy-modified organic silicon coating composition and preparation method thereof

A technology of silicone coating and epoxy modification, applied in the direction of coating, can solve the problems of reducing the overall heat resistance of silicone materials, poor brittleness and toughness, and sticky material surface, so as to facilitate construction and customer use. , The effect of strong anti-vibration ability and excellent surface dry performance

Inactive Publication Date: 2019-01-18
江苏科琪高分子材料研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Conventional acrylic and epoxy system coatings are difficult to adhere to the surface of silicone pressure-sensitive adhesives, and the systems are incompatible
The surface of general silicone free radical photocurable materials is severely inhibited by oxygen, and the surface of the cured material is severely sticky; while the cationic epoxy modified system is often brittle and poor in toughness, unable to withstand impact, resulting in high wear resistance and adhesion drop in magnitude
[0005] The patent with the publication number CN103275496A: An Epoxy Resin Modified Silicone Light Curing Material and Its Preparation Method discloses that epoxy resin modified vinyl polysiloxane is prepared by the following method: (1) optional Specifically, add aminosilane coupling agent or / and polyamide to vinyl polysiloxane to carry out ammoniation treatment; (2) add catalyst, after stirring evenly, slowly drop the solution reaction of bisphenol A type epoxy resin, Epoxy resin modified vinyl polysiloxane is obtained; preferably, the vinyl polysiloxane is prepared by the following method: octamethylcyclotetrasiloxane, tetramethyltetravinylcyclotetra According to the molar ratio of 3-550:1-90:1, siloxane and water are polymerized at 70-150°C for 0.5-12 hours under the action of catalyst tetramethylammonium hydroxide or tetramethylammonium hydroxide silicon alkoxide, After the polymerization is completed, the catalyst is removed to obtain vinyl polysiloxane. The molecular structure of vinyl polysiloxane is HOMeR1SiO(Me2SiO)a(MeViSiO)bSiR1MeOH, where a is an integer from 12 to 1920, and b is an integer from 1 to 310. Integer, R1 is -CH3 or -CH=CH2; The product that this synthetic method obtains has following defects: 1, molecular structure has introduced -NH-structure in the reaction process, easily produces yellowing and reduces the overall heat resistance of organosilicon material 2. The catalyst used in the synthesis is selected from organotin / and titanate, which is not conducive to environmental protection; 3. The molecular structure design of the catalyst leads to a high viscosity of the prepolymer, so the formula is a solvent-based product containing a large amount of toluene , high energy consumption and great environmental pollution

Method used

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  • Photo-cured epoxy-modified organic silicon coating composition and preparation method thereof
  • Photo-cured epoxy-modified organic silicon coating composition and preparation method thereof
  • Photo-cured epoxy-modified organic silicon coating composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Prepare adhesive composition according to following formula:

[0052] 92.0 parts of hydrogen-containing D4 added to Jiangsu Kexing V-200, and then VCHO (1,2-epoxy-4-vinylcyclohexane) terminated silicone prepolymer;

[0053] 2.0 parts of Aerosil R 106 from Degussa;

[0054] 5.0 parts of Syna Epoxy S-221, 3,3'-[oxybismethylene]bis[3-ethyl]oxetane from Xinaxi Company;

[0055] 0.5 parts of cationic photoinitiator UVI 6992 of Xinaxi Company;

[0056] 0.5 part of CAT 7605E from Japan ShinEtsu Co., bis(4-straight-chain alkyl(C10-C13)phenyl) onium iodide hexafluoroantimonate.

[0057] All parts are parts by weight, based on 100 parts by weight of the adhesive composition.

[0058] Specific preparation method:

[0059] The above-mentioned components (total 100g) are successively added into a plastic bucket with a capacity of 150g, and put into the SpeedMixer produced by FlackTech Inc. TM In the mixer, at 2000-2500 rpm, disperse and mix at high speed for 5 minutes.

Embodiment 2

[0061] Prepare adhesive composition according to following formula:

[0062] 92.0 parts of hydrogen-containing D4 added to Jiangsu Kexing V-1000, and then VCHO (1,2-epoxy-4-vinylcyclohexane)-terminated silicone prepolymer;

[0063] 2.0 parts of Aerosil R 106 from Degussa;

[0064] 5.0 parts of Syna Epoxy S-221, 3,3'-[oxybismethylene]bis[3-ethyl]oxetane from Xinaxi Company;

[0065] 0.5 parts of cationic photoinitiator UVI 6992 of Xinaxi Company;

[0066] 0.5 part of CAT 7605E from Japan ShinEtsu Co., bis(4-straight-chain alkyl(C10-C13)phenyl) onium iodide hexafluoroantimonate.

[0067] All parts are parts by weight, based on 100 parts by weight of the adhesive composition.

[0068] Specific preparation method:

[0069] The above-mentioned components (total 100g) are successively added into a plastic bucket with a capacity of 150g, and put into the SpeedMixer produced by FlackTech Inc. TM In the mixer, at 2000-2500 rpm, disperse and mix at high speed for 5 minutes.

Embodiment 3

[0071] Prepare the adhesive composition according to the following formula, and the preparation process is the same as in Example 1:

[0072] 82.5 parts of hydrogen-containing D4 added to Jiangsu Kexing V-1000, and then VCHO (1,2-epoxy-4-vinylcyclohexane) terminated silicone prepolymer;

[0073] 2.5 parts of Aerosil R 200 from Degussa;

[0074] 5.0 parts of Syna Epoxy S-221, 3,3'-[oxybismethylene]bis[3-ethyl]oxetane from Xinaxi Company;

[0075] 1.0 parts of cationic photoinitiator UVI 6976 of Xinaxi Company;

[0076] 1.0 parts of CAT 7605E, bis(4-straight-chain alkyl(C10-C13)phenyl)hexafluoroantimonate ammonium iodine, from Japan ShinEtsu Company.

[0077] All parts are parts by weight, based on 100 parts by weight of the adhesive composition.

[0078] Specific preparation method:

[0079] The above-mentioned components (total 100g) are successively added into a plastic bucket with a capacity of 150g, and put into the SpeedMixer produced by FlackTech Inc. TM In the mixe...

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Abstract

The invention relates to a photo-cured epoxy-modified organic silicon coating composition and a preparation method thereof. The photo-cured epoxy-modified organic silicon coating composition based on100 weight parts mainly comprises a component A of 30-98 parts of one or more than one epoxy-modified organic silicon oligomer, a component B of 0.5-40 parts of one or more than one epoxy active diluent, a component C of 0.5-10 parts of one or more than one photo-curing initiator and a component D of 0.5-10.0 parts of fumed silica to adjust the viscosity and thixotropy of the composition. The photo-cured epoxy-modified organic silicon coating composition provided by the invention is especially suitable for organic silicon material surface coatings in the electronic industry and is compatible to an organic silicon pressure-sensitive adhesive material; and meanwhile, a formula designing main body is of an organic silicon structure; and the coating possesses excellent heat resisting property.

Description

technical field [0001] The invention relates to the technical field of photocurable silicone, in particular to a photocurable epoxy-modified silicone coating composition and a preparation method thereof. Background technique [0002] Light-curing silicone materials have both the excellent properties of silicone materials and the high-efficiency and energy-saving features of light-curing technology, so they have gradually been widely used. Silicone materials are semi-inorganic and semi-organic polymer compounds with silicon-oxygen bonds as the main chain and side chains composed of silicon and organic groups. The special structure endows it with many excellent properties, such as high and low temperature resistance, weather resistance, aging resistance, corrosion resistance, low surface tension and physiological inertness, etc., so that it is widely used in aerospace, electronic and electrical, chemical and other fields. [0003] The combination of organic silicon materials ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/06C09D4/02C09D4/06C09D7/65C09D7/61C08G77/38
CPCC08G77/38C09D4/06C09D7/61C09D7/63C09D183/06C08K3/36C08K5/1515
Inventor 王洪宇姚磊薛丹丹蘧建星
Owner 江苏科琪高分子材料研究院有限公司
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