UV photosensitive adhesive, UV protective film applying UV photosensitive adhesive for wafer and preparation method of UV protective film for wafer

Abstract

The invention discloses a UV photosensitive adhesive, the UV photosensitive adhesive comprises the following components by mass percent: 10%-15% of star SIS, 10%-15% of poly-terpene A, 1%-5% of poly-terpene B, 0.5 per mill-0.8 per mill of a light stabilizer, 1 per mill-4 per mill of an ageing agent, 3 per mill-20 per mill of hollow microspheres, and 60 per mill-75 per mill of a solvent. The UV photosensitive adhesive rapidly reaches the higher bonding strength at the room temperature, is excellent in adherence to substrates like PO (Propylene Oxide) and PVC (Polyvinyl Chloride), can resist the high temperature of 100 DEG C within a short period of time, and is soft, the initial viscosity is quite excellent, and the ageing-resistant performance is excellent. A UV protective film applyingthe UV photosensitive adhesive for a wafer not only has an obvious visbreaking effect after the UV-irradiation, but also can tackify a rubber pressure sensitive adhesive before the pressure sensitiveadhesive.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and relates to a UV photosensitive adhesive, a UV protective film for wafers using the adhesive and a preparation method thereof. Background technique [0002] With the rapid development of electronic products, the requirements for electronic materials, especially electronic integrated circuits, are getting higher and higher. The main raw materials of integrated circuits depend on silicon wafers and their processing technology. Wafer thinning has become a key technology in the semiconductor industry in recent years, helping to develop technologies such as smart cards and video identification (RFID) devices, and has become a key technology in the latest mobile phones, personal digital assistants (PDAs), and ) and other small, lightweight, and powerful electronic devices is an important method of stacked chip packaging that is becoming more and more popular. From a material point of view, silic...

AI Technical Summary

Problems solved by technology

The adhesion of Japanese UV protective film can reach 2000gf / inch before UV irradiation, and it will drop below 30gf / inch after UV irradiation, and the surface of the wafer will not be polluted after peeling off the UV protective film, but the silicon wafer needs to be heated for 60 -80℃, so that the bonding is more firm, which causes the inconvenience of the process

[0005] At present, many manufacturers in the domestic market have begun to launch technical impacts on high-end UV protective films (wafer field), but limited to UV adhesive technology, the performance of UV protective films produced is often unstable, and most UV adhesives are purchased from South Korea and Japan do not have their own core technologies; the domestic high-end UV protective film market is mainly monopolized by Japan and South Korea, such as Lintec, Lion Lion, etc. These UV protective films used for wafer processing, their core adhesive systems are mainly It is composed of acrylic pressure-sensitive adhesive and various oligomers, monomers and photoinitiators. It can reduce the viscosity well after being irradiated by ultraviolet light, but the adhesion before ultraviolet light is about 2000gf / inch, which is not enough It is fully guaranteed to stick the wafer firmly during the process of wafer cutting and grinding, which makes it necessary to heat the wafer with UV protective film to 60-80°C before wafer processing to ensure that the UV protective film is completely bonded Fixes the wafer, which causes inconvenience to the wafer processing process

Images