High-flame-retardant high-thermal-conductive PVC (polyvinyl chloride) compound cable material and preparation method thereof
A composite cable material, high thermal conductivity technology, used in circuits, electrical components, plastic/resin/wax insulators, etc., can solve the problems of high temperature resistance, poor melt leveling performance, organic solvent insulation, etc., to improve Processing fluidity, good dielectric properties, and the effect of improving compatibility
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Embodiment 1
[0034] 100 parts of polyvinyl chloride, 36 parts of PTFE micropowder, 49 parts of perfluoroalkoxy copolymer, 15 parts of ethylene-chlorotrifluoroethylene copolymer, 30 parts of composite compatibilizer, 20 parts of nano zinc oxide, thermal conductive filler 42 parts, 10 parts of para-aramid fiber and 15 parts of modified magnesium hydroxide,
[0035] The mass ratio of cyclohexyl methacrylate, p-methylstyrene and vinyl butyrate in the composite compatibilizer is 0.8:1.2:2;
[0036] The thermally conductive filler is prepared from raw materials with the following weight components:
[0037] 25 parts of micron aluminum nitride powder, 15 parts of 20 micron aluminum oxide powder, 15 parts of aluminum oxide powder, 2 parts of nano silicon nitride whiskers,
[0038] In the micron aluminum nitride powder, the weight ratio of the 2 micron aluminum nitride powder and the 5 micron aluminum nitride powder is 1:1, and the average particle size of the nano silicon nitride whiskers is 600 nm.
[003...
Embodiment 2
[0046] 100 parts of polyvinyl chloride, 31 parts of PTFE micropowder, 44 parts of perfluoroalkoxy copolymer, 25 parts of ethylene-chlorotrifluoroethylene copolymer, 35 parts of composite compatibilizer, 30 parts of nano zinc oxide, thermal conductive filler 53 parts, 15 parts of para-aramid fiber and 10 parts of modified magnesium hydroxide,
[0047] The mass ratio of cyclohexyl methacrylate, p-methylstyrene and vinyl butyrate in the composite compatibilizer is 2.6:3.5:2.5;
[0048] The thermally conductive filler is prepared from raw materials with the following weight components:
[0049] 30 parts of micron aluminum nitride powder, 20 parts of 20 micron alumina powder, 20 parts of alumina powder, 3 parts of nano silicon nitride whiskers,
[0050] In the micron aluminum nitride powder, the weight ratio of the 2 micron aluminum nitride powder to the 5 micron aluminum nitride powder is 3:1, and the average particle size of the nano silicon nitride whiskers is 600 nm.
[0051] In the for...
Embodiment 3
[0058] 100 parts of polyvinyl chloride, 33 parts of polytetrafluoroethylene powder, 45 parts of perfluoroalkoxy copolymer, 22 parts of ethylene-chlorotrifluoroethylene copolymer, 32 parts of composite compatibilizer, 25 parts of nano zinc oxide, thermal conductive filler 47 parts, 12 parts of para-aramid fiber and 13 parts of modified magnesium hydroxide,
[0059] The mass ratio of cyclohexyl methacrylate, p-methylstyrene and vinyl butyrate in the composite compatibilizer is 1.5:2.6:2.1;
[0060] The thermally conductive filler is prepared from raw materials with the following weight components:
[0061] 28 parts of micron aluminum nitride powder, 17 parts of 20 micron alumina powder, 17 parts of alumina powder, 2 parts of nano silicon nitride whiskers,
[0062] In the micron aluminum nitride powder, the weight ratio of the 2 micron aluminum nitride powder and the 5 micron aluminum nitride powder is 2:1, and the average particle size of the nano silicon nitride whiskers is 600 nm.
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