Semiconductor structure and method of forming same
A semiconductor and gas technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, transistors, etc., can solve problems such as large contact resistance, reduced operating speed of semiconductor devices, and greater impact on the performance of MOS transistors, etc., to reduce contact resistance, contact The effect of increasing the area
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[0034] As mentioned in the background, the contact resistance between the source, the drain and the conductive plug is relatively large.
[0035] figure 1 It is a structural schematic diagram of each step of a method for forming a semiconductor structure.
[0036] Please refer to figure 1, providing the substrate 100, the substrate 100 includes an NMOS region and a PMOS region, the NMOS region substrate 100 has a first gate structure 101, the PMOS substrate 100 has a second gate structure 102, and the first The substrate 100 on both sides of a gate structure 101 has a first source-drain doped region 103, and the substrate 100 on both sides of the second gate structure 102 has a second source-drain doped region 104. The substrate 100, A dielectric layer 105 is formed on the first gate structure 101 , the second gate structure 102 , the first source-drain doped region 103 and the second source-drain doped region 104 .
[0037] Please continue to refer figure 1 , forming a fi...
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