Aluminum nitride ceramic pipe shell and fabrication method thereof

Abstract

The invention discloses an aluminum nitride ceramic pipe shell and a fabrication method thereof. An aluminum nitride ceramic substrate is employed, heat generated by a device is timely transferred toan external environment by the pipe shell, meanwhile, a metal thin film layer covers a surface of the aluminum nitride ceramic substrate, and high-frequency signal transmission is achieved. Since thinfilm metal wiring is high in accuracy, vertical interconnection can be achieved, and the high-frequency and high-density signal transmission requirement also can be achieved; and meanwhile, the defect of relatively large square resistance of a metal material to cause large signal transmission loss and signal delay under a high frequency is overcome by aluminum nitride multi-layer ceramic combinedwith a thin film process.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to an aluminum nitride ceramic shell and a manufacturing method thereof. Background technique [0002] When the spacecraft re-enters the atmosphere, it will enter the atmosphere at an ultra-high speed of ten to hundreds of times the speed of sound, causing the front end of the spacecraft to form a strong shock wave. Due to the compression of the shock wave at the front end of the spacecraft and the viscosity of the atmosphere, a large amount of kinetic energy of the spacecraft is converted into heat energy, and this heat energy will ionize the gas at the front end of the spacecraft to form a plasma region. In order to improve the ability of communication and guidance of high-frequency signals when the spacecraft penetrates the plasma, its transceiver components are required to have a very high frequency, and some have reached the frequency of millimeter waves. [0003] The breakdo...

AI Technical Summary

Problems solved by technology

Due to the high sintering temperature of the HTCC substrate, the conductor materials used for internal wiring and through-hole filling are metal materials such as tungsten, molybdenum, and manganese with high melting points. These materials have large square resistance, which will cause large signal transmission loss at high frequencies. , signal delay and other defects, so it is generally not suitable for high-frequency components

Among the three co-fired ceramics, aluminum nitride HTCC substrate has the highest thermal conductivity, which can meet the requirements of high heat dissipation and high integration of millimeter wave transceiver components, but the square resistance of tungsten conductor paste used in aluminum nitride multilayer ceramics 10-15mΩ / □, for millimeter wave band signals in the process of transmission, the loss is relatively large

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