Preparation method of aluminum-silicon composite material for electronic packaging

Abstract

The invention discloses a preparation method of an aluminum-silicon composite material for electronic packaging. The preparation method is characterized by comprising the following steps of S1, preparing pure aluminum and pure silicon, and smelting aluminum-silicon alloy to obtain an aluminum-silicon alloy melt; S2, performing gas atomization powder preparation on the aluminum-silicon alloy melt,and sieving powder to obtain aluminum-silicon alloy powder; S3, performing cold briquetting on the aluminum-silicon alloy powder to obtain an aluminum-silicon alloy green compact; S4, performing semi-solid forming on the aluminum-silicon alloy green compact after cold pressing to obtain an aluminum-silicon composite material; and S5, performing annealing treatment on the aluminum-silicon compositematerial. The aluminum-silicon composite material for electronic packaging prepared by the method is fine in silicon phase size, is passivated in silicon phase corner angle, is uniformly distributedin an aluminum matrix and has good microstructure characteristics and comprehensive properties.

Description

technical field [0001] The invention relates to the field of molding and processing of electronic packaging materials, in particular to a preparation method of an aluminum-silicon composite material for electronic packaging. Background technique [0002] Traditional electronic packaging materials mainly include Cu, Al, Ti, Kovar (or Invar), W / Cu (or Mo / Cu), Al 2 o 3 etc., and its main properties are shown in Table 1. With the development of modern electronic devices in the direction of miniaturization, light weight, high operating frequency, high power density, multi-function and high reliability, traditional packaging materials are no longer competent in terms of thermal conductivity, thermal expansion coefficient matching and light weight. [0003] Table 1 Main properties of commonly used electronic packaging materials [0004] [0005] In order to meet the material performance requirements of modern highly integrated electronic devices, Western developed countries h...

AI Technical Summary

Problems solved by technology

[0007] However, the aluminum-silicon composite materials in the prior art are generally prepared by semi-solid molding of ingots obtained by melting and casting. Due to the low cooling rate in the melting and casting process, coarse primary silicon phases and needle-shaped eutectic silicon phases are formed in the ingots. After semi-solid forming, this structure will remain in the semi-solid formed material, thereby deteriorating the comprehensive performance of the material

Therefore, the existing aluminum-silicon composite materials for electronic packaging often have problems such as large silicon phase size and low processability.

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