A Diffraction Grating Etching Machine

Abstract

The invention relates to the technical field of lithography, and specifically relates to a diffraction grating etcher. The diffraction grating etcher includes a first fixed housing, a transmission mechanism, a second fixed housing, an etching mechanism, a feeding mechanism, a sealing mechanism, an adjusting mechanism and a lithography mechanism, wherein the lithography mechanism is arranged in thefirst fixed housing, and can effectively project on a silica gel plate to form a model; the etching mechanism is arranged in the second fixed housing, and can effectively use the projected silica gelplate to perform etching to manufacture a real product; the transmission mechanism is arranged between the first fixed housing and the second fixed housing, and can transmit the projected silica gelplate in the first fixed housing into the second fixed housing for etching while maintaining the sealing properties of the first fixed housing and the second fixed housing, so as to realize continuousproduction; and in the first fixed housing, the feeding mechanism is used to perform feeding, and at the same time the sealing mechanism is used to maintain the sealing state, and when the sealing mechanism is opened, the sealing mechanism can guarantee that no external light enters and can guarantee the sealing properties during the feeding process.

Description

technical field [0001] The invention relates to the technical field of photolithography, in particular to a diffraction grating etching machine. Background technique [0002] Lithography machine is also known as: mask alignment exposure machine, exposure system, lithography system, etc. A commonly used lithography machine is mask alignment lithography. The general photolithography process has to go through the processes of cleaning and drying the surface of the silicon wafer, primer coating, spin-coating photoresist, soft baking, alignment exposure, post-baking, developing, hard baking, and etching. Inductively coupled plasma etching is the result of the joint action of chemical and physical processes. Its basic principle is that under vacuum and low pressure, the radio frequency generated by the ICP radio frequency power supply is output to the ring coupling coil, and a certain proportion of mixed etching gas is coupled with glow discharge to generate high-density plasma....

AI Technical Summary

Problems solved by technology

[0003] In the process of etching silicon wafers with diffraction gratings, during photolithography and etching, sealing must be ensured. The first fixed shell needs to be light-proof, and the second fixed shell needs to be vacuumed. Therefore, after photolithography, it cannot Realize the continuous transport of photolithographic silicon wafers into the etching machine using the conveyor belt

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