A kind of high thermal conductivity silicone grease interface material and preparation method thereof

Abstract

The invention discloses a high thermal conductivity silicone grease interface material and a preparation method thereof. The high thermal conductivity silicone grease interface material is characterized in that it is a paste silicone grease with low oil seepage and high thermal conductivity. In the invention, metal or inorganic powder with high thermal conductivity is used as thermal conductive filler, which is added into the organic silicone oil mixture and uniformly mixed by a three-roll grinder to obtain homogeneous gray paste silicone grease. In the paste, the mass percentage of organic silicon oil is 5%-40%, and the mass percentage of the metal or inorganic powder mixed with heat-conducting filler is 60%-95%. The average particle size of the filler is at least three kinds, the large particle size is 15-30um, the medium particle size is 5-10um, and the small particle size is 0.1-1um. The high thermal conductivity silicone grease interface material of the present invention has the characteristics of high thermal conductivity, good heat dissipation effect, small oil leakage, simple preparation process, etc., and is especially suitable for occasions where oil leakage needs to be avoided.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a method for solving the problem of contact thermal resistance encountered in the heat dissipation process of key stand-alone satellites and components, enhancing the heat dissipation performance of high-power devices, and meeting the requirements for heat dissipation and avoiding oil seepage in the space environment. The needs of the problem. [0002] technical background [0003] The spacecraft needs to experience extremely harsh thermal environments during its flight. In order to ensure the normal operation of the spacecraft, it is necessary to effectively control the heat conduction process between the internal and external components of the spacecraft, stand-alone machines, and instruments. The heat generated by the common chip heat source in a single machine needs to be conducted to the bracket through the circuit board, then to the shell of the single mach...

AI Technical Summary

Problems solved by technology

Due to the very low thermal conductivity of air, the large amount of heat generated by the heat source cannot be effectively conducted out

On the other hand, the fastening process of some stand-alone assembly produces local stress, which causes local deformation of the installation contact surface, further increases the contact gap, and thus aggravates the degree of poor thermal contact

[0004] At present, the commercially available thermal grease generally has some shortcomings, such as low thermal conductivity, easy separation of base material and thermal filler, serious oil leakage, and easy "oil creeping" phenomenon, which cannot meet the thermal control requirements of the new generation of high-density stand-alone , also poses a threat to the security of the device

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