Diffusion bonding method for high-temperature alloy and oxygen-free copper annular part
A high-temperature alloy and diffusion bonding technology, which is applied in welding equipment, metal processing equipment, electron beam welding equipment, etc., can solve the problems of peeling of the connecting layer, high porosity of the connecting layer, and layered matrix, so as to avoid peeling and increase the application range effect
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[0022] The method for diffusion bonding of superalloys and oxygen-free copper rings provided by the present invention will be described in detail below with reference to the accompanying drawings and specific examples.
[0023] Such as figure 1 — Figure 5 As shown, the superalloy provided by the present invention and the oxygen-free copper ring diffusion bonding method include
[0024] The following steps in order:
[0025] 1) According to the structural features of the superalloy and oxygen-free copper ring connectors 4 and 5, the superalloy ring 3 is prepared. The material of the superalloy ring 3 is GH907, which is prepared by mechanical processing, the surface is polished, and the surface is ultrasonically cleaned with acetone.
[0026] 2) Design and process a reasonable oxygen-free copper sheath according to the thickness of the oxygen-free copper layer and the shape of the connector. The sheath includes the top plate 1 and the U-shaped cylinder 2. The thickness of th...
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