Cerium dioxide nanoparticle reinforced tin silver copper composite soldering paste and preparation method thereof

A nanoparticle and cerium oxide technology, which is applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of poor mechanical strength, insufficient fatigue resistance, and poor wettability of the interface metal connection layer, and achieve improved mechanical properties. Performance, inhibition of grain growth, and the effect of reducing production and preparation costs

Inactive Publication Date: 2018-09-14
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main disadvantages of the existing lead-free electronic packaging solders are: the mechanical strength of the interface metal connection layer is poor, it is easy to break under the action of external force, and the fatigue resistance is insufficient, and the wetting performance is not good, etc.

Method used

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  • Cerium dioxide nanoparticle reinforced tin silver copper composite soldering paste and preparation method thereof
  • Cerium dioxide nanoparticle reinforced tin silver copper composite soldering paste and preparation method thereof
  • Cerium dioxide nanoparticle reinforced tin silver copper composite soldering paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Add nano-cerium oxide powder (particle size: 10-30nm) with a mass fraction of 0.10% to tin-silver-copper lead-free solder paste with a mass ratio of 99.0:0.3:0.7, and mechanically stir for more than 45 minutes to ensure that the nano-cerium oxide The particles are uniformly distributed in the tin-silver-copper lead-free solder paste, and the cerium dioxide nanoparticle-enhanced tin-silver-copper composite solder paste is obtained. Take a small amount of solder paste on the copper plate, and make a sample after 30s of industrial reflow process, and observe its cross-sectional electron microscope scanning image (such as figure 1 ), the average thickness of the IMC is 1.606 μm, and the shape tends to be stable, indicating that ceria doping plays a role in inhibiting the growth and refinement of IMC.

Embodiment 2

[0025] Add nano-cerium oxide powder (particle size: 10-30nm) with a mass fraction of 0.25% to tin-silver-copper lead-free solder paste with a mass ratio of 99.0:0.3:0.7, and mechanically stir for more than 45 minutes to ensure that the nano-cerium oxide The particles are uniformly distributed in the tin-silver-copper lead-free solder paste, and the cerium dioxide nanoparticle-enhanced tin-silver-copper composite solder paste is obtained. Take a small amount of solder paste on the copper plate, and make a sample after 30s of industrial reflow process, and observe its cross-sectional electron microscope scanning image (such as figure 2 ), the average thickness of its IMC is 2.038 μm. In the case of the same reflow time, the inhibitory effect of higher content of ceria doping may not be so obvious.

Embodiment 3

[0027] Add 0.05%, 0.10%, 0.15%, 0.20%, 0.25% nanometer ceria powder (particle size: 10-30nm) to the tin-silver-copper lead-free solder paste with a mass ratio of 99.0:0.3:0.7 During the process, the mechanical stirring was performed for more than 45 minutes to ensure that the cerium dioxide nanoparticles were uniformly distributed in the tin-silver-copper lead-free solder paste, and the cerium dioxide nanoparticle-enhanced tin-silver-copper composite solder paste was obtained.

[0028] Then reflow soldering for 60s, 100s, 600s, 1000s, 2000s respectively.

[0029] Calculate the thickness of the IMC and make a bar graph such as image 3 shown. Among them, SAC indicates that CeO was not added 2 Nanoparticle SnAgCu solder paste; SAC-x (x=0.05, 0.10, 0.15, 0.20, 0.25) CeO 2 Indicates that the mass fraction x% of CeO is added to the SnAgCu solder paste 2 nanoparticles.

[0030] It can be seen that when the added content is 0.10%, the inhibitory effect of nano-cerium oxide parti...

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Abstract

The invention discloses cerium dioxide nanoparticle reinforced tin silver copper composite soldering paste. The cerium dioxide nanoparticle reinforced tin silver copper composite soldering paste is obtained by blending tin silver copper lead-free soldering paste and cerium dioxide nanoparticles, wherein the mass percentage of the cerium dioxide nanoparticles in the composite soldering paste is 0.05 to 0.5 percent. Through addition of the cerium dioxide nanoparticles, the microhardness and the mechanical property of the composite soldering flux are improved, the growth of solder joint interfaceintermetallic compounds can be effectively inhibited, the crystal particles of the solder joint interface intermetallic compounds can be refined, the welding reliability is improved, and a good application prospect is achieved.

Description

technical field [0001] The invention relates to the technical field of soldering materials, in particular to a ceria nanoparticle-reinforced tin-silver-copper composite solder paste and a preparation method thereof. Background technique [0002] The European Union officially announced the WEEE and RoHS directives in January 2003. The purpose is to limit and prohibit the use of toxic and harmful substances such as lead, and reduce the impact of harmful substances in waste electronic products on the environment. In the process of assembling printed circuit boards, whether manual soldering iron soldering, dip soldering, wave soldering or reflow soldering is used, traditional tin-lead solders are widely used at present, and to break through the technical barriers of EU directives, it is necessary to turn to non-conductive Leaded electronics assembly. The National Standardization Management Committee of China also started to formulate the national standard of "Lead-free Solder"...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/362B23K35/40
CPCB23K35/262B23K35/362B23K35/40
Inventor 李国元邱若谷唐宇
Owner SOUTH CHINA UNIV OF TECH
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