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Resin composition and low-gummosis prepreg prepared from resin composition

A resin composition and resin curing technology, which is applied in the field of printed circuit boards, can solve problems such as insufficient adhesion, restrictions on the application of low-flow adhesive prepregs, and negative effects on the heat resistance of low-flow adhesive prepregs to achieve low resin flow. properties, excellent heat resistance, and excellent toughness

Inactive Publication Date: 2018-08-10
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Early low-flow adhesive prepregs achieved low-flow adhesives by increasing the baking time and improving the reaction degree on the basis of conventional FR-4, but there was a problem of insufficient adhesion. The current low-flow adhesive prepregs are generally passed through high molecular weight phenolic oxygen. Resin, rubber and other thermoplastic macromolecule materials are used to modify epoxy resin and other main body resins, such as in patent CN102775734A, in order to achieve low flow glue, phenolic resin, shell core rubber and polymer epoxy resin are added to the resin formula, however , due to the addition of components such as phenolic resin and shell core rubber, it has a negative impact on the heat resistance of low-flow rubber prepregs, which limits the application of low-flow rubber prepregs in high heat-resistant fields

Method used

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  • Resin composition and low-gummosis prepreg prepared from resin composition
  • Resin composition and low-gummosis prepreg prepared from resin composition
  • Resin composition and low-gummosis prepreg prepared from resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0084] In a dry three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, add 400 g (4.65 mol) of vinyl acetate after purification, 0.1 g AIBN and 250 ml of acetone, heat in a water bath under stirring, and control the temperature of the water bath to be 50- 65°C, keep reflux. After a period of time, the reactant in the flask began to become viscous and was accompanied by bubbles. When the bubbles in the reactant basically stopped rising and became long and thin, add 250ml of acetone to the flask and continue to stir. Stop the reaction when the viscosity of the mixture is almost constant. The mixture in the flask was poured out, washed with water, filtered, and then dried in a constant temperature oven at 100°C for 12 hours to obtain a vinyl acetate polymer. Then, get this multipolymer 100g, use 100ml acetone to dissolve and pour in the flask and keep stirring, then add 150ml methyl alcohol and NaOH methanol solution 50ml, make the polyvinyl alcohol (P...

Synthetic example 2

[0086] In a dry three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, add 400 g (4.65 mol) of vinyl acetate after purification, 0.1 g AIBN and 250 ml of acetone, heat in a water bath under stirring, and control the temperature of the water bath to be 50- 55°C, keep reflux. After a period of time, the reactant in the flask began to become viscous and was accompanied by bubbles. When the bubbles in the reactant basically stopped rising and became long and thin, add 250ml of acetone to the flask and continue to stir. Stop the reaction when the viscosity of the mixture is almost constant. The mixture in the flask was poured out, washed with water, filtered, and then dried in a constant temperature oven at 100°C for 12 hours to obtain a vinyl acetate polymer. Then, get this multipolymer 100g, use 100ml acetone to dissolve and pour in the flask and keep stirring, then add 100ml of hydrochloric acid 150ml methanol and 2mol / l, make polyvinyl alcohol (PVA);...

Synthetic example 3

[0090] Referring to Synthesis Example 1, a polyvinyl alcohol (PVA) resin was prepared, which was washed and dried for subsequent use. In a dry three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, take a certain amount of the above-mentioned PVA resin and deionized water, add phosphoric acid and urea after dissolving, stir evenly, rise to the reaction temperature for a period of time, and then cool to At room temperature, then use ethanol to repeatedly wash and dry to obtain phosphated polyvinyl alcohol with a phosphorus content of 15%, and the dried resin is dissolved in a dimethylformamide solvent to make a 15% resin solution (C3). The Mw of the resin was 15.

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PUM

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Abstract

The invention discloses a resin composition. The resin composition is prepared from the following components in parts by weight according to the weight part of organic solid matters: 100 parts of modified maleimide resin, 2 to 50 parts of flexible long-chain resin and 0.5 to 50 parts of flexible long-chain resin curing agent, wherein the flexible long-chain resin contains at least two hydroxyl functional groups. Compared with the prior art, the resin composition and the low-gummosis prepreg prepared from the resin composition, provided by the invention, have extremely low resin flowability andexcellent toughness; nearly no resin powder obviously falls off from the prepreg after the prepreg is mechanically punched; the resin composition has very excellent heat resistance and excellent comprehensive performance.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a resin composition and a prepreg with low resin fluidity used as a bonding layer material in the production of rigid-flexible printed circuit boards prepared by using the resin composition. Background technique [0002] Rigid-flex printed circuit boards and stepped boards are currently in demand and developing printed circuit boards. This type of special printed circuit board is an effective means to achieve miniaturization and high density in the interconnection field and improve safety performance. [0003] At this stage, special printed circuit boards such as rigid-flex boards use low-flow resin prepregs as bonding layer materials during processing and production. Die-cut, then laminated with rigid and flexible printed boards and then pressed. Compared with conventional FR-4 prepregs, low resin fluidity prepregs have little or no glue flow under high temperatu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L29/04C08L63/00C08L9/02C08L71/12C08K13/02C08K3/38C08K5/29C08K5/315C08K5/3445
CPCC08L79/085C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2205/035C08L29/04C08L63/00C08L9/02C08L71/123C08K13/02C08K3/38C08K5/29C08K5/3155C08K5/3445
Inventor 何继亮马建崔春梅陈诚张明军
Owner SHENGYI TECH SUZHOU
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