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Graphite nickel plating method

A technology of nickel and graphite plating, applied in the field of electrochemistry, can solve the problems of wasting time, increasing the cost of graphite nickel plating, reducing the efficiency of nickel plating, etc., and achieving the effect of good electrical conductivity and tensile strength

Inactive Publication Date: 2018-07-13
ZHEJIANG SAINTYEAR ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the traditional process has relatively complicated pretreatment processes, such as surface degreasing, roughening, sensitization, metal palladium activation, degumming and other processes. These pretreatment processes not only waste time, reduce the efficiency of nickel plating, but also increase Cost of Graphite Nickel Plating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Embodiment 1 nickel-plated graphite powder

[0069] (1) Configure the electroless nickel plating solution: nickel sulfate hexahydrate 25g / L, lactic acid 30g / L, triethanolamine 18g / L, sodium citrate 20g / L, ammonium chloride 35g / L, sodium hypophosphite 45g / L, L-arginine 0.1mg / L, potassium ferrocyanide 5mg / L, adjusted to pH8.8 with ammonia water.

[0070] (2) Add graphite powder directly into the electroless nickel plating solution heated to 30°C, and mechanically stir for 10 minutes. After chemical reaction, a layer of electroless nickel-phosphorus alloy metal layer can be formed on the surface of graphite powder. After washing with running water and drying at 150°C for 10 minutes, good nickel-phosphorus alloy-plated graphite can be obtained.

[0071] figure 1 It is a process flow chart of nickel plating in Example 1 of the present invention.

Embodiment 2

[0073] The first step of electroless copper plating

[0074] (1) Configure the electroless copper plating solution: copper sulfate pentahydrate 8g / L, tetrasodium edetate 35g / L, sodium hydroxide 12g / L, formaldehyde 10mL / L, bipyridine 5mg / L, polyethylene glycol Alcohol 50mg / L.

[0075] (2) Add the graphite powder directly into the electroless copper plating solution at a temperature of about 30°C, and stir mechanically for 10 minutes. After a chemical reaction, a layer of chemical copper metal layer can be formed on the surface of the graphite powder.

[0076] The second step of electroless nickel plating

[0077] (1) Configure the electroless nickel plating solution: nickel sulfate hexahydrate 25g / L, lactic acid 30g / L, triethanolamine 18g / L, sodium citrate 20g / L, ammonium chloride 35g / L, sodium hypophosphite 45g / L, L-arginine 0.2mg / L, potassium ferrocyanide 10mg / L, ammonia water adjusted to PH8.8, etc.

[0078] (2) After the graphite powder of the electroless copper layer ha...

Embodiment 3

[0081] First Step Electroless Nickel Plating

[0082] (1) Add the graphite powder directly into the electroless nickel plating solution at a temperature of about 45°C, and stir it mechanically for 10 minutes. After a chemical reaction, a layer of chemical nickel-phosphorus alloy metal layer can be formed on the surface of the graphite powder.

[0083] (1) Configure the electroless nickel plating solution: The electroless nickel plating solution consists of nickel sulfate hexahydrate, lactic acid, triethanolamine, sodium citrate, ammonium chloride, sodium hypophosphite, stabilizer and the like. Dosage: nickel sulfate hexahydrate 25g / L, lactic acid 30g / L, triethanolamine 18g / L, sodium citrate 20g / L, ammonium chloride 35g / L, sodium hypophosphite 45g / L, L-arginine 0.01mg / L L, potassium ferrocyanide 0.1mg / L, ammonia water to adjust the pH to 8.8.

[0084] The second step configures electroless copper plating

[0085] (2) Configure the electroless copper plating solution: copper s...

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Abstract

The invention provides a graphite nickel plating method. The graphite nickel plating method comprises the steps of adding a graphite matrix into a nickel plating solution, and carrying out a reactionso as to obtain nickel plated graphite, wherein the nickel plating solution comprises the following components by content: 20 g / L to 35 g / L of nickel sulfate hexahydrate, 8 g / L to 30 g / L of lactic acid, 2 g / L to 18 g / L of triethanolamine, 20 g / L to 45 g / L of sodium citrate, 10 g / L to 35 g / L of ammonium chloride, 30 g / L to 45 g / L of sodium hypophosphite, 0.01 mg / L to 0.2 mg / L of L-arginine and 0.1mg / L to 10 mg / L of potassium ferrocyanide, pH is adjusted to be 8 to 9 through aqueous ammonia, and the temperature of the nickel plating solution is 30 DEG C to 45 DEG C. According to the graphite nickel plating method, complex technologies like surface degreasing, sensitization, metal palladium activation and peptization are eliminated, so that production efficiency is greatly improved; preciousmetal catalysis is not utilized, so that cost is reduced; and further, graphite powder is firstly subjected to copper plating and then is subjected to nickel plating, so that graphite powder has better electrical conductivity and tensile strength.

Description

technical field [0001] The invention belongs to the technical field of electrochemistry, in particular to a method for graphite nickel plating. Background technique [0002] Nickel-plated graphite is widely used in the national economy. In many application fields, it is required to cover a layer of metallic nickel on the surface of graphite. For example, when graphite powder is used as a conductive material, in order to improve the conductivity of graphite powder, it is often coated on the surface of graphite powder. A metal nickel is formed by chemical plating or vapor deposition. For example, graphite powder is often coated with a layer of nickel metal on its surface when it is used as an electromagnetic shielding material. The surface of graphite powder is coated with metal material, which has good mechanical and mechanical properties. Electrical properties, good thermal conductivity, electrical conductivity and lubricity, good electrical conductivity and filling performa...

Claims

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Application Information

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IPC IPC(8): C23C18/36C23C18/40B22F1/02
CPCC23C18/1651C23C18/36C23C18/405B22F1/17
Inventor 王正坤张婷周鸿方源李少波董庆文
Owner ZHEJIANG SAINTYEAR ELECTRONICS TECH
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