Thermal conductivity filler composition as well as high thermal conductivity insulating composite material and preparation method thereof

Abstract

The invention discloses a thermal conductivity filler composition. The thermal conductivity filler composition is characterized by being prepared from the following components in parts by weight: 90 to 95 percent of component A and 5 to 10 percent of component B, wherein the component A is prepared from thermal conductivity filler and a silane coupling agent, and the silane coupling agent accountsfor 1 to 3 percent of the total weight of the component A; the component B is prepared from graphene oxide and isocyanate, and the isocyanate accounts for 70 to 80 percent of the total weight of thecomponent B. The invention also discloses a high thermal conductivity insulating composite material and a high thermal conductivity insulation base film and preparation methods of the high conductivity thermal insulating composite material and the high thermal insulation base film. The high thermal conductivity insulating composite material has high thermal conductivity, good insulation and mechanical properties, good dielectric properties and high water vapor barrier property.

Description

technical field [0001] The invention relates to the field of thermally conductive materials, in particular to a thermally conductive filler composition, a high thermally conductive insulating composite material and methods for preparing them. Background technique [0002] With the development of electronic components and electronic equipment toward miniaturization and miniaturization, more and more heat is accumulated in a limited space. Therefore, higher requirements are placed on the thermal conductivity and heat dissipation performance of insulating materials. The thermal conductivity of ordinary polymer materials is mostly difficult to meet the heat dissipation requirements. [0003] At present, there are two main ways to improve the thermal conductivity of polymers: (1) Synthesize polymers with high thermal conductivity structures, such as polyacetylene, polyaniline, polypyrrole, etc., which mainly conduct electricity through electronic heat conduction mechanisms; or ha...

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Problems solved by technology

The first way does not need to add thermally conductive fillers, relying on the polymer itself to achieve thermal conductivity, the scope of application is narrow, and it cannot be applied to the field of insulation due to its own electrical conductivity; the second way is to form a thermal conduction path by adding inorganic thermally conductive fillers to contact each other in the polymer system To achieve thermal conductivity, it has a wide range of applications. However, the thermal conductivity of ordinary inorganic thermally conductive fillers is still low, and the compatibility with polymer systems is poor. Usually, it is necessary to add 50% by weight to 90% by weight to achieve high thermal conductivity. function, which often leads to a reduction in the mechanical and insulating properties of the polymer material

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