Semiconductor device and manufacturing method thereof, and electronic device
A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, circuits, etc., can solve the problems of reducing device performance, increasing device size, and large pitch size, so as to improve overall performance and integration, reduce Effect of turning on resistance and reducing pitch size
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Embodiment 1
[0062] In order to solve the foregoing technical problems, the present invention provides a semiconductor device, which mainly includes:
[0063] a semiconductor substrate having a first conductivity type, the semiconductor substrate comprising a first surface and a second surface opposite the first surface;
[0064] a body region with a first conductivity type formed in the semiconductor substrate, the body region includes a first portion and a second portion above and adjacent to the first portion, wherein the second portion is adjacent to the a first surface of a semiconductor substrate, the first portion extends along a first direction with a first width, the second portion extends along the first direction with a second width, and the first width is smaller than the second width;
[0065] a first gate structure disposed on the first surface of the semiconductor substrate and partially extending to the body region;
[0066] The second gate structure is disposed on the fir...
Embodiment 2
[0100] This implementation also provides a method for manufacturing a semiconductor device in the aforementioned implementation one, such as Figure 4 As shown, it mainly includes the following steps:
[0101] Step S1, providing a semiconductor substrate having a first conductivity type, the semiconductor substrate comprising a first surface and a second surface opposite to the first surface, and forming on the first surface of the semiconductor substrate a first gate structure and a second gate structure arranged at intervals along the first direction;
[0102] Step S2, forming a patterned mask layer with an opening to cover the first surface of the semiconductor substrate, wherein the opening exposes the gap between the first gate structure and the second gate structure said semiconductor substrate at the gap;
[0103] Step S3, performing a first ion implantation to form a first part of a body region in the semiconductor substrate exposed in the opening, wherein the first ...
Embodiment 3
[0161] The present invention also provides an electronic device, including the semiconductor device described in Embodiment 1, and the semiconductor device is prepared according to the method described in Embodiment 2.
[0162] The electronic device of this embodiment can be any electronic device such as a mobile phone, a tablet computer, a notebook computer, a netbook, a game console, a TV set, a VCD, a DVD, a navigator, a digital photo frame, a camera, a video camera, a recording pen, MP3, MP4, PSP, etc. Product or equipment, but also any intermediate product including electrical circuits. The electronic device according to the embodiment of the present invention has better performance due to the use of the above-mentioned semiconductor device.
[0163] in, Figure 5 An example of a mobile phone handset is shown. A mobile phone handset 500 is provided with a display portion 502 included in a casing 501, operation buttons 503, an external connection port 504, a speaker 505,...
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