A kind of resin diamond wire and its preparation method
A technology of resin diamond wire and resin, which is applied in the manufacture of tools, stone processing equipment, fine working devices, etc., can solve the problems of restricting the performance of resin diamond wire, the decrease of diamond holding force, and poor effective cutting performance, and achieve excellent holding force, Improve wettability and increase cutting force
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Embodiment 1
[0046]The diamond micropowder with D50 of 9.1 μm was subjected to plasma treatment under an oxygen atmosphere, the gas flow rate was 150L / h, the voltage was 30KV, the single treatment volume of the diamond micropowder was 5000ct, and the treatment time was 30min to obtain a modified diamond abrasive. A slurry was obtained by mixing 36% of polyimide resin, 25% of modified diamond abrasive, 15% of aluminum oxide and 24% of DMF. After the high-carbon steel wire busbar is coated with slurry through the mold, it is dried in a 300°C oven at a speed of 90m / min and wound up, and then post-treated at 220°C for 5h to obtain a resin diamond wire (denoted as S- 1). The morphology and structure of the resulting resin diamond wire can be found in figure 1 , figure 1 It is the topography diagram of the resin diamond wire S-1 obtained in this example.
[0047] Set up the control sample: prepare according to the above preparation process, the difference is that the diamond powder is not sub...
Embodiment 2
[0054] The diamond micropowder with D50 of 9.1 μm was subjected to plasma treatment under an oxygen atmosphere, the gas flow rate was 150L / h, the voltage was 20KV, the single treatment volume of the diamond micropowder was 5000ct, and the treatment time was 30min to obtain a modified diamond abrasive. Mix 25% polyimide resin, 30% modified diamond abrasive, 20% copper powder and 25% DMF to obtain a slurry. After the high-carbon steel wire busbar is coated with slurry through the mold, it is dried in a 300°C oven at a speed of 90m / min and wound up, and then post-treated at 220°C for 5h to obtain a resin diamond wire (denoted as S- 2).
[0055] According to the cutting test method of Example 1, the obtained resin diamond wire S-2 was subjected to a cutting test, and the test results showed that the diamond shedding rate was 19%, and the diamond wear rate was 22%. It can be seen that the bond between the modified diamond abrasive and the resin is strong, the grip is firm, the dia...
Embodiment 3
[0057] The diamond micropowder with D50 of 9.1 μm was subjected to plasma treatment under an oxygen atmosphere, the gas flow rate was 50L / h, the voltage was 30KV, the single treatment volume of the diamond micropowder was 5000ct, and the treatment time was 30min to obtain a modified diamond abrasive. 25% of polyimide resin, 30% of modified diamond abrasive, 20% of silicon carbide and 25% of DMF were mixed to obtain a slurry. After the high-carbon steel wire busbar is coated with slurry through the mold, it is dried in an oven at 250°C at a speed of 90m / min and wound up, and then post-treated at 200°C for 6 hours to obtain a resin diamond wire (denoted as S- 3).
[0058] According to the cutting test method of Example 1, the obtained resin diamond wire S-3 was subjected to a cutting test, and the test results showed that the diamond shedding rate was 18%, and the diamond wear rate was 22%. It can be seen that the bond between the modified diamond abrasive and the resin is stro...
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