Preparation method of metallic bond tool bit and diamond saw web comprising metallic bond tool bit
A metal bond and diamond technology, applied in the field of diamond tools, can solve problems such as insufficient cutting edge, liquid phase loss, and high-quality cutting, and achieve the effects of improving cutting sharpness, inhibiting liquid phase outflow, and increasing sintering temperature
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Embodiment 1
[0024] A method for preparing a metal bond cutter head, comprising the steps of:
[0025] Step (1) Metal powder preparation: choose metal powder containing 400 mesh CuSn 15 Water atomized pre-alloyed powder 、 AlSi finer than 1000 mesh 10 Gas atomized pre-alloyed powder, CuCe finer than 1000 mesh 20 Gas atomized pre-alloyed powder; the mass fraction ratio of the components in the metal powder is: 85% CuSn 15 Water atomized pre-alloyed powder, 5% AlSi 10 Gas atomized pre-alloyed powder, 10% CuCe 20 Gas atomized pre-alloyed powder;
[0026] Step (2) Diamond pretreatment: choose diamond, the selected diamond includes 40 / 50 particle size diamond, 50 / 60 particle size diamond, 60 / 70 particle size diamond, and 40 / 50 particle size diamond, 50 / 60 particle size diamond , The mass ratio of the diamond of 60 / 70 particle size is 3:4:3; Carry out vacuum titanium plating to the selected diamond, obtain titanium-coated diamond; Mix titanium-coated diamond with 800 mesh cobalt powders of ...
Embodiment 2
[0031] The preparation method of the metal bond cutter head of embodiment 2 is basically the same as the preparation method of embodiment 1, the difference is:
[0032] Metal powder comprises 82% CuSn in the step (1) of embodiment 2 15 Water atomized pre-alloyed powder, 3% AlSi 10 Atomized powder, 15% CuCe 20 Gas atomized pre-alloyed powder;
[0033] The diamonds selected in step (2) of Example 2 include diamonds with a particle size of 60 / 70 and diamonds with a particle size of 70 / 80, and the mass ratio of diamonds with a particle size of 60 / 70 and diamonds with a particle size of 70 / 80 is 6:4.
[0034] In step (3) of Example 2, the metal powder obtained in step (1) and the diamond obtained in step (2) were uniformly mixed to obtain a green compact mixture, wherein the volume fraction of diamond was 4.7%.
Embodiment 3
[0036] The preparation method of the metal bond cutter head of embodiment 3 is basically the same as the preparation method of embodiment 1, the difference is:
[0037] Metal powder comprises 80% CuSn in the step (1) of embodiment 3 15 Water atomized pre-alloyed powder, 3% AlSi 10 Atomized powder, 17% CuCe 20 Gas atomized pre-alloyed powder;
[0038] The diamond selected in the step (2) of embodiment 3 comprises the diamond of 60 / 70 grain size, the diamond of 70 / 80 grain size, the diamond of 80 / 100 grain size, and the diamond of 60 / 70 grain size, the diamond of 70 / 80 grain size, 80 The mass ratio of diamond / 100 grain size is 5:3:1.
[0039] In step (3) of Example 3, the metal powder obtained in step (1) and the diamond obtained in step (2) were uniformly mixed to obtain a green compact mixture, wherein the volume fraction of diamond was 4%.
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