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3D printing photosensitive resin material

A photosensitive resin, 3D printing technology, applied in the field of 3D printing materials, can solve the problems affecting the yield of printed parts, poor uv resin compatibility, poor release performance, etc., to achieve excellent release ability, fast curing rate, precision high degree of effect

Inactive Publication Date: 2018-04-03
HUIZHOU YOUHENGKE 3D MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Organosilicon compounds have excellent low surface tension and flexibility, but their polarity is low, and their compatibility with commonly used UV resins is poor
In the process of light-curing 3D printing, each printed layer forms a film between the trough and the platform. If the adhesion of the resin is too large and the release performance is poor, the part will be damaged due to the adhesion of the cured layer and the release film of the trough. Falling from the platform due to excessive force will affect the yield of printed parts

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Add 100 parts of epoxy resin, 0.05 parts of triphenylphosphine, 0.02 parts of p-hydroxyanisole and 20 parts of cyclohexane solvent into a four-necked flask equipped with a stirrer, thermometer, and reflux cooler, and pass in the protection After the gas is appropriately heated, stir evenly, start adding 36 parts of acrylic acid dropwise, after the addition is completed, program the temperature to 130°C, keep the temperature until the acid value is less than 0.2mg KOH / g, and lower the temperature to 70°C. Add 5 parts of polymethyltriethoxysilane, 0.5 parts of dibutyltin dilaurate and 10 parts of cyclohexane into a four-necked flask, react at constant reflux for a certain period of time for 3 hours, and react under reduced pressure at 50°C for 2 hours. The temperature is increased to remove the cyclohexane, and the silicone modified epoxy acrylate A with good compatibility is obtained.

Embodiment 2

[0024] Add 100 parts of epoxy resin, 0.05 parts of triphenylphosphine, 0.02 parts of p-hydroxyanisole and 20 parts of cyclohexane solvent into a four-necked flask equipped with a stirrer, thermometer, and reflux cooler, and pass in the protection After the gas is heated appropriately, stir evenly, start adding 42 parts of methacrylic acid dropwise, after the addition is completed, program the temperature to 120°C, keep the temperature until the acid value is less than 0.2mgKOH / g, and lower the temperature to 70°C. Add 15 parts of polymethyltriethoxysilane, 0.5 part of dibutyltin dilaurate and solvent into a four-necked flask, react under reflux at constant temperature for 6 hours, and react under reduced pressure at 90°C for 2 hours. Remove the solvent at elevated temperature to obtain the phase Silicone modified epoxy acrylate B with good capacitance.

Embodiment 3

[0026] Add 100 parts of epoxy resin, 0.05 parts of triphenylphosphine, 0.02 parts of p-hydroxyanisole and 20 parts of cyclohexane solvent into a four-necked flask equipped with a stirrer, thermometer and reflux cooler, and pass in protective gas. After proper heating, stir uniformly, start adding 36 parts of acrylic acid dropwise, after the addition is completed, program the temperature to 120°C, keep the temperature until the acid value is less than 0.2mg KOH / g, and lower the temperature to 70°C. Add 25 parts of polymethyltriethoxysilane, 0.5 part of dibutyltin dilaurate and 10 parts of cyclohexane into a four-necked flask, react at constant reflux for 8 hours, react under reduced pressure at 60°C for 2 hours, and remove the ring at elevated temperature. Hexane to obtain silicone modified epoxy acrylate C with good compatibility.

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Abstract

The invention discloses a 3D printing photosensitive resin material. The 3D printing photosensitive resin material comprises the following components in parts by weight: 10-50 parts of a low-viscosityphotosensitive resin oligomer, 10-50 parts of organosilicone modified epoxy acrylate, 30-50 parts of a reactive diluent, 1-5 parts of a photoinitiator, 1-5 parts of an auxiliary agent and 0.01-1 partof a pigment. The 3D printing photosensitive resin material is very low in viscosity and odor, high in curing rate, high in precision of a printed product and universal in universality; meanwhile, the organosilicone modified epoxy acrylate resin is obtained by grafting silicon onto a molecular chain of epoxy resin, so that the polarity of an organosilicone component is reduced and the compatibility thereof in the photosensitive resin material can be improved; in addition, the content of the organosilicone is high, and the organosilicone component in a branched-chain state contributes to movement of the molecular chain and can easily migrate to an interface between a 3D printing trough and the photosensitive resin material, so that the 3D printing photosensitive resin material shows excellent release capability.

Description

Technical field [0001] The invention relates to the technical field of 3D printing materials, in particular to a photosensitive resin material applied to 3D printing. Background technique [0002] 3D printing technology is the use of computer-aided design object 3D data model, and build three-dimensional objects layer by layer, 3D printing technology includes fused deposition modeling (FDM), paper laminate molding (LOM), selective laser sintering molding (SLS) and light curing three-dimensional Molding (SLA), light-curing 3D printing technology is to selectively cure photosensitive resin layer by layer through a computer controlled ultraviolet light beam, and control the displacement of the platform in the z-axis direction, and perform the next layer of photosensitive resin on the upper cured layer The curing of the resin completes the production of 3D printed parts. The mature light-curing 3D printing technology, high precision, high material utilization rate, and fast forming ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/14C08L63/10C08L67/06C08G59/17C08G59/14B33Y70/00
CPCB33Y70/00C08G59/1466C08G59/1494C08L63/10C08L67/06C08L75/14C08L2205/025
Inventor 张金汉陈樟
Owner HUIZHOU YOUHENGKE 3D MATERIAL TECH CO LTD
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