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High-thermal conductivity flame-retardant epoxy resin pouring sealant and preparation method thereof

A technology of epoxy resin and potting glue, applied in the field of potting glue, to achieve the effect of industrialized production, easy industrial production and good compatibility

Inactive Publication Date: 2018-03-09
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at present, the thermal conductivity of epoxy resin potting compound is generally lower than 3.0 W / mK, and the flame retardant grade is UL94-V1

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A high thermal conductivity and flame retardant epoxy resin potting compound of the present invention, the thermal conductivity of the epoxy resin potting compound reaches 5.0W / mK, and the flame retardant grade is UL94 V-0 level; the epoxy resin potting compound includes A components and B components,

[0039] Wherein, component A is mainly prepared from the following raw materials in parts by weight:

[0040] Epoxy resin (glycidyl ester type epoxy resin) 60kg,

[0041] Inorganic filler (30-50nm boron nitride nanosheets) 30kg,

[0042] Inorganic filler (10-20um silica powder) 10kg,

[0043] Dispersant (BYK163) 1.5kg,

[0044] Defoamer (BYK141) 0.5kg,

[0045] Active diluent (alkyl glycidyl ether) 3kg;

[0046] Component B is mainly prepared from the following raw materials in parts by weight:

[0047] Curing agent (polyamide) 90kg,

[0048] Accelerator (DMP-30) 10kg;

[0049] The mass ratio of component A to component B is 10:1.

[0050] The preparation method ...

Embodiment 2

[0055] A high thermal conductivity and flame retardant epoxy resin potting compound of the present invention, the thermal conductivity of the epoxy resin potting compound reaches 3.0W / mK, and the flame retardant grade is UL94 V-0 level; the epoxy resin potting compound includes A components and B components,

[0056] Wherein, component A is mainly prepared from the following raw materials in parts by weight:

[0057] Epoxy resin (aliphatic epoxy resin) 65kg,

[0058] Inorganic filler (alumina with a particle size of 10-20um) 15kg,

[0059] Inorganic filler (aluminum nitride with a particle size of 15-25um) 25kg,

[0060] Dispersant (EFKA4050) 1.5kg,

[0061] Defoamer (HX-2000) 0.3kg,

[0062] Reactive diluent (ethylene glycol glycidyl ether) 2kg;

[0063] Component B is mainly prepared from the following raw materials in parts by weight:

[0064] Curing agent (fatty amine) 92kg,

[0065] Accelerator (K54) 8kg;

[0066] The mass ratio of component A to component B is 12:1...

Embodiment 3

[0072] A high thermal conductivity and flame retardant epoxy resin potting compound of the present invention, the thermal conductivity of the epoxy resin potting compound reaches 4.2W / mK, and the flame retardant grade is UL94 V-0 level; the epoxy resin potting compound includes A components and B components,

[0073] Wherein, component A is mainly prepared from the following raw materials in parts by weight:

[0074] Epoxy resin (glycidyl ether type epoxy resin) 80kg,

[0075] Inorganic filler (boron nitride nanotubes with a particle size of 20-40nm) 15kg,

[0076] Inorganic filler (silica powder with a particle size of 10-20um) 10kg,

[0077] Dispersant (BYK163) 1.0kg,

[0078] Defoamer (Deqian 2700) 0.2kg,

[0079] Reactive diluent (low molecular weight epoxy resin with a molecular weight of 500-1000) 1kg;

[0080] Component B is mainly prepared from the following raw materials in parts by weight:

[0081] Curing agent (alicyclic amine) 95kg,

[0082] Accelerator (DMP...

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Abstract

The invention discloses a high-thermal conductivity flame-retardant epoxy resin pouring sealant. The heat conductivity coefficient of the pouring sealant reaches 3.0W / mK-5.0W / mK, and the flame-retardant grade is UL94 V-0. The pouring sealant contains a component A and a component B, wherein the component A is mainly prepared from epoxy resin, an inorganic fillings, a dispersing agent, a defoamingagent and an active diluent; the component B is mainly prepared from a curing agent and an accelerant; the inorganic fillings are selected from at least two of boron nitride nanotubes, boron nitride nanosheets, aluminum nitride, aluminum oxide and silica powder; and the mass ratio of the component A to the component B is (10-15) to 1. The invention further discloses a preparation method of the epoxy resin pouring sealant. The heat conductivity coefficient of the pouring sealant reaches 3.0W / mK-5.0W / mK, and the flame-retardant grade is UL94 V-0.

Description

technical field [0001] The invention belongs to the field of potting glue, and in particular relates to a high thermal conductivity and flame-retardant epoxy resin potting glue and a preparation method thereof. Background technique [0002] As an important class of thermosetting resins, epoxy resin has a series of advantages such as high mechanical properties, strong adhesion, low curing shrinkage, and good stability. It is widely used in water conservancy, transportation, machinery, electronics, home appliances, automobiles and aviation. aerospace field. The potting glue prepared by epoxy resin can effectively strengthen the integrity of electronic components, prevent moisture and harmful gases from invading electronic components, and improve the resistance to external shock and vibration. With the rapid development of modern industry, the integration level of electronic components is getting higher and higher. Its high power, high density and high integration characterist...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08C09J9/00
CPCC08K3/36C08K7/00C08K7/24C08K2003/2227C08K2003/285C08K2201/003C08K2201/011C09J9/00C09J11/04C09J11/06C09J11/08C09J163/00
Inventor 周伟陈立斌曾凡辉曾智邢国华王浩新李儒剑丁嘉欣
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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