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High-temperature resistant low-dilatation coefficient heat conduction potting adhesive as well as preparation method and application thereof

A low expansion coefficient, heat conduction potting technology, applied in the field of potting glue, can solve the problems of high temperature resistance and small volume expansion coefficient of PTC potting glue, achieve good adhesion, increase dosage, and enhance thermal conductivity.

Active Publication Date: 2017-12-26
广州天宸高新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that the PTC potting compound existing in the prior art cannot have both high temperature resistance and small volume expansion coefficient, the present invention provides a heat-conducting potting compound composition with high temperature resistance, low volume expansion coefficient and large thermal conductivity

Method used

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  • High-temperature resistant low-dilatation coefficient heat conduction potting adhesive as well as preparation method and application thereof
  • High-temperature resistant low-dilatation coefficient heat conduction potting adhesive as well as preparation method and application thereof

Examples

Experimental program
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Embodiment

[0031] Example Heat-conducting potting compound with high temperature resistance and low expansion coefficient

[0032] A-1 is a terminal group vinyl silicone oil with a viscosity of 300mPa.s and a vinyl content of 0.8%;

[0033] A-2 is a terminal vinyl silicone oil with a viscosity of 400Mpa.s and a vinyl content of 0.5%;

[0034] A-3 is a terminal vinyl silicone oil with a viscosity of 300MPa.s and a vinyl content of 0.8%;

[0035] B-1 is a hydroxyl vinyl oligomer with a viscosity of 30MPa.s and a vinyl content of 2.5%;

[0036] B-2 is a hydroxyvinyl oligomer with a viscosity of 40MPa.s and a vinyl content of 2%;

[0037] B-3 is a hydroxyvinyl oligomer with a viscosity of 25MPa.s and a vinyl content of 3%;

[0038] C-1 is aluminum powder and boron nitride with coating treatment on the surface, in which the average particle size of aluminum powder is 3 μm, boron nitride is a flake substance, and the content of boron nitride is 9%;

[0039] C-2 is spherical alumina, the av...

Embodiment 1

[0062] The preparation method of embodiment one comprises the steps:

[0063] S1 prepares A component and B component respectively; 1 and 10 parts of E-1 were stirred at a speed of 400r / min for 50min under the environment of vacuum degree of -0.06MPa and temperature of 28°C to obtain component A; the preparation method of component B was as follows: weigh 20 parts A-1, 6 parts of B-1, 7 parts of I-1, 1 part of D-1, 93 parts of C-1, 3 parts of F-1 and 0.008 parts of H-1, at a vacuum of -0.06MPa and a temperature of Stir at a speed of 400r / min for 50min at 28°C to obtain component B;

[0064] S2 defoaming and sub-packaging: put the A component and B component prepared in S1 in a high-speed defoaming machine, defoam at a speed of 3000r / min, pack, and obtain a high-temperature-resistant heat-conducting potting compound.

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Abstract

The invention provides a high-temperature resistant low-dilatation coefficient heat conduction potting adhesive which consists of a component A and a component B, wherein the component A comprises the following components in parts by mass: 10-30 parts of end group vinyl silicon oil, 5-20 parts of a hydroxyl vinyl oligomer, 0.5-2 parts of a high-temperature resistant aid, 80-100 parts of heat conduction packing, 6-20 parts of a low-volume dilatation controller and 0.002-0.010 part of a catalyst; and the component B comprises the following components in parts by mass: 10-30 parts of end group vinyl silicon oil, 5-20 parts of a hydroxyl vinyl oligomer, 2-20 parts of end hydrogen-containing silicone oil, 0.5-2 parts of a high-temperature resistant aid, 80-100 parts of heat conduction packing, 2-4 parts of an adhesive accelerant and 0.002-0.010 part of an inhibitor. The adhesive provided by the invention belongs to the technical field of potting adhesives. The high-temperature resistant low-dilatation coefficient heat conduction potting adhesive provided by the invention has the advantages of being small in volume dilatation coefficient, good in high temperature resistance, good in adhesion property and the like.

Description

technical field [0001] The invention belongs to the technical field of potting glue, and in particular relates to a heat-conducting potting glue with high temperature resistance and low expansion coefficient, a preparation method and application thereof. Background technique [0002] The thermal management scheme design of new energy power batteries generally includes three parts: heat dissipation, heat preservation and heating. Among them, the most important component involved in the heating scheme part is the PTC resistor, which is the abbreviation of Positive Temperature Coefficient (Positive Temperature Coefficient). The most commonly used PTC is a kind of barium titanate (BaTiO 3 ) is the basic composition of the semiconductor resistor. This kind of resistor is in a low resistance state at a lower temperature; but when the temperature is above a certain temperature (called the Curie temperature), its own resistance rises sharply by 3 to 8 orders of magnitude (10 3 ~10...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J183/06C09J11/04C09J11/06C09K5/14H01M10/637
CPCC08K2003/0812C08K2003/282C08K2003/385C08L2201/08C08L2203/20C08L2205/025C08L2205/03C09J11/04C09J11/06C09J183/04C09K5/14H01M10/637C08L83/06C08L83/04C08K9/02C08K3/08C08K3/38C08K5/0091C08K7/18C08K5/56C08K5/10C08K7/08C08K3/28Y02E60/10
Inventor 黄海全邱浩孟温茂添王坤
Owner 广州天宸高新材料有限公司
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