Nickel-free chemical copper plating solution and preparation method thereof

Abstract

The invention provides a nickel-free chemical copper plating solution and a preparation method thereof. The nickel-free chemical copper plating solution is prepared from the following materials according to mass concentration: 1-5g / L of copper sulfate, 0.5-2g / L of reducing agents, 3-8g / L of complexing agents and 0.001-0.01g / L of stabilizers. The nickel-free chemical copper plating solution has a stable deposition rate of 0.3-0.6 microns / cycle; the plating layer has excellent physical property; the nickel-free chemical copper plating solution is high in stability and free of sediment after the plating solution is stored for one week, is applicable to different substrate materials and comprises ordinary FR4 and High Tg materials and ceramic materials; the backlight effect of the substrates plated with copper is excellent; the backlight level reaches the ninth grade or higher.

Description

technical field [0001] The invention belongs to the technical field of electroless copper plating solution and relates to a nickel-free electroless copper plating solution and a preparation method. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] In the PCB manufacturing process, it is the most mature way to conduct via electroless copper. This electroless copper plating solution generally uses copper sulfate or copper chloride as a copper ion source, EDTA or / and tartaric acid as a complexing agent, formaldehyde as a reducing agent, a specially formulated stabilizer and nickel ions to improve the coating. physical properties. However, because nickel m...

AI Technical Summary

Problems solved by technology

However, because nickel may cause contact dermatitis and other allergies or damage to human skin, long-term exposure may cause mutagenesis, carcinogenicity, and great troubles to environmental protection and public health. Therefore, the European Union has completed the legislative process and completely banned nickel. , and passed the detection method of nickel content on the relevant products; this "nickel-free" electroplating will definitely be the trend of electroplating in the future, so nickel-free electroless copper plating has received more and more attention and research, while nickel-free electroless copper plating has received more and more attention and research. The technology of electroless copper plating often brings about the physical properties of electroless copper plating, and the deposition speed is slow, which is still a technical difficulty in the production process of high-end high-frequency circuit boards

[0004] CN101591792A discloses a nickel-free environmental protection electroplating treatment method, which is composed of: degreasing, roughening, neutralization, pre-soaking, palladium activation, acceleration, electroless copper plating, scorched copper, acid copper, chrome plating, and detection steps. No nickel or cyanide is used in the middle process, which meets the national requirements for establishing an environmental protection industry and an intensive economy; it can meet the increasingly stringent environmental protection standards of various countries; it saves raw materials, but the deposition rate and the physical properties of the coating Performance to be improved

[0005] CN104674314A discloses a copper-tin alloy cyanide-free and nickel-free electroplating method, the method comprising performing electroless copper plating, cyanide-free copper plating, sulfate copper plating, cyanide-free copper-tin alloy plating, and lead-free chrome plating on the base material in sequence; The plating solution for cyanide electroplating copper is copper pyrophosphate 10-20g / l, sodium pyrophosphate 230-280g / l; the plating solution for cyanide-free copper-tin alloy plating is potassium pyrophosphate 240-280g / l, copper pyrophosphate 12-17g / l, sodium stannate 10-20g / l; the electroplating solution for lead-free chromium plating is trivalent chromium 20-24g / l, boric acid 65-85g / l; this cyanide-free and nickel-free plating method does not contain carcinogens, reducing Environmental pollution, but the deposition rate, the backlight effect of the prepared material and the physical properties of the coating need to be further improved

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