a diaphragm

An integrated, arc-shaped technology, applied in the direction of non-planar diaphragm/paper cone, diaphragm structure, transducer diaphragm, etc., can solve the problem of easy adsorption of air impurities and dust, low thermal stability, and elastic diaphragm Problems such as poor resilience

Active Publication Date: 2021-05-14
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Elastomer diaphragms have poor resilience, low thermal stability, unsatisfactory waterproof and sealing effects, and "burrs" are prone to appear during production and processing, so they are not suitable for thin-wall design and processing; while silicone materials have better resilience, However, the wear resistance is poor, and it is particularly easy to absorb impurities and dust in the air. Impurities and dust will have a greater impact on the quality and performance of the speaker. During the production process, the environmental requirements are relatively high, and plasma technology and other methods are also required. The surface of the diaphragm is treated with impurities and dust

Method used

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Effect test

Embodiment 1

[0035] Such as figure 1 As shown, this embodiment discloses a diaphragm, which includes a single-layer thermoplastic vulcanized silica gel (hereinafter referred to as TPSiV) material layer 1, and the single-layer TPSiV material layer 1 can be doped with polymer materials, elastomer materials, silica gel One or more of the materials, among which polymer materials include PEEK (polyetheretherketone), PAR (polyarylate), PEI (polyetherimide), PEN (polyethylene naphthalate), etc. , Elastomer materials include TPE (thermoplastic elastomer), TPU (thermoplastic polyurethane elastomer), TPC (thermoplastic-based composite material), etc.; the diaphragm of TPSiV material can be thermocompressed or injection molded. Compared with silicone materials, injection molding is generally used. Molding, the manufacturing process is simpler.

[0036]As a specific application, the diaphragm can be applied to loudspeaker products. The speaker can be round, square or track-shaped, and the above-menti...

Embodiment 2

[0038] Such as figure 2 As shown, in this embodiment, the diaphragm includes a layer of TPSiV material layer 1 and a layer of PEEK material layer 3, wherein a glue layer 2 may be arranged between the TPSiV material layer and the PEEK material layer, and of course, glue may not be provided. The setting of the layer 2 and the glue layer 2 can increase the damping characteristics of the material, and the presence or absence of the glue layer 2 does not affect the protection range of the diaphragm of the present invention.

[0039] In this embodiment, the TPSiV material layer 1 and the PEEK material layer 3 are combined, and the PEEK material layer 3 is only a preferred embodiment. The PEEK material here can be replaced with a TPSiV material, or a polymer such as a PAR material or a PEI material. materials, or replaced by elastic materials such as TPU materials, TPE materials, TPC materials, or replaced by silica gel materials, do not affect the protection scope of the present in...

Embodiment 3

[0042] Such as image 3 As shown, the diaphragm in this embodiment is basically the same as that in Embodiment 2, except that the novel diaphragm disclosed in this embodiment is composed of TPSiV material layer 1, PEEK material layer 3 and TPU material layer 4, wherein the material The layers are bonded through the adhesive layer 2. Similarly, different material layers can also be bonded by injection molding or thermocompression. Similar to Embodiment 2, the TPSiV material layer or a multilayer material containing TPSiV can be used as an embedded material and Silicone material injection molding.

[0043] In this embodiment, the PEEK material layer 3 and the TPU material layer 4 are only a preferred implementation mode. The diaphragm composed of three layers of materials in this embodiment is not limited to the combination of these three materials, nor is it limited to the combination of TPSiV material and The composite of polymer material and elastomer material may also be th...

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Abstract

The invention discloses a vibrating membrane, which comprises a central part located in the middle, an arc part arranged around the center part and a connecting part arranged outside the arc part, the arc part at least includes a base material layer, and the base material layer It is a layer of thermoplastic vulcanized silicone material. TPSiV material diaphragm has better tensile performance, compression performance and wear resistance at high temperature, good resilience, and is more suitable for thin-walled design; at the same time, thermoplastic vulcanized silicone material is softer than TPU material, and can be used with various materials Two-time injection molding meets the requirements of various speaker designs. It has good sealing performance during assembly and meets the waterproof requirements of speakers. In addition, thermoplastic vulcanized silicone material is not easy to stick and absorbs less dust, so it is suitable for dust-proof applications. In the speaker products with high performance requirements, the acoustic performance of the speaker is improved, and the user experience of consumers is satisfied.

Description

technical field [0001] The present invention relates to the field of electroacoustic conversion, more specifically, to a vibrating membrane. Background technique [0002] With the rapid development of electronic information technology, portable electronic devices such as mobile phones and tablet computers are becoming more and more important in people's lives. The speaker is an indispensable and important acoustic component in portable mobile terminals. Its function is to convert electrical signals into sound signal output. As a key component of the speaker, the diaphragm plays a vital role in improving the performance of the speaker. [0003] With the development of thinner and lighter speakers, the diaphragm of the speaker is becoming thinner and thinner, and most speakers need to work under the conditions of high power and large displacement, which requires high resilience of the diaphragm material At the same time, the waterproof test of the product requires the diaphr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R7/12
CPCH04R7/122
Inventor 常秀丽许超
Owner GOERTEK INC
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