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A kind of glass fiber ball bundle and preparation method thereof

The technology of glass fiber and ball bundle is applied in the field of glass fiber ball bundle and its preparation, which can solve the problems of human harm, easy generation of dust, entering the respiratory tract and eyes, etc., and achieves the effect of cost saving and application expansion.

Active Publication Date: 2020-03-17
SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The glass fibers recovered by this method are white powders. When processing and using these glass fiber powders, it is easy to generate dust, which enters the respiratory tract and eyes, especially easily penetrates into the skin, causing harm to the human body and causing discomfort.

Method used

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  • A kind of glass fiber ball bundle and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The waste printed circuit boards are crushed and sorted to collect non-metallic powder. Take 100g of non-metallic powder and add it to 300mL6mol / L nitric acid solution, heat at 85°C for 20 hours, filter, extract the filtrate with ethylene glycol ether, and wash the solid with ethylene glycol ether to obtain glass fiber powder; combine the ethylene glycol ether extraction Liquid and washing liquid, distill off ethylene glycol ethyl ether with rotary evaporator, obtain recovery epoxy resin.

[0032] Take 50g of glass fiber powder, reclaim 1g of epoxy resin, add it to 200mL of 6% (by weight) ethanol solution of diethylenetriamine, heat at 50°C for 7 hours, filter to obtain glass fiber ball bundles, and then glass The fiber ball bundles were added to 150mL of ethanol, heated at 40°C for 5 hours, filtered, and dried to obtain the following: figure 1 Fiberglass bundles shown.

Embodiment 2

[0034] The waste printed circuit boards are crushed and sorted to collect non-metallic powder. Take 130g of non-metallic powder and add it to 910mL of 8mol / L nitric acid and phosphoric acid solution (3:1 by volume), heat at 80°C for 10 hours, filter, extract the filtrate with ethyl acetate, and wash the solid with ethyl acetate to obtain glass fiber powder ; Combine the ethyl acetate extract and the washing solution, and evaporate the ethyl acetate with a rotary evaporator to obtain an epoxy resin recovery.

[0035] Take 50g of glass fiber powder, reclaim 3g of epoxy resin, add it to 230mL of 9% (by weight) propanol solution of hexamethylenediamine, heat at 60°C for 6 hours, filter to obtain glass fiber ball bundles, and then glass The fiber ball bundles were added to 150mL of 4M nitric acid, heated at 50°C for 3 hours, filtered and dried.

Embodiment 3

[0037] The waste printed circuit boards are crushed and sorted to collect non-metallic powder. Take 120g of non-metallic powder and add it to 720mL of 6mol / L nitric acid and sulfuric acid solution (4:1 by volume), heat at 83°C for 12 hours, filter, extract the filtrate with butyl acetate, and wash the solid with butyl acetate to obtain glass fiber powder ; Merge the butyl acetate extract and the washing solution, and evaporate the butyl acetate with a rotary evaporator to obtain an epoxy resin recovery.

[0038] Take 50g of glass fiber powder, reclaim 0.5g of epoxy resin, add it to 200mL of 15% (by weight) methanol solution of ethylenediamine, heat at 60°C for 6 hours, filter to obtain glass fiber ball bundles, and then The fiber ball bundles were added to 150mL of 4M nitric acid and phosphoric acid solution (3:1 by volume), heated at 60°C for 10 hours, filtered and dried.

[0039] In summary, in the present invention, the waste printed circuit board is crushed and sorted and...

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Abstract

The invention discloses a glass fiber ball bundle and a preparation method thereof. The preparation method comprises the following steps: 1, grinding and sorting waste printed circuit boards so as to obtain nonmetallic powder; 2, adding the nonmetallic powder into an inorganic acid, and reacting at the temperature of 50-95 DEG C for 8-40 hours; 3, filtering, and respectively collecting glass fiber powder solids and filtrate; 4, extracting the filtrate with an extraction agent so as to obtain the recycled epoxy resin; and 5, adding the glass fiber powder and the recycled epoxy resin into an organic amine solution while stirring according to a weight ratio of 100:(0.1-10), reacting at the temperature of 40-80 DEG C for 0.5-30 hours, and filtering, thereby obtaining the glass fiber ball bundle. According to the method disclosed by the invention, harm of the glass fiber powder on the human body in the process of recovering, treating and reutilizing the glass fibers is avoided, the recycled glass fiber ball bundle can serve as a carrier of catalysts, nanometer materials and other materials and can be directly prepared into a composite material, the condition that the performance is reduced due to a high temperature in the extrusion pelletizing process is avoided, and the glass fiber ball bundle has excellent application prospects.

Description

technical field [0001] The invention relates to the recovery of glass fibers in non-metallic powder of waste printed circuit boards, in particular to a glass fiber ball bundle and a preparation method thereof. Background technique [0002] Printed Circuit Boards (PCB for short) are the most basic components of electronic products and the basis for the interconnection of various components in electronic products. Common household appliances in our daily life are mainly televisions, washing machines, refrigerators, air conditioners and computers. In recent years, these household appliances have entered the peak period of elimination and scrapping. These appliances contain a large number of printed circuit boards. As the number of discarded household appliances continues to increase, the amount of discarded PCBs also increases year by year. [0003] In addition to electronic waste, another source of discarded PCBs is the scraps and substandard products generated during the P...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B26/14
CPCC04B26/14C04B24/02C04B24/121C04B14/42
Inventor 管传金陶阳张宏伟程丛宇
Owner SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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