Halogen-free thermosetting resin composition and prepreg and printed circuit laminate employing halogen-free thermosetting resin composition
A resin composition, thermosetting technology, used in synthetic resin layered products, applications, electronic equipment, etc., can solve the problem of low peel strength, interlayer adhesion and bending strength, which cannot meet the requirements of high frequency and high speed copper clad substrates , difficult processing and other problems, to achieve the effects of good processability, fast curing reaction rate and excellent dielectric properties
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[0082] The technical solutions of the present invention will be further described below through specific embodiments.
[0083] The following description is the specific implementation of the embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the embodiment of the present invention, some improvements and modifications can also be made. These improvements And retouching are also regarded as the scope of protection of the embodiments of the present invention.
[0084] The embodiments of the present invention will be further described below in several embodiments. Embodiments of the present invention are not limited to the following specific examples. Appropriate changes can be made without changing the scope of the claims.
[0085] 1. Redistribution of polyphenylene ether
[0086] Stir and heat 4000g of toluene in a three-necked flask equipped with a stirrer, condensing reflux tube ...
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