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Halogen-free thermosetting resin composition and prepreg and printed circuit laminate employing halogen-free thermosetting resin composition

A resin composition, thermosetting technology, used in synthetic resin layered products, applications, electronic equipment, etc., can solve the problem of low peel strength, interlayer adhesion and bending strength, which cannot meet the requirements of high frequency and high speed copper clad substrates , difficult processing and other problems, to achieve the effects of good processability, fast curing reaction rate and excellent dielectric properties

Inactive Publication Date: 2017-09-19
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] CN101796132A discloses the use of cyanate ester, epoxy resin, polyphenylene ether resin and bromine-containing flame retardant to blend to obtain a copper-clad laminate with heat resistance, good dielectric properties, and low CTE, but it is a bromine-containing flame-retardant; patent Disclosed in CN103694642A adopts epoxy resin, cyanate compound or / and cyanate prepolymer, polyphosphonate or / and phosphonate-carbonate copolymer to prepare the non-conductive material with good dielectric performance and heat and humidity resistance. Halogen UL94V-0 is flame retardant, but its peel strength, interlayer adhesion and bending strength are low
Although the above resins have good dielectric properties, they all have defects such as difficult processing, poor heat resistance, and poor peel strength, which cannot meet the requirements of high-frequency and high-speed copper clad substrates.

Method used

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  • Halogen-free thermosetting resin composition and prepreg and printed circuit laminate employing halogen-free thermosetting resin composition
  • Halogen-free thermosetting resin composition and prepreg and printed circuit laminate employing halogen-free thermosetting resin composition
  • Halogen-free thermosetting resin composition and prepreg and printed circuit laminate employing halogen-free thermosetting resin composition

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Embodiment Construction

[0082] The technical solutions of the present invention will be further described below through specific embodiments.

[0083] The following description is the specific implementation of the embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the embodiment of the present invention, some improvements and modifications can also be made. These improvements And retouching are also regarded as the scope of protection of the embodiments of the present invention.

[0084] The embodiments of the present invention will be further described below in several embodiments. Embodiments of the present invention are not limited to the following specific examples. Appropriate changes can be made without changing the scope of the claims.

[0085] 1. Redistribution of polyphenylene ether

[0086] Stir and heat 4000g of toluene in a three-necked flask equipped with a stirrer, condensing reflux tube ...

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Abstract

The invention relates to a halogen-free thermosetting resin composition and a prepreg and a printed circuit laminate employing the halogen-free thermosetting resin composition. An organic condensate of the halogen-free thermosetting resin composition comprises the ingredients in parts by weight (based on 100 parts): (A) 5-50 parts of cyanate resin; (B) 5-40 parts of polyphenylether resin; (C) 5-30 parts of phosphoric bisphenol polymer; (D) 30-60 parts of halogen-free epoxy resin. The prepreg and the printed circuit laminate made from the halogen-free thermosetting resin composition, provided by the invention, have high glass transition temperature, excellent dielectric properties, low water absorption rate, high heat resistance, high peel strength, excellent humidity resistance and good process processability, can achieve no halogen and flame retardance and reaches UL94 V-0.

Description

technical field [0001] The invention relates to a halogen-free thermosetting resin composition, and also relates to a prepreg and a printed circuit laminate made of the halogen-free thermosetting resin composition. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08G59/62C08L63/00C08K5/5399C08K3/36B32B27/38B32B15/092B32B15/08B32B15/098B32B27/42B32B27/02
CPCC08G59/40C08L63/00C08L85/02C08G59/4014B32B15/08B32B15/092B32B15/098B32B27/38B32B27/42B32B2260/04B32B2260/046B32B2266/0271B32B2266/0285B32B2270/00B32B2305/07B32B2307/204B32B2307/306B32B2307/3065B32B2457/08C08G59/4007C08G59/62C08K3/36C08K5/5398C08K2201/003C08L2201/02C08L2201/08C08L2201/22
Inventor 罗成唐国坊
Owner GUANGDONG SHENGYI SCI TECH
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