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Epoxy based silicon tackifier and organosilicon conductive insulating gel prepared from same

An epoxy-based organosilicon, thermally conductive and insulating technology, applied in the direction of adhesives, etc., can solve the problems of affecting the light output performance of heat-resistant devices, poor mechanical properties of thermally conductive insulating adhesives, poor bonding performance, etc., to solve the problem of yellowing and blackening, excellent bonding performance, good compatibility

Inactive Publication Date: 2017-06-09
FOSHAN CENT FOR FUNCTIONAL POLYMER MATERIALS & FINE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, silicone-based heat-conducting insulating adhesives have the problems of poor mechanical properties and poor bonding performance. As mentioned in CN201410035224 and CN200910251588, CN201410035224 needs to add titanate as a tackifier to increase the gap between the chip and the bracket. The cohesive strength of this organic silica gel synthesized in CN200910251588 requires low temperature
There may be a phase separation problem between the tackifier and the matrix resin, which indirectly affects the heat resistance and light output performance of the device
The storage conditions require low temperature, which is also a big problem for energy consumption.

Method used

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  • Epoxy based silicon tackifier and organosilicon conductive insulating gel prepared from same
  • Epoxy based silicon tackifier and organosilicon conductive insulating gel prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1. Add 4.924g (20mmol) of 3-(methacryloyloxy)propyltrimethoxysilane and 20ml solvent DMF into a three-necked flask, and add 4.728g (20mol) of γ-glycidyl etheroxypropyltrimethoxysilane After mixing with 5ml of DMF, drop it into a three-neck flask with a constant pressure dropping funnel at 40°C, and drop in diluted 0.3g of HCl at the same time. After the dropwise addition was completed, the temperature was raised to 60° C., and the reaction was carried out for 12 hours. Wash until neutral, dry for 12 hours to get the prepolymer epoxy-based silicone tackifier, recorded as 2K-1.

[0028] 2. Mix 1.2g of tackifier 2K-1 with 1.5g of vinyl silicone oil (vinyl content = 0.6%), 2.5g of hydrogen-containing silicone oil and 1.0g of 0.5umAlN in a beaker, then add 0.06g of The Karstedt catalyst with a Pt content of 3000ppm is placed in a vacuum drying oven at room temperature for 30 minutes, poured into a polytetrafluoroethylene mold, pre-cured at 90°C for 1 hour, and then heated t...

Embodiment 2

[0031] 1. Add 4.924g (20mmol) of 3-(methacryloyloxy)propyltrimethoxysilane and 20ml of solvent DMF into a three-necked flask, and add 5.568g (20mol) of γ-(2,3-glycidoxy ) Propyltriethoxysilane was mixed with 5ml of DMF and added dropwise into a three-neck flask with a constant pressure dropping funnel at 40°C, and at the same time, 0.3g of diluted HCl was added dropwise. After the dropwise addition was completed, the temperature was raised to 60° C., and the reaction was carried out for 12 hours. Wash until neutral and dry for 14 hours to obtain the prepolymer as epoxy-based silicone tackifier, marked as 3K-1.

[0032] 2. Mix 1.2g of tackifier 3K-1 with 1.5g of vinyl silicone oil (vinyl content = 0.6%), 2.5g of hydrogen-containing silicone oil and 1.0g of 0.5μm AlN in a beaker, then add 0.06g of The Karstedt catalyst with a Pt content of 3000ppm is placed in a vacuum drying oven at room temperature for 30 minutes, poured into a polytetrafluoroethylene mold, pre-cured at 90°C ...

Embodiment 3

[0035] 1. Add 5.764g (20mmol) of 3-(methacryloyloxy)propyltriethoxysilane and 20ml of solvent DMF into a three-necked flask, and add 5.568g (20mol) of γ-(2,3-glycidyloxypropoxy Base) propyltriethoxysilane was mixed with 5ml of DMF and added dropwise into a three-neck flask with a constant pressure dropping funnel at 40°C, and at the same time, 0.3g of diluted HCl was added dropwise. After the dropwise addition was completed, the temperature was raised to 60° C., and the reaction was carried out for 12 hours. Wash until neutral and dry for 16 hours to obtain the prepolymer as epoxy-based silicone tackifier, marked as 4K-1.

[0036] 2. Mix 1.2g of tackifier 4K-1 with 1.5g of vinyl silicone oil (vinyl content = 0.6%), 2.5g of hydrogen-containing silicone oil and 1.0g of 0.5umAlN in a beaker, then add 0.06g of The Karstedt catalyst with a Pt content of 3000ppm is placed in a vacuum drying oven at room temperature for 30 minutes, poured into a polytetrafluoroethylene mold, pre-cur...

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Abstract

The invention discloses an epoxy based silicon tackifier and organosilicon conductive insulating gel prepared from the same. The tackifier is formed by hydrolytic condensation of vinyl siloxane and expoxy-based siloxane under the acidic condition, and the organosilicon conductive insulating gel is obtained by mixing the tackifier with vinyl silicone oil, a catalyst, hydrogen contained silicon oil and a thermal conductive filler and subjecting the mixture to stirring, vacuum defoaming, warming and curing. Epoxy groups are introduced to a hydrogen silicon oil contained side chain through hydrosilylation, the problem about poor compatibility of the former tackifier and matrix resin is solved, shortcomings that a traditional epoxy resin based material is poor in thermal resistance and prone to yellowing and aging are overcome by applying the tackifier to preparation of the organosilicon conductive insulating gel, and the prepared organosilicon conductive insulating gel has the advantages of good thermal resistance, high mechanical strength and good adhesiveness.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lighting, and in particular relates to the preparation of an epoxy-based organosilicon tackifier and the prepared organosilicon heat-conducting and insulating glue. Background technique [0002] At present, only epoxy and silicone are used as bonding materials between the chip and the substrate. Epoxy has good adhesion, chemical corrosion resistance and excellent mechanical properties. However, it is found that the epoxy system will gradually turn yellow and blacken during use, which significantly reduces the light output efficiency and affects the reliability requirements of the entire device. [0003] In order to solve these problems, many companies such as Dow Corning in the United States, Shin-Etsu in Japan, and Marunouchi have studied the use of silicone to replace traditional epoxy materials. Because silicone has good heat resistance and anti-ultraviolet performance, it can meet the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/20C08G77/06C09J183/05C09J183/07
CPCC08G77/20C08G77/06C08L2205/025C08L2205/03C09J183/04C08L83/04
Inventor 庞浩莫文蔚廖兵黄健恒雍奇文赵阳阳
Owner FOSHAN CENT FOR FUNCTIONAL POLYMER MATERIALS & FINE CHEM
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