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Epoxy resin composition and cured product thereof

A technology of epoxy resin and composition, which can be used in electric solid devices, chemical instruments and methods, semiconductor/solid device parts, etc., can solve the problems of limited use of solvent-soluble varnishes and no flame retardancy, etc. Achieve the effect of good solvent solubility, low dielectric constant and low dielectric loss tangent

Active Publication Date: 2017-05-31
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, these triazine ring-containing phenolic resins exhibit good flame retardancy when combined with phosphorus-based flame retardants, etc., but do not exhibit good flame retardancy when additive-based flame retardants and flame-retardant auxiliary agents are not used in combination. full flame retardancy
In addition, in recent years, the frequency of electronic components tends to be significantly increased. For insulating materials such as semiconductor sealing materials, copper-clad laminates, and laminated films, resin materials with lower dielectric constants and dielectric loss tangents are required. As a result, , the aforementioned phenolic resins containing triazine rings did not fully meet the required level
[0006] In addition, a method of using o-cresol as a phenol in the synthesis of the above-mentioned triazine ring-containing phenolic resin is also disclosed. Although this method contributes to lowering the dielectric constant, it has problems in terms of solvent solubility and has been affected by varnish. Problems such as limitation of use

Method used

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  • Epoxy resin composition and cured product thereof
  • Epoxy resin composition and cured product thereof
  • Epoxy resin composition and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0136] Next, this invention is demonstrated more concretely based on an Example and a comparative example, Hereinafter, "part" and "%" are a mass basis.

[0137]

[0138] Measured under the following conditions.

[0139] Measuring device: "HLC-8320GPC" manufactured by Tosoh Corporation,

[0140] Column: Guard column "HXL-L" manufactured by Tosoh Corporation

[0141] + "TSK-GEL G2000HXL" manufactured by Tosoh Corporation

[0142] + "TSK-GEL G2000HXL" manufactured by Tosoh Corporation

[0143] + "TSK-GEL G3000HXL" manufactured by Tosoh Corporation

[0144] + "TSK-GEL G4000HXL" manufactured by Tosoh Corporation

[0145] Detector: RI (differential refraction) detector

[0146] Data processing: "EcoSEC-WS Version 1.12" manufactured by Tosoh Corporation

[0147] Determination conditions: column temperature 40°C

[0148] Developing solvent Tetrahydrofuran

[0149] Flow rate 1.0ml / min

[0150] Standard: In accordance with the measurement manual of the aforementioned "EcoSEC-W...

Synthetic example 1

[0159] Add 883 parts of p-tert-butylphenol, 88 parts of melamine, 253 parts of 41.5% formalin, and 1.8 parts of triethylamine into a flask equipped with a thermometer, a condenser tube, a fractionating tube, and a stirrer, and pay attention to the heat release. Slowly raise the temperature to 100°C. After making it react at 100 degreeC under reflux for 2 hours, it heated up to 130 degreeC over 3 hours under normal pressure, removing water. Then, it was made to react under reflux for 2 hours, and then it heated up to 150 degreeC over 1 hour, removing water under normal pressure. Furthermore, it was made to react under reflux for 2 hours, and then it heated up to 180 degreeC over 2 hours, removing water under normal pressure. Next, unreacted p-tert-butylphenol was removed under reduced pressure to obtain a phenol resin (B-1). The GPC chart of gained phenolic resin (B-1) is shown in figure 1 . Based on the GPC chart, the content of the bifunctional compound represented by th...

Synthetic example 2

[0161] In Synthesis Example 1, 438 parts of p-tert-butylphenol, 63 parts of melamine, 106 parts of 41.5% formalin, and 1.8 parts of triethylamine were changed, and the phenolic resin was obtained by the same operation as Synthesis Example 1. (B-2). The GPC chart of gained phenolic resin (B-2) is shown in figure 2 . Based on the GPC chart, the content of the bifunctional compound represented by the structural formula (III) was 8.4%, and Mw / Mn was 1.42.

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Abstract

In the present invention, a triazine ring-containing phenolic resin, which is obtained by reacting melamine, a para-alkylphenol, and formalin, is used in order to provide an epoxy resin composition which imparts a cured product with excellent flame retardancy, exhibits excellent dielectric properties such as low dielectric loss tangent and low dielectric constant, and also exhibits excellent thermal conductivity, a cured product of the epoxy resin composition, and the following which use the expoxy resin composition: a prepreg; a circuit board; a build-up film; a build-up substrate; a semiconductor sealing material; a semiconductor device; a fiber-reinforced composite material; a molded article; and the like.

Description

technical field [0001] The present invention relates to an epoxy resin composition that exhibits excellent flame retardancy and heat resistance in a cured product, and provides excellent dielectric properties such as low dielectric loss tangent and low dielectric constant, and further provides excellent thermal conductivity. Background technique [0002] As circuit board materials for electronic equipment, thermosetting resins such as epoxy resins, benzoxazine resins, and BT (bismaleimide-triazine) resins are impregnated into glass cloth and dried by heating. The obtained prepreg is a laminate obtained by heating and curing the prepreg, and a multilayer board obtained by combining the laminate and the prepreg and heating and curing the laminate. [0003] In recent years, in these various applications, especially advanced material applications, further improvements in performance represented by heat resistance, dielectric properties, and moisture resistance reliability have b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G14/10C08G59/62C08J5/24H01L23/14H01L23/29H01L23/31H05K1/03
CPCH01L23/14H01L2924/0002H01L23/293H05K1/0346C08J2461/34C08L61/34C08G59/64C08G14/10C08J2363/04C09K5/14C09K21/14H05K1/0326C08J5/244H01L2924/00C08L63/00C08L63/04C08G59/62H01L23/29H01L23/31H05K1/0366C08J2361/28C08J2461/28C08J2463/04C08L61/28C08L2201/02C08L2201/08H01L23/295H05K3/005H05K3/18H05K3/42
Inventor 有田和郎冈本竜也矢本和久佐藤泰
Owner DIC CORP
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