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A kind of ultraviolet curing pressure-sensitive adhesive and preparation method thereof

A technology of ultraviolet light and curing pressure, applied in adhesives, non-polymer organic compound adhesives, adhesive additives, etc., can solve the problem of slow drying and film formation, poor heat resistance, and restrictions on the large-scale development and application of HMPSA, etc. problems, achieve the effect of reducing energy waste and fast cross-linking speed

Active Publication Date: 2020-09-08
宁波卓胜新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, although hot-melt pressure-sensitive adhesive (HMPSA) has been applied in many fields, its heat resistance is poor, and its solvent resistance is not satisfactory, and the limitation of its raw materials also limits the large-scale development of HMPSA. And applications, and its related products are currently only limited to the fields of book binding, decoration bonding, etc.
[0005] Water-emulsion-type acrylate pressure-sensitive adhesives are currently developing rapidly because they do not contain organic solvents, but their drying rate is very slow, and the appearance of the finished product is worse than that of solvent-type pressure-sensitive adhesives. larger

Method used

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  • A kind of ultraviolet curing pressure-sensitive adhesive and preparation method thereof

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Effect test

Embodiment 1

[0026] In every 100 mass parts raw material liquid: butyl acrylate: 24.2g, isooctyl acrylate: 8g, neopentyl glycol diacrylate: 10g, pentaerythritol triacrylate: 12g, acrylate polyol (hydroxyl value 18mgKOH / g ): 40 g, 200 nm fumed silica: 3 g, hydroxycyclohexyl phenyl ketone: 2 g, γ-(methacryloyloxy)propyltrimethoxysilane: 0.8 g.

[0027] The preparation method is:

[0028] Under the conditions of avoiding sunlight and relative air humidity of less than 60%, add the above-mentioned substances into the mixing tank in turn, stir for 30 minutes, and then filter and remove impurities with a polypropylene filter element with a pore size of 0.1 μm to obtain a raw material mixture for later use. .

[0029] Then the prepared raw material mixture is coated on the PET film substrate by slit extrusion coating method, and the irradiation energy of the ultraviolet high-pressure mercury lamp is 800mJ / cm 2 After being irradiated for 15s, it is cured to form a layer of pressure-sensitive adh...

Embodiment 2

[0031] In every 100 parts by mass of raw material liquid: butyl acrylate: 30g, ethylene glycol diacrylate: 12g, trimethylolpropane pentaerythritol triacrylate: 6g, polyurethane acrylate (hydroxyl value 18mgKOH / g): 46.2g, 200 nm fumed silica: 3 g, hydroxycyclohexyl phenyl ketone: 2 g, γ-(methacryloyloxy)propyltrimethoxysilane: 0.8 g.

[0032] The preparation method is:

[0033] Under the conditions of avoiding sunlight and relative air humidity less than 60%,

[0034] The above-mentioned substances were sequentially added into the mixing tank, stirred for 30 minutes, and then filtered through a polypropylene filter element with a pore size of 0.1 μm to remove impurities to obtain a raw material mixture, which was set aside.

[0035] Then the prepared raw material mixture is coated on the PET film substrate by slit extrusion coating method, and the irradiation energy of the ultraviolet high-pressure mercury lamp is 800mJ / cm 2 After being irradiated for 15s, it is cured to form...

Embodiment 3

[0037] In every 100 parts by mass of raw material liquid: butyl acrylate: 25g, vinyl acetate: 16g, ethylene glycol diacrylate: 7g, trimethylolpropane pentaerythritol triacrylate: 8g, polyurethane acrylate (hydroxyl value 18mgKOH / g): 35.2 g, 200 nm fumed silica: 5 g, hydroxycyclohexyl phenyl ketone: 3 g, γ-(methacryloyloxy)propyltrimethoxysilane: 0.8 g.

[0038] The preparation method is:

[0039] Under the conditions of avoiding sunlight and relative air humidity of less than 60%, add the above-mentioned substances into the mixing tank in turn, stir for 30 minutes, and then filter and remove impurities with a polypropylene filter element with a pore size of 0.1 μm to obtain a raw material mixture for later use. .

[0040] Then the prepared raw material mixture is coated on the PET film substrate by slit extrusion coating method, and the irradiation energy of the ultraviolet high-pressure mercury lamp is 800mJ / cm 2 After being irradiated for 15s, it is cured to form a layer ...

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Abstract

The invention relates to an ultraviolet curing pressure-sensitive adhesive and a preparation method thereof. The ultraviolet curing pressure-sensitive adhesive comprises the following raw material components in parts by weight: 20-60 parts of an acrylic compound, 35-80 parts of a hydroxyl-containing oligomer, 1-5 parts of fumed silica, 0.1-3 parts of a photoinitiator and 0.2-1 part of a coupling agent. The preparation method comprises the following steps: mixing the raw materials, coating a film substrate, and curing, thereby obtaining the ultraviolet curing pressure-sensitive adhesive. The ultraviolet curing pressure-sensitive adhesive provided by the invention is free of solvent, and cross-linking curing can be resulted under radiation of ultraviolet rays, so that the cohesion, the solvent resistance, the thermal resistance, the adhesion property and the like of the adhesive can be all ensured, the cross-linking velocity is rapid, a great deal of energy can be saved when being compared with that of thermal curing, and meanwhile no organic solvent can be discharged.

Description

technical field [0001] The invention belongs to the field of pressure-sensitive adhesive materials and preparation thereof, in particular to an ultraviolet light-curable pressure-sensitive adhesive and a preparation method thereof. Background technique [0002] Pressure-sensitive adhesive (PSA) is a widely used adhesive material. This material has self-adhesiveness, can quickly contact and wet the bonding surface under pressure, and rely on intermolecular interaction to generate adhesion. Due to its excellent convenience, pressure-sensitive adhesives have not only been widely used in bonding occasions such as labels, tapes, automotive interiors, packaging, and fixing, but also in high-end fields with strict requirements such as aerospace and electronic communications. emphasized. [0003] As environmental protection requirements become more and more intense, it is an industry trend to develop non-polluting adhesive products that comply with relevant environmental protection...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J11/04C09J11/06
CPCC09J4/00C09J11/04C09J11/06
Inventor 方振华任忠平杨安康
Owner 宁波卓胜新材料有限公司
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