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Polyamide-imide with indan structure and preparation method of polyamide-imide

A technology of polyamide and imide, which is applied in the field of polyamideimide resin containing indane structure and its preparation, can solve the problems of difficult processing of large-sized parts and high porosity of parts, and achieve the reduction of bulk density and interaction Function, excellent solubility, and the effect of increasing flexibility

Active Publication Date: 2017-05-31
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solubility of the imidized imide resin in organic solvents is far lower than the process requirements, so when preparing prepregs, the form of amic acid is often used for high-temperature curing molding, but the resin will be in the process of thermal imidization. The production of small molecular products such as water causes problems such as high porosity of the parts, making it difficult to process large-sized parts, which is also a very important reason for the limited application of polyimide

Method used

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  • Polyamide-imide with indan structure and preparation method of polyamide-imide
  • Polyamide-imide with indan structure and preparation method of polyamide-imide
  • Polyamide-imide with indan structure and preparation method of polyamide-imide

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Embodiment 1

[0048] The synthesis of embodiment 1 trimellitic anhydride acid chloride (TMAC)

[0049]Add 38g (0.2mol) of trimellitic anhydride and 100ml of thionyl chloride into a three-necked flask equipped with a condensing device and an exhaust gas absorption device, add 1-2 drops of DMF dropwise, heat and reflux at 70°C for 7 hours, and the reaction solution turns into a yellow clear liquid , After distilling off excess thionyl chloride under reduced pressure, a white crystalline solid was obtained after static recrystallization, and a synthetic product was obtained after vacuum drying for 12 hours. m.p.: 66-68°C.

[0050] Infrared analysis of the product see figure 1 , the result of characterization is as follows:

[0051]

Embodiment 2

[0052] Example 2 Synthesis of 5(6)-nitro-1-(4-nitrophenyl)-1,3,3-trimethylindane (PIDN)

[0053] In a three-necked flask equipped with mechanical stirring, 18.9 g (0.08 mol) of 1,3,3-trimethyl-1-phenylindane was dissolved in 60 ml of dichloromethane, and placed in an ice bath at 0-5 ° C, Slowly add a mixed acid solution with a ratio of 33ml of concentrated sulfuric acid and 14.5ml of concentrated nitric acid dropwise, and determine the end point of the reaction by TCL analysis. After the reaction was completed, the organic layer was separated and kept, washed with saturated sodium carbonate solution to neutrality, then washed with saturated sodium chloride solution, anhydrous MgSO 4 Dry, concentrate under reduced pressure to obtain a brown oily liquid, add petroleum ether, stir at low temperature to precipitate a solid, recrystallize from absolute ethanol, and the yield is 83%. mp: 110-120°C.

[0054] See the NMR spectrum figure 2 , 1 H-NMR (CDCl 3 ,TMS,500MHz), δ:8.25-7...

Embodiment 3

[0055] Example 3 Synthesis of 5(6)-amino-1-(4-aminophenyl)-1,3,3-trimethylindane (PIDA)

[0056] In a 250ml three-necked flask equipped with mechanical stirring and nitrogen gas, dissolve 6g of PIDN in 120ml of absolute ethanol, heat up to 80°C, add 0.3g of Pd / C, slowly add 29ml of 80% hydrazine hydrate solution dropwise, and react for 7 hours Add 0.4g of activated carbon, filter while hot after 1h, concentrate the filtrate under reduced pressure to obtain a brown oily liquid, dissolve in 50ml of 2mol / L dilute hydrochloric acid, stir at room temperature until completely dissolved, extract with ethyl acetate, remove the organic layer, and use Saturated NaOH solution adjusted the pH to alkaline, extracted with ethyl acetate, and concentrated under reduced pressure to obtain a brown oil, which was poured into continuously stirring water to obtain a light brown solid with a yield of 63.7%. mp: 77-98°C.

[0057] 1 H-NMR (CDCl 3 , TMS, 500MHz), δ: 7.13-6.89(m, 3H), 6.70-6.43(m, 4...

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Abstract

The invention provides polyamide-imide with an indan structure. The polyamide-imide has a structural formula as shown in the specification, and in the formula, n is from 1 to 8. The invention further discloses a material which is prepared after the polyamide-imide with the indan structure is cured at 220-380 DEG C, and a preparation method of the polyamide-imide with the indan structure. The invention studies the synthesis and the properties of polyamide-imide, thermal-curing polyamide-imide of different polymerization degrees is prepared from 5(6)-amino-1-(4-amino phenyl)-1,3,3-trimethyl indan as monomers, then the stacking density and the interaction of molecular chains can be reduced, the flexibility of the molecular chains can be improved, and finally polyamide-imide resin which is excellent in solubleness and excellent in thermal resistance can be synthesized.

Description

technical field [0001] The invention belongs to the field of organic polymer compounds, and in particular relates to a polyamideimide resin containing an indane structure and a preparation method thereof. Background technique [0002] Aromatic thermosetting polyimide (PI) resins are widely used in various fields due to their excellent thermal stability and high-temperature mechanical properties. However, the solubility of the imidized imide resin in organic solvents is far lower than the process requirements, so when preparing prepregs, the form of amic acid is often used for high-temperature curing molding, but the resin will be in the process of thermal imidization. The production of small molecule products such as water causes problems such as high porosity of the parts, making the processing of large-sized parts difficult, which is also a very important reason for the limited application of polyimide. Therefore, the development of polyimides that are soluble and fusible...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D209/48
CPCC07D209/48
Inventor 陈功李春雨
Owner BEIHANG UNIV
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