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Tin antimony solder alloy

A technology of solder alloys and raw materials, applied in the field of tin-antimony solder alloys, can solve problems such as application limitations, achieve the effects of improving stability, reducing solder temperature, and improving shear resistance

Inactive Publication Date: 2017-05-10
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Sn-Sb solder has a relatively high eutectic melting point of 234-240°C, which is higher than that of the traditional Sn-37Pb solder alloy (183°C), which greatly limits its application.

Method used

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  • Tin antimony solder alloy

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A tin-antimony solder alloy, calculated by weight percentage, comprising the following raw materials:

[0018] 12% of antimony, 2.4% of silver, 6% of zinc, 0.6% of nanometer ferric oxide particles, 0.06% of vanadium and 0.004% of Pr, and the balance is tin. The particle size of the nanometer ferric oxide particles is 50nm.

[0019] Preparation:

[0020] According to the Sb, Ni, Zn, nano-Fe in the present embodiment 2 o 3 , V, weight percentage of Pr and Sn Weigh the required raw materials, add them into the furnace, then heat up to 500°C to melt, start timing after complete melting, and keep warm for 120min. During this period, stir with a ceramic rod every 10 minutes to fully homogenize the alloy components. Two hours later, take the hot crucible out of the furnace, put it in air to cool down to room temperature (20° C.), and then take it out from the crucible to obtain the tin-antimony solder alloy of the present invention.

Embodiment 2

[0022] A tin-antimony solder alloy, calculated by weight percentage, comprising the following raw materials:

[0023] 14% of antimony, 2.8% of silver, 6% of zinc, 0.4% of nanometer ferric oxide particles, 0.03% of vanadium and 0.003% of Dy, and the balance is tin. The particle size of the nanometer ferric oxide particles is 10nm.

[0024] According to the Sb, Ni, Zn, nano-Fe in the present embodiment 2 o 3 , weight percent of V, Dy and Sn Weigh the required raw materials, add them into the furnace, then heat up to 480°C to melt, start timing after complete melting, and keep warm for 120min. During this period, stir with a ceramic rod every 10 minutes to fully homogenize the alloy components. Two hours later, take the hot crucible out of the furnace, put it in air to cool down to room temperature (20° C.), and then take it out from the crucible to obtain the tin-antimony solder alloy of the present invention.

Embodiment 3

[0026] A tin-antimony solder alloy, calculated by weight percentage, comprising the following raw materials:

[0027] 10% of antimony, 3.0% of silver, 8% of zinc, 0.8% of nanometer ferric oxide particles, 0.1% of vanadium and 0.006% of Nd, and the balance is tin. The particle size of the nanometer ferric oxide particles is 10nm.

[0028] The preparation method of the low-melting-point lead-free solder in this embodiment is the same as the method described in Embodiment 1, the only difference is that the weight percentages of the components of the lead-free solder alloy are weighed according to the proportions in this embodiment.

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Abstract

The invention provides a tin antimony solder alloy. The alloy is prepared from, by weight, 10-16% of antimony, 2.0-3.0% of silver, 5-8% of zinc, 0.3-0.8% of nanometer ferric oxide granule, 0.02-0.1% of vanadium and 0.002-0.006% of RE, the balance being tin. The solder alloy not only possesses very low melting point, but also possesses excellent wetting property and anti-cut property.

Description

technical field [0001] The invention belongs to the technical field of welding materials, and in particular relates to a tin-antimony solder alloy. Background technique [0002] Sn-Pb solder has been used in the electronics industry for quite a long time. Due to its low melting point, high cost performance and easy availability, it has become the most important low-temperature solder system and is widely used in non-ferrous metals, Welding of food containers, construction, machinery and piping installations, etc. However, with the advent of the information age, electronic products emerge in an endless stream. While these electronic products benefit mankind, the lead contained in them is also increasingly polluting the ecological environment and human health. The Chinese government also promptly formulated the "Administrative Measures for the Prevention and Control of Pollution Produced by Electronic Information Products", which was implemented in July 2006. [0003] The cu...

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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