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Low-melting-point lead-free solder alloy

A technology of lead-free solder alloy and low melting point, which is applied in welding/cutting medium/material, welding medium, welding equipment, etc. It can solve the problems of thermal fatigue resistance, poor ductility, insufficient welding reliability, limited promotion and application, etc. Achieve good wettability, good wetting performance and shear resistance, and improve the effect of shear resistance

Inactive Publication Date: 2017-05-10
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the poor thermal fatigue resistance and ductility of SnBi eutectic solder, its welding reliability is insufficient and wire processing is difficult, which limits its further promotion and application.

Method used

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  • Low-melting-point lead-free solder alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A lead-free solder alloy with a low melting point, calculated by weight percentage, comprising the following raw materials:

[0019] 20% of bismuth, 1.2% of silver, 0.6% of nanometer ferric oxide particles, 0.08% of vanadium, and the balance is tin.

[0020] Preparation:

[0021] According to Bi, Ag, nanometer Fe in the present embodiment 2 o 3 , weight percent of V and Sn Weigh the required raw materials, add them into the furnace, then heat up to 600°C to melt, start timing after complete melting, and keep warm for 120min. During this period, stir with a ceramic rod every 10 minutes to fully homogenize the alloy components. Two hours later, the hot crucible was taken out of the furnace, cooled to room temperature (20° C.) in the air, and then taken out from the crucible to obtain the low melting point lead-free solder alloy of the present invention.

Embodiment 2

[0023] A lead-free solder alloy with a low melting point, calculated by weight percentage, comprising the following raw materials:

[0024] 22% of bismuth, 1.2% of silver, 0.7% of nanometer ferric oxide particles, 0.0004% of Co and 0.08% of vanadium, and the balance is tin.

[0025] According to Bi, Ag, nanometer Fe in the present embodiment 2 o 3 , V, Co and Sn weight percentages Weigh the required raw materials, add them into the furnace, and then heat up to 600 ° C to melt, start timing after complete melting, and then keep warm for 120 minutes. During this period, stir with a ceramic rod every 10 minutes to fully homogenize the alloy components. Two hours later, the hot crucible was taken out of the furnace, cooled to room temperature (20° C.) in the air, and then taken out from the crucible to obtain the low melting point lead-free solder alloy of the present invention.

Embodiment 3

[0027] A lead-free solder alloy with a low melting point, calculated by weight percentage, comprising the following raw materials:

[0028] 10% of bismuth, 1.8% of silver, 0.8% of nanometer ferric oxide particles, 0.0005% of Co and 0.1% of vanadium, and the balance is tin.

[0029] The preparation method of the low melting point lead-free solder in this embodiment is the same as the method described in embodiment 2, the only difference is that the weight percentages of the components of the lead-free solder alloy are weighed according to the proportions in this embodiment.

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Abstract

The invention provides low-melting-point lead-free solder alloy. The low-melting-point lead-free solder alloy comprises, by weight, 10%-30% of bismuth, 0.6%-1.8% of silver, 0.3%-0.8% of nano iron sesquioxide particles, 0.02%-0.1% of vanadium and the balance tin. The low-melting-point lead-free solder alloy is very low in melting point, good in wetting performance and shearing resistance and low in silver content and cost.

Description

technical field [0001] The invention belongs to the technical field of soldering materials, in particular to a lead-free solder alloy with a low melting point. Background technique [0002] Sn-Pb solder has been used in the electronics industry for quite a long time. Due to its low melting point, high cost performance and easy availability, it has become the most important low-temperature solder system and is widely used in non-ferrous metals, Welding of food containers, construction, machinery and piping installations, etc. However, with the advent of the information age, electronic products emerge in an endless stream. While these electronic products benefit mankind, the lead contained in them is also increasingly polluting the ecological environment and human health. The Chinese government also promptly formulated the "Administrative Measures for the Prevention and Control of Pollution Produced by Electronic Information Products", which was implemented in July 2006. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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