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Low-melting-point tin bismuth solder alloy

A solder alloy, low melting point technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of thermal fatigue and poor ductility, limited promotion and application, insufficient welding reliability, etc. Good wettability, improve shear resistance, and ensure the effect of shear strength performance

Inactive Publication Date: 2017-05-10
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the poor thermal fatigue resistance and ductility of SnBi eutectic solder, its welding reliability is insufficient and wire processing is difficult, which limits its further promotion and application.

Method used

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  • Low-melting-point tin bismuth solder alloy

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A low-melting-point tin-bismuth solder alloy, calculated by weight percentage, comprises the following raw materials:

[0020] 20% bismuth, 2.4% titanium, 0.6% nanometer ferric oxide particles, 0.08% vanadium and 0.004% Pr, and the balance is tin. The particle size of the nanometer ferric oxide particles is 50nm.

[0021] Preparation:

[0022] According to Bi, Ti, nanometer Fe in the present embodiment 2 o 3 , V, weight percentage of Pr and Sn Weigh the required raw materials, add them into the furnace, then heat up to 600°C to melt, start timing after complete melting, and keep warm for 120min. During this period, stir with a ceramic rod every 10 minutes to fully homogenize the alloy components. After two hours, take the hot crucible out of the furnace, put it in air to cool down to room temperature (20° C.), and then take it out from the crucible to obtain the low melting point tin-bismuth solder alloy of the present invention.

Embodiment 2

[0024] A low-melting-point tin-bismuth solder alloy, calculated by weight percentage, comprises the following raw materials:

[0025] 23% bismuth, 2.6% titanium, 0.7% nanometer ferric oxide particles, 0.06% vanadium, 0.0003% Co and 0.005% Dy, and the balance is tin. The particle size of the nanometer ferric oxide particles is 10nm.

[0026] According to Bi, Ti, nanometer Fe in the present embodiment 2 o 3 , V, Co, Dy and Sn by weight Weigh the required raw materials, add them into the furnace, and then heat up to 600 ° C to melt, start timing after complete melting, and then keep warm for 120 minutes. During this period, stir with a ceramic rod every 10 minutes to fully homogenize the alloy components. After two hours, take the hot crucible out of the furnace, put it in air to cool down to room temperature (20° C.), and then take it out from the crucible to obtain the low melting point tin-bismuth solder alloy of the present invention.

Embodiment 3

[0028] A low-melting-point tin-bismuth solder alloy, calculated by weight percentage, comprises the following raw materials:

[0029] 10% bismuth, 3.0% titanium, 0.8% nanometer ferric oxide particles, 0.0005% Co, 0.006% Nd, 0.1% vanadium, and the balance is tin. The particle size of the nanometer ferric oxide particles is 10nm.

[0030] The preparation method of the low melting point lead-free solder in this embodiment is the same as the method described in embodiment 2, the only difference is that the weight percentages of the components of the lead-free solder alloy are weighed according to the proportions in this embodiment.

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Abstract

The invention provides low-melting-point tin bismuth solder alloy. The low-melting-point tin bismuth solder alloy is prepared from the following raw materials in percentages by weight: 10-30% of bismuth, 2.0-3.0% of titanium, 0.3-0.8% of nano iron sesquioxide particles, 0.02-0.1% of vanadium, 0.002-0.006% of RE and the balance of tin. The solder alloy not only has a very low melting point, but also has good wetting property and anti-shearing property.

Description

technical field [0001] The invention belongs to the technical field of welding materials, and in particular relates to a low melting point tin-bismuth solder alloy. Background technique [0002] Sn-Pb solder has been used in the electronics industry for quite a long time. Due to its low melting point, high cost performance and easy availability, it has become the most important low-temperature solder system and is widely used in non-ferrous metals, Welding of food containers, construction, machinery and piping installations, etc. However, with the advent of the information age, electronic products emerge in an endless stream. While these electronic products benefit mankind, the lead contained in them is also increasingly polluting the ecological environment and human health. The Chinese government also promptly formulated the "Administrative Measures for the Prevention and Control of Pollution Produced by Electronic Information Products", which was implemented in July 2006....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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