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An intelligent control system and control method based on a rolling-type thermoplastic resin light conversion body for laminating and encapsulating LEDs

An intelligent control system, thermoplastic resin technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low production efficiency of packaged LEDs, affected by thermal overstress, product consistency problems, etc., to improve light output efficiency and light output. Uniformity, improving the consistency of light and color, and the effect of flatness and thickness

Active Publication Date: 2018-03-02
JIANGSU CHERRITY OPTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method improves the uniformity of the coating thickness of the light conversion body through the screen printing process, and improves the uniformity of the phosphor particle distribution, so as to achieve the purpose of improving the yield; but there are still the following obvious deficiencies: one is that the screen printing The light converter of silicone resin is coated on the surface of the LED chip, and then due to the influence of thermal overstress during the baking and curing process, it will still cause local bubbles to form on the coating surface of the light converter coating and the LED chip to form unevenness The second is to fill the sealing mold or the lens cover with silica gel and package the LED chip coated with the light conversion body, and then the overall structure is baked and cured due to the influence of thermal overstress, which will still cause cracks in the sealing mold or lens cover. Bubbles are generated locally on the silicone surface layer to form uneven defects
The purpose of this method is to provide light converters uniformly arranged around the LED to prevent damage, so as to obtain an LED covered with a light converter layer and an LED device with the LED covered with a light converter layer; but there are also the following obvious Disadvantages: First, during the curing process of the fluorescent resin composition of the light conversion body, due to the influence of thermal overstress, it will still cause local bubbles to form on the surface layer of the light conversion body to form uneven defects; LEDs will still be affected by thermal overstress, resulting in a decrease in light efficiency during use of the LED; third, the process in the entire packaging process is relatively cumbersome, and the production efficiency of the packaged LED is not high; The displacement of the chip, and there is no intelligent control system for precise control, will inevitably lead to a decrease in the yield rate
Although the purpose of the invention of this solution is to improve the color and brightness uniformity, ease of manufacture, and degree of freedom of design of the semiconductor light-emitting element attached with the resin layer containing the light conversion body through the resin sheet laminate, But there are still the following obvious deficiencies: one is that the light conversion body resin sheet used is a cured light conversion body resin sheet, which will not be able to effectively eliminate the possible residual pores, unevenness or other processing defects; In the process, pressing the pressure tool from the side of the semiconductor light-emitting element will damage the semiconductor light-emitting element; the third is to use the adhesive bonding process in the resin layer of the light conversion body, which is difficult to remove the bonded semiconductor. Residues in the light-emitting element, the bonding process is prone to produce pores, which will reduce the yield rate. At the same time, the existence of the adhesive layer also reduces the light-emitting efficiency of the LED element; the fourth is the light conversion of the light-emitting surface of the semiconductor light-emitting element. The base material of the bulk resin sheet is not peeled off, which directly affects the light efficiency of the semiconductor light-emitting element; fifth, the light-converting resin layer is presented in a manner in which multiple blocks are repeatedly arranged in rows in the length direction, but to realize the light conversion The configuration of multiple blocks of the bulk resin layer, the actual operation procedure is cumbersome, will affect the packaging efficiency of the entire component, and the layout error of multiple blocks will directly affect the accuracy of subsequent bonding with the light-emitting element, while If the size and thickness of multiple blocks cannot meet the consistency requirements, it may cause serious product consistency problems

Method used

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  • An intelligent control system and control method based on a rolling-type thermoplastic resin light conversion body for laminating and encapsulating LEDs
  • An intelligent control system and control method based on a rolling-type thermoplastic resin light conversion body for laminating and encapsulating LEDs
  • An intelligent control system and control method based on a rolling-type thermoplastic resin light conversion body for laminating and encapsulating LEDs

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Example 1. combine figure 1 with figure 2 , an intelligent control system based on a rolling-type thermoplastic resin light conversion body bonding package LED, which at least includes a rolling shaping and cutting forming process for a thermoplastic resin light conversion body rolling bonding package LED, rolling pasting Process detection unit, central control device and process drive unit of synthetic process and curing forming process; such as figure 2 shown, where:

[0021] The process detection unit at least includes a roll forming and cutting process for detecting that the light conversion body film is formed into a light conversion film array composed of a single light conversion film with grooves through the rolling forming and cutting process. Cut sensing device, used to detect the roll-bonding sensing device that turns the light conversion film array and LED flip-chip array into LED package components through the roll-press molding process, used to detect...

Embodiment 2

[0036] Example 2. The specific implementation of the new process applied in the present invention will be further described in detail below by taking the new process of the present invention applied to the rolling-type thermoplastic resin light conversion body to package the LED as an example. A process method based on a rolling-type thermoplastic resin light conversion body for bonding and packaging LEDs, which is characterized in that it includes at least the preparation of the light conversion film, the rolling shaping and cutting of the light conversion body film array, and the LED package components The flow-type continuous process constructed by the roll-pressing molding and curing molding process of LED packaging components, the basic steps include the following:

[0037] Step 1, preparation of light-converting film: obtaining a light-converting film composed of at least thermoplastic resin and light-converting material;

[0038] Step 2, roll forming and cutting of the...

Embodiment 3

[0043] Example 3. combine image 3 In the following, taking the new technology of the present invention applied to the rolling-type thermoplastic resin light conversion body to package LED as an example, the intelligent control method of the present invention is further described in detail. The control method of the intelligent control system of the conversion body to fit and package the LED is characterized in that it includes the detection and regulation of the rolling forming and cutting forming process, the rolling forming process, and the curing forming process; wherein:

[0044] The detection and regulation of the rolling forming and cutting forming process is to set the sensor by aligning the vacuum sensor, temperature sensor, roller and roller or roller and plane conveying device in the rolling forming and cutting sensor device. , the roller speed sensor or / and the forward speed sensor of the plane conveying device, the distance between the rollers or the distance bet...

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PUM

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Abstract

An intelligent control system and control method for controlling the use of a thermoplastic resin photoconverter to bond-package an LED by rolling at least comprises: respective process detection units, a central control device and respective process driving units for a roll-shaping and cut-molding process, a roll-bonding and molding process, and a curing and molding process for using a thermoplastic resin photoconverter to bond-package an LED. The central control device is in signal connections with the respective process detection units and the respective process driving units, and processes state information received in real time from the respective process detection units to form operation information for adjusting the respective process driving units in real time. The invention has the significant advantage of detecting and controlling a technique and an equipment system for bond-packaging an LED by rolling, and can satisfy requirements of a technique and an equipment system applicable to the use of a thermoplastic resin photoconverter to bond-package an LED, thereby increasing production efficiency and yield of LED packages in industrialized batch production.

Description

technical field [0001] The invention belongs to the technical field of intelligent control of LEDs packaged by a light conversion body, and in particular relates to an intelligent control system and a control method based on a rolling-type thermoplastic resin light conversion body vacuum-bonded and packaged LED. Background technique [0002] LED has the advantages of high brightness, low heat, long life, environmental protection, renewable utilization, etc., and is called the most promising new generation of green lighting source in the 21st century. At present, although the theoretical life of LEDs can reach more than 100,000 hours, in actual use, due to the constraints of various factors such as chip failure, packaging failure, thermal overstress failure, electrical overstress failure or / and assembly failure, among them Package failure is particularly prominent, which makes LEDs prematurely experience light decay or light failure, which will hinder the progress of LEDs as ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50
CPCH01L33/50
Inventor 何锦华
Owner JIANGSU CHERRITY OPTRONICS CO LTD
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