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Rolling type smart control system for laminating packed LEDs based on thermoplastic resin photo-conversion body and control method thereof

An intelligent control system, thermoplastic resin technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low production efficiency of packaged LEDs, thermal overstress, product consistency, etc., to improve light output efficiency and light output Uniformity, improving the consistency of light and color, and the effect of smoothing and consistent thickness

Active Publication Date: 2017-03-01
JIANGSU CHERRITY OPTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method improves the uniformity of the coating thickness of the light conversion body through the screen printing process, and improves the uniformity of the phosphor particle distribution, so as to achieve the purpose of improving the yield; but there are still the following obvious deficiencies: one is that the screen printing The light converter of silicone resin is coated on the surface of the LED chip, and then due to the influence of thermal overstress during the baking and curing process, it will still cause local bubbles to form on the coating surface of the light converter coating and the LED chip to form unevenness The second is to fill the sealing mold or the lens cover with silica gel and package the LED chip coated with the light conversion body, and then the overall structure is baked and cured due to the influence of thermal overstress, which will still cause cracks in the sealing mold or lens cover. Bubbles are generated locally on the silicone surface layer to form uneven defects
The purpose of this method is to provide light converters uniformly arranged around the LED to prevent damage, so as to obtain an LED covered with a light converter layer and an LED device with the LED covered with a light converter layer; but there are also the following obvious Disadvantages: First, during the curing process of the fluorescent resin composition of the light conversion body, due to the influence of thermal overstress, it will still cause local bubbles to form on the surface layer of the light conversion body to form uneven defects; LEDs will still be affected by thermal overstress, resulting in a decrease in light efficiency during use of the LED; third, the process in the entire packaging process is relatively cumbersome, and the production efficiency of the packaged LED is not high; The displacement of the chip, and there is no intelligent control system for precise control, will inevitably lead to a decrease in the yield rate
Although the purpose of the invention of this solution is to improve the color and brightness uniformity, ease of manufacture, and degree of freedom of design of the semiconductor light-emitting element attached with the resin layer containing the light conversion body through the resin sheet laminate, But there are still the following obvious deficiencies: one is that the light conversion body resin sheet used is a cured light conversion body resin sheet, which will not be able to effectively eliminate the possible residual pores, unevenness or other processing defects; In the process, pressing the pressure tool from the side of the semiconductor light-emitting element will damage the semiconductor light-emitting element; the third is to use the adhesive bonding process in the resin layer of the light conversion body, which is difficult to remove the bonded semiconductor. Residues in the light-emitting element, the bonding process is prone to produce pores, which will reduce the yield rate. At the same time, the existence of the adhesive layer also reduces the light-emitting efficiency of the LED element; the fourth is the light conversion of the light-emitting surface of the semiconductor light-emitting element. The base material of the bulk resin sheet is not peeled off, which directly affects the light efficiency of the semiconductor light-emitting element; fifth, the light-converting resin layer is presented in a manner in which multiple blocks are repeatedly arranged in rows in the length direction, but to realize the light conversion The configuration of multiple blocks of the bulk resin layer, the actual operation procedure is cumbersome, will affect the packaging efficiency of the entire component, and the layout error of multiple blocks will directly affect the accuracy of subsequent bonding with the light-emitting element, while If the size and thickness of multiple blocks cannot meet the consistency requirements, it may cause serious product consistency problems

Method used

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  • Rolling type smart control system for laminating packed LEDs based on thermoplastic resin photo-conversion body and control method thereof
  • Rolling type smart control system for laminating packed LEDs based on thermoplastic resin photo-conversion body and control method thereof
  • Rolling type smart control system for laminating packed LEDs based on thermoplastic resin photo-conversion body and control method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Example 1. combine figure 1 and figure 2 , an intelligent control system based on a rolling-type thermoplastic resin light-converting body for laminating and encapsulating LEDs, which at least includes rolling-forming and cutting-forming processes for the thermoplastic resin light-converting body for rolling and laminating and encapsulating LEDs, rolling and sticking Process detection unit, central control device and process drive unit for synthesis process and curing process; such as figure 2 shown, where:

[0021] The process detection unit at least includes a rolling forming and cutting process for detecting that the light conversion body film is formed into a light conversion film array composed of a single light conversion film with grooves through the rolling forming and cutting forming processes. Cut sensor device, used to detect the roll bonding sensor device used to detect the LED package element through the roll bonding process The cooling and curing sen...

Embodiment 2

[0036] Example 2. The specific embodiments of the new process applied by the present invention are further described in detail below by taking the new process of applying the present invention to a rolling-type thermoplastic resin light conversion body to fit and encapsulate an LED as an example. A process method for laminating and encapsulating LEDs based on a rolling-type thermoplastic resin light conversion body, characterized in that it comprises at least preparation of a light conversion film, rolling forming and cutting of a light conversion body film array, LED packaging body elements The flow-type continuous process constructed by the roll-on-molding molding and the curing molding process of the LED package components, the basic steps include the following:

[0037] Step 1, preparation of the light conversion film: obtain a light conversion film composed of at least a thermoplastic resin and a light conversion material;

[0038] Step 2, rolling, shaping and cutting of...

Embodiment 3

[0043] Example 3. combine image 3 , the following is an example of the new process of applying the present invention to a rolling thermoplastic resin light conversion body to fit and encapsulate an LED to further describe the intelligent control method of the present invention. The control method of the intelligent control system for the converter body to fit and package the LED is characterized in that, it includes the detection and regulation of the rolling forming and cutting and forming processes, the rolling and laminating forming process, and the curing forming process; wherein:

[0044] The detection and regulation of the rolling forming and cutting and forming processes are arranged by the vacuum sensor, the temperature sensor, the roller and the roller or the roller and the plane conveying device in the rolling forming and cutting sensing device. , Roller rotational speed sensor or / and plane conveying device forward speed sensor, roller distance or roller and plane ...

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Abstract

The invention relates to a smart control system for rolling type laminating packed LEDs based on thermoplastic resin photo-conversion bodies and a control method thereof. The smart control system comprises at least process detection units for a rolling fixing and cutting fixing process, a rolling laminating forming process, a fixed forming process for rolling laminating packed LEDs with thermoplastic resin photo-conversion bodies, a central control device and a process driving unit, wherein the central control device is respectively in signal connection with each process detection unit and the process driving unit, receives the state information of each process detection unit and processes into operation information for real-time regulating and controlling the process detection units. The smart control system and the control method have the advantages of detecting and controlling rolling laminating packaging LED process and device systems, the requirements of process and equipment systems of rolling type thermoplastic resin photo-conversion body laminating packed LEDs, and the production efficiency of mass production of LED packaging and high-quality product rate are improved.

Description

technical field [0001] The invention belongs to the technical field of intelligent control of LEDs packaged by a light conversion body, and in particular relates to an intelligent control system and a control method based on a rolling-type thermoplastic resin light conversion body vacuum-bonded and packaged LED. Background technique [0002] LED has the advantages of high brightness, low heat, long life, environmental protection, renewable utilization, etc., and is called the most promising new generation of green lighting source in the 21st century. At present, although the theoretical life of LEDs can reach more than 100,000 hours, in actual use, due to the constraints of various factors such as chip failure, packaging failure, thermal overstress failure, electrical overstress failure or / and assembly failure, among them Package failure is particularly prominent, which makes LEDs prematurely experience light decay or light failure, which will hinder the progress of LEDs as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50
CPCH01L33/50H01L33/005H01L2933/0041
Inventor 何锦华
Owner JIANGSU CHERRITY OPTRONICS CO LTD
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