A grinding and polishing method for superhard and brittle workpieces
A technology for ultra-hard and brittle workpieces, which is applied in the field of grinding and polishing of ultra-hard and brittle workpieces, can solve the problems of low quality, and achieve the effects of simple preparation, improved surface roughness, and small subsurface damage
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Embodiment 1
[0025] A grinding method suitable for silicon carbide and sapphire. It first prepares diamond abrasive aggregates, adopts 10-15 μm particle size diamond crushing material with a weight ratio of 70:12:8, pre-sintered vitrified bond and copper powder to prepare diamond aggregates. The preparation method is: the above materials After the steps of mixing, gluing, drying, granulating, degumming, sintering and re-screening, the aggregate abrasive with a particle size of 2-20 μm is obtained.
[0026] The above-mentioned prepared aggregate abrasive and resin bond are in a ratio of 35:65 by weight (during specific implementation, the weight ratio of aggregate abrasive and resin bond can also be 70:30, 50:50 and 20:80, etc. ) were mixed, then poured into the prepared mold, and thermally induced to cure, demolded to obtain a grinding and polishing pad with protrusions in the shape of quadrangular prisms and arranged in a cycloidal shape, and post-cured for 2 hours.
[0027] The above-me...
Embodiment 2
[0029]A grinding method suitable for silicon carbide and sapphire. It first prepares diamond abrasive aggregates, using diamond with a weight ratio of 65:35 and pre-sintered low-temperature ceramic bond to prepare diamond aggregates. The original particle size of diamonds is 8-12 μm. The preparation method is: Mixing, gluing, drying, granulating, degumming, sintering, re-screening and other steps to obtain diamond aggregate abrasive grains with a particle size of 50-60 μm.
[0030] The above prepared aggregate large particles and copper powder are in a weight ratio of 44:60 (in practice, the ratio of aggregate large particles to copper powder can also be 75:25, 50:50 or 20:80) Mix, then put into pre-selected and prepared graphite molds, carry out hot pressing and sintering for 15 minutes, demould to obtain pellets with protrusions in the shape of pentagonal prisms, and bond them into a grinding pad with protrusions arranged in a radial shape.
[0031] The above-mentioned prep...
Embodiment 3
[0033] A polishing method suitable for silicon carbide and sapphire. It first prepares diamond abrasive aggregates. It first uses diamonds with a particle size of 3-5 μm in a weight ratio of 62:30:8, low-temperature ceramic pre-sintered bodies and copper powder to prepare diamond aggregate abrasive grains. The preparation method is: The above materials go through the steps of mixing, gluing, drying, granulating, degumming, sintering and re-screening to obtain diamond aggregate abrasives with a particle size of 40-50 μm.
[0034] Mix the above-mentioned large aggregate particles and resin in a ratio of 50:50 (in practice, the weight ratio of aggregate abrasive and resin binder can also be 70:30, 60:40 and 20:80, etc.), Then pour it into the prepared mold, perform hot pressing on a vulcanizing machine, and demould to obtain a grinding and polishing pad whose protrusions are in the shape of hexagonal prisms and the protrusions are arranged in a square lattice (lattice spacing: 2 ...
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