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High-toughness, anti-impact and high-flexibility epoxy pouring sealant and preparation method thereof

A potting glue and impact-resistant technology, applied in the field of potting glue, can solve the problems of insufficient crosslinking density, insufficient rigidity of cured products, reduced heat resistance, etc., and achieve stable curing rate, good flexibility, and small heat release Effect

Active Publication Date: 2017-01-04
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are many common epoxy resin toughening methods, such as using the interaction between resin macromolecular segments and small molecules to replace the interaction force between macromolecular segments; such as adding a small molecule toughening diluent to make the cured product Lower the glass transition temperature, endow the epoxy adhesive with flexibility, and improve its elongation at break and impact strength, but this modification method often results in insufficient rigidity of the cured product due to insufficient crosslinking density; another method is to add Elastomers such as polyurethane, vinyl resin, acrylic resin, chlorinated rubber, carboxybutyl rubber, etc. are physically blended, but this modification method is not a true molecular level blending, but will reduce its resistance. hot

Method used

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  • High-toughness, anti-impact and high-flexibility epoxy pouring sealant and preparation method thereof
  • High-toughness, anti-impact and high-flexibility epoxy pouring sealant and preparation method thereof
  • High-toughness, anti-impact and high-flexibility epoxy pouring sealant and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0039] A high toughness, impact resistance and high flexibility epoxy potting compound of the present invention, comprising A component and B component with a mass ratio of 10:1, wherein A component is composed of the following raw materials:

[0040]

[0041] Component B consists of the following raw materials:

[0042] Mixture of Huntsman D230 and T403 35g;

[0043] Hyperbranched curing agent (complex of hyperbranched polyethyleneimine and isophorone diamine) 25g and DMP-302g.

[0044] The preparation method of the high toughness, impact resistance and high flexibility epoxy potting glue of the present embodiment comprises the following steps:

[0045] (1) Preparation of matrix resin component system (component A): add 70g of liquid nitrile rubber-modified bisphenol A epoxy resin to the high-speed disperser kettle, and then add 5g of Bluestar Chemical’s 0192 type After the CYH-277 hyperbranched reactive diluent of epoxy resin, 5g is mixed homogeneously, then add the R974 ...

Embodiment 2

[0049] A high toughness, impact resistance and high flexibility epoxy potting compound of the present invention, comprising A component and B component with a mass ratio of 15:1, wherein A component is composed of the following raw materials:

[0050]

[0051] Component B consists of the following raw materials:

[0052] Mixture of Huntsman D2000 and T403 20g;

[0053] Hyperbranched curing agent (complex of hyperbranched polyethyleneimine and isophorone diamine) 40g and triethanolamine 3g.

[0054] The preparation method of the high toughness, impact resistance and high flexibility epoxy potting glue of the present embodiment comprises the following steps:

[0055] (1) Preparation of the matrix resin component system (component A): add 100g of liquid nitrile rubber-modified bisphenol F epoxy resin to the high-speed disperser kettle, and then add 10g of Bluestar Chemical’s 0193H type Epoxy resin, 10g of CYH-277-S hyperbranched reactive diluent are mixed evenly, then add 5g...

Embodiment 3

[0059] A high-toughness, impact-resistant, high-flexibility epoxy potting adhesive of the present invention, comprising A component and B component with a mass ratio of 20:1, wherein A component is composed of the following raw materials:

[0060]

[0061] Component B consists of the following raw materials:

[0062] Huntsman ED-600 and EDR-176 mixture 50g;

[0063] Hyperbranched curing agent (complex of hyperbranched polyethyleneimine and isophorone diamine) 50g and resorcinol 5g.

[0064] The preparation method of the high toughness, impact resistance and high flexibility epoxy potting glue of the present embodiment comprises the following steps:

[0065] (1) Preparation of matrix resin component system (component A): add 130g of liquid nitrile rubber-modified bisphenol A epoxy resin to the high-speed disperser kettle, and then add 20g of Bluestar Chemical’s 0191H type Epoxy resin, 18 parts of CYH-277-S hyperbranched reactive diluent are mixed evenly, then add 10 parts ...

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Abstract

The invention discloses a high-toughness, anti-impact and high-flexibility epoxy pouring sealant. The high-toughness, anti-impact and high-flexibility epoxy pouring sealant is composed of a component A and a component B, wherein the component A is prepared from the following raw materials in parts by weight: 0 to 130 parts of toughening epoxy resin, 5 to 20 parts of bisphenol A type epoxy resin, 1 to 18 parts of an active diluent, 1 to 10 parts of a thixotropic agent and 160 to 320 parts of aluminum oxide; the component B is prepared from the following raw materials in parts by weight: 20 to 50 parts of a flexible curing agent, 25 to 50 parts of a hyperbranched curing agent and 1 to 5 parts of an accelerant; the mass ratio of the component A to the component B ranges from (10 to 1) to (20 to 1). According to a preparation method provided by the invention, the materials are prepared and mixed according to formulas of the component A and the component B respectively. The epoxy resin provided by the invention not only has rubber flexibility, but also has excellent heat-resisting performance and rigidity.

Description

technical field [0001] The invention relates to the technical field of potting glue, in particular to an epoxy potting glue with high toughness, impact resistance and high flexibility and a preparation method thereof. Background technique [0002] Epoxy resin refers to an organic polymer compound containing two or more epoxy groups in the molecule, which has good dielectric properties, mechanical properties, adhesive properties and corrosion resistance, and curing shrinkage and linear expansion The coefficient is small, the size of the cured product is relatively stable, and it has excellent comprehensive performance. Epoxy resin is widely used in the field of potting because of its excellent electrical insulation and manufacturability. [0003] Products that are potted and protected with epoxy resin have excellent integrity and dimensional stability, and can effectively prolong the service life by 2 to 3 times. However, after the ordinary epoxy resin is cured, due to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04C08G59/50
Inventor 曾亮黎超华李忠良朱伟田宗芳蒋大伟李鸿岩姜其斌
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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