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Copper-clad plate reinforced by glass fiber cloth

A technology of glass fiber cloth and copper clad laminate, which is applied in the direction of glass/slag layered products, epoxy resin glue, adhesive type, etc. It can solve the problems of difficult removal, complicated process flow, and a large number of burrs, and achieve filler dispersion Good effect, excellent comprehensive performance, and the effect of improving the dielectric constant

Active Publication Date: 2016-12-07
江门建滔积层板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a common milling cutter is used to process a plated through hole (PTH) on a PTFE copper clad laminate, it is easy to produce a large number of burrs on the machined surface, and because these burrs are soft, they are not easy to remove
[0006] In the existing preparation methods of PTFE composite dielectric substrates without reinforcement materials, there are complicated process flow, and various organic additives need to be added to improve the dispersion effect of PTFE and fillers
In the process of removing organic additives, it generally takes a long time (more than 4h) high temperature (above 200°C) treatment to remove organic additives, and there may still be residues of organic additives, which will affect the dielectric properties of PTFE composite dielectric substrates. Affects performance and water absorption

Method used

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  • Copper-clad plate reinforced by glass fiber cloth

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Epoxy resin adhesive raw materials (parts by weight): 50 parts of dicyclopentadiene type novolac epoxy resin, 20 parts of tetraphenol ethane type epoxy resin, 0.6 part of N,N-dimethylbenzylamine, zinc octoate 0.6 parts, 45 parts of ethyl acetate, 250 parts of high dielectric constant filler, 7.2 parts of flame retardant.

[0039] The high dielectric constant filler is obtained by uniformly stirring and mixing strontium titanate, strontium niobate and strontium zirconate in a mass ratio of 1:1:1.

[0040] The flame retardant is obtained by uniformly stirring and mixing triethyl phosphate, tris(2-chloroethyl) phosphate and tris(1-chloro-2-propyl) phosphate in a mass ratio of 1:1:1.

[0041] Epoxy adhesive preparation:

[0042] Stir dicyclopentadiene novolac epoxy resin, tetraphenol ethane type epoxy resin, and ethyl acetate at 400 rpm for 5 minutes, then add N,N-dimethylbenzylamine and zinc octanoate at 300 rpm Stir for 10 minutes per minute, and finally add high dielec...

Embodiment 2

[0045] It is basically the same as in Example 1, except that the high dielectric constant filler is obtained by stirring and mixing strontium niobate and strontium zirconate at a mass ratio of 1:1. The glass fiber cloth reinforced copper clad laminate of Example 2 was obtained.

Embodiment 3

[0047] It is basically the same as in Example 1, except that the high dielectric constant filler is obtained by stirring and mixing strontium titanate and strontium zirconate at a mass ratio of 1:1. The glass fiber cloth reinforced copper clad laminate of Example 3 was obtained.

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Abstract

The invention discloses a copper-clad plate reinforced by glass fiber cloth. The copper-clad plate comprises prepreg. The prepreg is obtained by soaking the glass fiber cloth in an epoxy resin adhesive and then dried. The epoxy resin adhesive is prepared from, by weight, 45-55 parts of dicyclopentadiene novolac epoxy resin, 15-25 parts of tetraphenol ethane epoxy resin, 0.3-3 parts of N,N-dimethylbenzylamine, 0.3-3 parts of zinc dioctanoate, 20-80 parts of ethyl acetate, 200-300 parts of high-dielectric-constant filler and 5-15 parts of fire retardant. The copper-clad plate is reinforced by the glass fiber cloth; through the reasonable matching, the types and amounts of the proper high-dielectric-constant filler and the proper fire retardant are preferentially selected, the dielectric constant, flame retardance and stripping strength are improved, comprehensive performance is quite excellent, the filler dispersing effect is good, cost is low, and the copper-clad plate is environmentally friendly and economical.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a copper clad laminate reinforced with glass fiber cloth. Background technique [0002] As the development of electronic products tends to be multi-functional, the components of electronic products are also constantly developing in light, thin, short, small, etc., especially the wide application of high-density integrated circuit technology, which proposes high-performance, Requirements for high reliability and high security; requirements for good technical performance, low cost, and low energy consumption for industrial electronic products. Therefore, the core material of electronic products - the base material of printed circuit board (PCB) is facing higher technical requirements, more severe use environment and higher environmental protection requirements. [0003] Copper Clad Laminate (CCL for short) is mainly used to produce printed circuit boards. It is made ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/04C08K7/14C08K3/24C08K5/098C08K5/521C08K5/18C09J163/00C08J5/24B32B17/02B32B17/06B32B37/10B32B37/06
CPCB32B15/14B32B37/06B32B37/10B32B2260/021B32B2260/046B32B2262/101B32B2307/3065C08J5/24C08J2363/00C08K2201/014C08L63/00C08L2201/02C08L2203/20C08L2205/025C09J163/00C08K13/04C08K7/14C08K3/24C08K5/098C08K5/521C08K5/18C08K13/02
Inventor 刘世超
Owner 江门建滔积层板有限公司
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