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A light-cured resin material for 3D printing

A technology of light-curing resin and epoxy resin, which is applied in the direction of additive processing, etc., can solve the problems of high water absorption and damage to the stability of light-cured workpieces, and achieve the effects of low water absorption, expanded use, and avoid volume expansion

Active Publication Date: 2019-03-22
HUNAN FARSOON HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a light-curable resin material to solve the disadvantages of the existing light-curable resin material that destroys the stability of the light-cured workpiece due to its high water absorption rate. The light-curable resin material of the present invention improves the use quality of the 3D printing workpiece and service life

Method used

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  • A light-cured resin material for 3D printing

Examples

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Effect test

Embodiment 1

[0021] A photocurable resin material, wherein the mass percentages of each component are: bisphenol A type E-51 epoxy resin 51%, tricyclodecane dimethanol diacrylate 2%, trimethylol propane triacrylate 5% %, Dipropylene Glycol Diacrylate 5%, Polyacrylate Elastomer Particles 5%, 3-Hydroxymethyl-1-Oxetane 7%, 2-Hydroxymethyl Oxetane 11%, Initiator 6%, trifluoroethyl acrylate 8%.

Embodiment 2

[0023] A light-curing resin material, wherein the mass percentages of each component are: bisphenol A type E-51 epoxy resin 20%, alicyclic epoxy resin 30%, hydrogenated bisphenol A type epoxy resin 10%, 2 -Methyl-1,3-propanediol diacrylate 12%, trimethylolpropane trimethacrylate 8%, polyurethane elastomer particles 2%, 3-hydroxymethyl-1-oxetane 5% , initiator 8%, trifluoroethyl methacrylate 3%, pentafluoropropyl acrylate 2%.

Embodiment 3

[0025] A light-curing resin material, wherein the mass percentages of each component are: bisphenol A type E-51 epoxy resin 6%, alicyclic epoxy resin 20%, hydrogenated bisphenol A type epoxy resin 20%, two Propylene glycol diacrylate 7%, 1,6-hexanediol diacrylate 3%, silica particle modified epoxy resin 7%, polyacrylate elastomer particle 10%, 2-hydroxymethyloxetane Alkane 8%, 3-methyl-3-hydroxymethyl oxetane 15%, initiator 10%, pentafluoropropyl methacrylate 1%.

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Abstract

The invention discloses a photocurable resin material for 3D printing, wherein the mass percentage of each component is: 10-60% of epoxy resin, 0-30% of acrylate monomer or acrylate prepolymer, and anti-impact agent 2‑10%, oxetane reactive diluent 5‑40%, initiator 5‑20%, hydrophobic modifier 1‑10%. The photocurable resin material of the present invention can reduce the water absorption rate of the material after curing, effectively avoid the volume expansion, strength reduction, and modulus decrease of the material caused by the plasticizing effect of water molecules, and improve the use quality and service life of the workpiece .

Description

technical field [0001] The invention relates to a photocurable resin material, in particular to a photocurable resin material for 3D printing. Background technique [0002] Stereo Lithography Apparatus (SLA) was introduced by 3D System in the United States in the late 1980s. It is the most mature and widely used rapid prototyping technology today. [0003] At present, the photosensitive resin used in the photocuring process is mainly a cationic-free radical hybrid system composed of epoxy resin and acrylate monomer. Generally, in order to improve the impact resistance of the workpiece after the material is cured and formed, hydroxyl-containing components such as polyols are often added to the material components to reduce the crosslinking density and improve the toughness after curing. Raw materials are easy to absorb water; in addition, different from traditional processing methods such as injection molding, SLA technology adopts the forming method of "from points to lines...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L51/08C08L75/04C08L33/04C08F283/10C08F222/14C08F222/20C08F220/22C08K3/36B33Y70/00
CPCC08F283/10C08L51/08B33Y70/00C08L2205/03C08L33/04C08L75/04C08L63/00C08K3/36C08F222/103C08F222/102
Inventor 袁博佟凤宇潘强
Owner HUNAN FARSOON HIGH TECH CO LTD
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