Copper surface organic solder preservative and application thereof

A solder-preserving and organic technology, applied in the field of copper surface treatment in the PCB industry, can solve problems such as uneven film formation, achieve good anti-oxidation, good application prospects, and improve uniformity.

Active Publication Date: 2016-07-20
深圳市天泽科技实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The film-forming process of OSP mainly uses imidazole organic matter to configure organic solderable copper surface protectant, and the organic matter reacts with the copper surface to form a complex, thereby forming a layer of homogeneous organic film. The forming process of the film layer is protected by the protective agent. Influenced by factors such as the composition of the copper surface, the properties of the copper surface, the pH value of the system during the film formation process, temperature, time, etc., the existing process generally has the technical problem of uneven film formation caused by the unstable properties of the reaction system during the film formation process. improve to solve

Method used

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  • Copper surface organic solder preservative and application thereof
  • Copper surface organic solder preservative and application thereof
  • Copper surface organic solder preservative and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Preparation of organic flux for copper surface:

[0020] Heat 0.8kg of solution HP-MU (Shenzhen Tianxi Technology Development Co., Ltd.) containing organic film-forming substances to 40°C, add 16g of regulating additive n-octanoic acid, stir and mix evenly, add 0.5g of 2-amino-2-formazan base-1-propanol to obtain an organic soldering flux for the copper surface with a pH value of 3.

Embodiment 2

[0022] Preparation of organic flux for copper surface:

[0023] With 0.8kg of solution HPX-MU (Shenzhen Tianxi Technology Development Co., Ltd.) containing organic film-forming substances, the temperature was raised to 36°C, and 16g of regulating auxiliary agent oleic acid was added, stirred and mixed evenly, and 4g of 2 -Amino-2-methyl-1-propanol aqueous solution to obtain an organic soldering flux for the copper surface, with a pH value of 2.8.

Embodiment 3

[0025] Preparation of organic flux for copper surface:

[0026] With 0.8kg solution HF-MU (Shenzhen Tianxi Science and Technology Development Co., Ltd.) that contains organic film-forming substances, heat up to 40°C, add 40g of regulating auxiliary agent n-octanoic acid, stir and mix evenly, add 2.5g of 65% mass concentration 2-(butylamino) ethanol aqueous solution, obtains the copper surface organic flux that pH value is 3.

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PUM

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Abstract

The invention discloses copper surface organic solder preservative and an application thereof. The organic solder preservative comprises a solution containing organic film forming matter, an adjusting additive and a buffering agent; the organic film forming matter is an imidazole compound; the buffering agent is one or more of 2-amidogen-2-methyl-1-propyl alcohol, 2-(butyl amine) ethyl alcohol and N-methylethanolamine or is an aqueous solution of one or more of 2-amidogen-2-methyl-1-propyl alcohol, 2-(butyl amine) ethyl alcohol and N-methylethanolamine. According to the copper surface organic solder preservative, through formula improvement, the dissolving property of the film forming matter and stability of a reaction system can be improved, accordingly, the film forming quality of the copper surface is improved, and the film forming efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of copper surface treatment in the PCB (printed circuit board) industry, and relates to an organic flux for copper surface and its application. technical background [0002] When copper-containing components such as PCB (Printed Circuit Board, printed circuit board) are soldered, if the surface is oxidized or stained, the solder joints will be unreliable, which will cause the components to burn during use. Therefore, before welding, it is generally necessary to carry out surface treatment on the copper surface to improve oxidation resistance and heat resistance. At present, the OSP (Organic Solderability Preservatives) process is widely used due to the advantages of low cost and simple operation. This process covers the bare copper surface with a chemical method. Oxidation, thermal shock resistance and moisture resistance, protect the copper surface from oxidation and corrosion in the normal environment, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/3612B23K35/362
Inventor 刘根潘湛昌詹国和付正皋肖俊张波胡光辉肖楚民
Owner 深圳市天泽科技实业有限公司
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