Manufacturing method of pcb board surface protection

Abstract

The invention discloses a manufacturing method used for a PCB (printed circuit board) and capable of protecting the PCB surface. The manufacturing method comprises the following steps of pasting photo-sensitive resist on the surface of the PCB; manufacturing a negative film and drawing patterns on the negative film, wherein a light tight pattern is arranged in a position, corresponding to a position where a protection layer is not required to cover the PCB, of the negative film, and the rest positions of the negative film are light-transmitting; putting the PCB in an exposure machine, after enabling the negative film to be aligned with the PCB, placing the negative film on the PCB; starting the exposure machine, wherein UV light from the exposure machine irradiates the negative film, and the UV light transmits the light-transmitting part of the negative film to be irradiated on the PCB obtained in the first step; baking; developing; and baking. The manufacturing method is simple in manufacturing process and environment-friendly; the manufactured PCB is high in flatness; the adhesive force of the protection layer is enhanced; and an accurate windowing region is obtained.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing PCB surface protection. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, referred to as printed board, is one of the important components of the electronics industry, is the support of electronic components, and the carrier of electrical connections. During the production process of the PCB board, the surface protection treatment of the PCB board needs to be completed to achieve the functions of anti-oxidation, insulation, anti-corrosion, anti-leakage, anti-soldering, and aesthetics. At present, the surface of the PCB is generally protected by coating solder resist ink or attaching a coverlay. [0003] The method of coating solder resist ink includes the following process: making screen printing screen and deploying ink, solder resist ink coating, low temperature baking plate, mak...

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Problems solved by technology

[0003] The method of coating solder resist ink includes the following process: making screen printing screen and deploying ink, solder resist ink coating, low temperature baking plate, making exposure film, window alignment / exposure, development, UV and high temperature curing; this kind of PCB The board surface protection method is limited by the flatness of the PCB board surface and the adhesion of the protective layer to the PCB board. The production process is heavily polluted and the production process is relatively complicated.

[0004] The method of pasting coverlay includes the following process: punching at the window opening position, alignment lamination, and hot pressing; this kind of method of pasting coverlay needs to be punched first, and then through the complex process of alignment false pasting and finally hot pressing. The production of some external circuit boards with many, dense and small pads is quite weak.