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A preparation method of gradient aluminum-silicon electronic packaging material

An electronic packaging material and aluminum-silicon technology, which is applied in the preparation of aluminum-silicon alloy materials and the preparation of gradient aluminum-silicon electronic packaging materials, can solve the problem of increased thermal conductivity, poor melting and welding of aluminum-silicon alloys, and difficulties in welding and machining of aluminum-silicon alloys. Increase and other problems to achieve the effect of densification and composition gradient

Active Publication Date: 2017-03-29
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As the silicon content increases, the thermal expansion coefficient of the Al-Si alloy decreases and the thermal conductivity increases; however, the welding and machining of the Al-Si alloy becomes more difficult
It is difficult to guarantee the machining accuracy of the aluminum-silicon packaging shell, and the tool wear is serious; the melting and welding of the aluminum-silicon alloy is poor, and defects such as cracks and air hole inclusions usually occur, which seriously affect the performance of the component
It is difficult for a single homogeneous aluminum-silicon composite material to meet the requirements of many special properties (physical properties and mechanical processing properties) of electronic packaging at the same time

Method used

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  • A preparation method of gradient aluminum-silicon electronic packaging material
  • A preparation method of gradient aluminum-silicon electronic packaging material

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Experimental program
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Embodiment 1

[0032] This embodiment includes the following steps:

[0033] (1) Adopt the casting method to prepare the aluminum-silicon material with the mass percentage of silicon being 10% and the thickness H=10mm. It is completely melted in the furnace, and then cast into a block material with a thickness of 10mm.

[0034] (2) Fix the aluminum-silicon material in step (1) on the workbench of the friction stir processing equipment, and use a stirring head with a standard thread to obtain a dense aluminum-silicon alloy with fine silicon particles (less than 10 μm) and uniform distribution.

[0035] The specific steps and process parameters of friction stir processing are as follows: the diameter of the shaft shoulder is 30mm, the diameter of the cylindrical stirring needle is M14, the length is 10mm, and the inclination angle is 2.5°. The rotation speed of the stirring head is 750 rpm, and the friction stir processing speed is 100 mm / min; 2 passes of friction stir processing of the entir...

Embodiment 2

[0042] This embodiment includes the following steps:

[0043] (1) Adopt powder metallurgy method to prepare the aluminum-silicon material that the mass percent of silicon is 20%, thickness H=10mm, concrete method is: the silicon powder that accounts for 20% of total weight and the aluminum powder that accounts for 80% of total weight Mix evenly in a powder mixer, pre-sinter at 450°C and 40MPa in an argon atmosphere for 15 minutes, then sinter at 700°C for 1 to 2 hours, cool down to 450°C, and hold at 30MPa for 2 hours , to obtain Al-Si material.

[0044] (2) The aluminum-silicon material in step (1) is subjected to friction stir processing to obtain a dense aluminum-silicon alloy with fine silicon particles (less than 10 μm) and uniform distribution.

[0045] The specific steps and process parameters of friction stir processing are as follows: the diameter of the shoulder of the stirring head used is 30mm, the diameter of the cylindrical stirring pin is M14, the length is 9mm...

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Abstract

The invention discloses a preparation method for a gradient aluminum-silicon electronic encapsulation material. The preparation method comprises the following specific steps: (1), preparing an aluminum-silicon material by adopting a casting or powder metallurgy method and carrying out friction stirring processing on the aluminum-silicon material so as to obtain compact aluminum silicon alloy with refined and uniformly-distributed silicon particles; (2), drilling uniformly-distribute blind holes in the aluminum silicon alloy, filling the holes with silicon powder, compacting silicon powder and carrying out friction stirring processing so as to obtain an aluminum silicon composite layer with a certain thickness; and (3), repeating the step (2), and controlling the sizes of a stirring needle and the blind holes and intervals, so as to obtain the gradient aluminum silicon alloy, of which the mass percentage of silicon is in gradient distribution. According to the invention, through a friction stirring processing method, the aluminum silicon alloy with the ingredient in continuous and gradient distribution is obtained, so that the aluminum silicon alloy has different thermal conductivity, different thermal expansion coefficients and different mechanical properties at different positions to meet demands when being used as the encapsulation material.

Description

technical field [0001] The invention relates to the technical field of preparation of aluminum-silicon alloy materials, in particular to the technical field of preparation of gradient aluminum-silicon electronic packaging materials. Background technique [0002] In recent years, with the improvement of the integration and complexity of microelectronic devices, the calorific value of the chip has risen sharply. Become the two main failure modes of microelectronic devices. As an important part of electronic circuit components, the selection of electronic packaging materials is very important to the overall performance of components. The material of the packaging shell should meet the heat dissipation requirements of the electronic circuit components, and at the same time match the thermal expansion coefficient of the component substrate. [0003] Aluminum-silicon alloy has broad application prospects in the field of electronic packaging due to its low thermal expansion coeff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C21/02C22C1/10
Inventor 华鹏周伟昝祥吴玉程
Owner HEFEI UNIV OF TECH
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