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Polyurethane pouring sealant and preparation method thereof

A potting glue and polyurethane technology, applied in the field of polyurethane potting glue and its preparation, can solve the problems of weak metal adhesion, long curing time, poor transparency, etc., achieve fast curing speed, reduce construction process requirements, and be easy to operate. Effect

Active Publication Date: 2016-01-20
BEIJING JINWEINA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual use of existing potting adhesives, there are often problems such as high hardness, high viscosity, poor transparency after curing, many bubbles, poor insulation, weak adhesion to metal, and long curing time.

Method used

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  • Polyurethane pouring sealant and preparation method thereof
  • Polyurethane pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The present invention will be further described below in conjunction with the examples, which are not limited to the present invention.

[0030] The following examples are all in weight percent.

[0031] Embodiment 1 A kind of polyurethane potting glue (A component does not contain plasticizer)

[0032] A polyurethane potting glue, comprising the steps of:

[0033] (1) Component A is made from the following components by weight:

[0034] Add 90.5 parts of castor oil, 2 parts of 1,4-butanediol, 3 parts of triethanolamine, 10100.5 parts of antioxidant, 0.5 parts of UV-3280, and 6220.5 parts of light stabilizer into the reaction kettle, and stir at 80-100 °C, Vacuumize and dehydrate and degas for 3 hours, lower the temperature to 10-40°C, add 2 parts of organic rare metal catalyst PD, 40.5 parts of defoamer BYK17940, and 20.5 parts of coupling agent PN-7920, stir evenly, and discharge.

[0035] (2) B component is made from the following components by weight:

[0036] A...

Embodiment 2

[0038] Embodiment 2 A kind of polyurethane potting glue (A component does not contain plasticizer)

[0039] A polyurethane potting glue, comprising the steps of:

[0040] (1) Component A is made from the following components by weight:

[0041] Add 90.5 parts of castor oil, 2 parts of 1,4-butanediol, 3 parts of triethanolamine, 10100.5 parts of antioxidant, 0.5 parts of UV-3280, and 6220.5 parts of light stabilizer into the reaction kettle, and stir at 80-100 °C , vacuum dehydration and degassing for 3.5 hours, lower the temperature to 10-40°C, add 16192 parts of organic bismuth zinc catalyst, 10.2 parts of defoamer BYK1410.3 parts, DeFom65000.3 parts, coupling agent KH-5500.5 parts, stir evenly, discharge .

[0042] (2) B component is made from the following components by weight:

[0043] Add 52 parts of dioctyl phthalate into the reaction kettle, vacuumize and dehydrate at 80-100°C for 2-3 hours to make the water content <0.05%, drop the temperature to 10-30°C, add 32 par...

Embodiment 3

[0045] Embodiment 3 A kind of polyurethane potting glue (A component does not contain plasticizer)

[0046] A polyurethane potting glue, comprising the steps of:

[0047] (1) Component A is made from the following components by weight:

[0048] 79.5 parts of castor oil, 10 parts of polyoxypropylene glycol (Mn1000), 2 parts of 1,4-butanediol, 3 parts of trimethylolpropane, 10100.5 parts of antioxidant, 0.5 parts of UV-3280, 6220.5 parts of light stabilizer Add 3 parts of stannous octoate, 0.5 parts of antifoaming agent BYK17900, and 0.5 parts of coupling agent KH-5600.5 portion, stir evenly, and discharge.

[0049](2) B component is made from the following components by weight:

[0050] Add 61.3 parts of dioctyl phthalate into the reaction kettle, vacuumize and dehydrate at 80-100°C for 2-3 hours to make the water content <0.05%, cool down to 10-30°C, add 20.5 parts of toluene diisocyanate, pre- 15.6 parts of polymer ZB1895 and 5052.6 parts of polymethylene polyphenyl polyi...

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Abstract

The invention relates to a polyurethane pouring sealant. The polyurethane pouring sealant comprises a component A and a component B in a mass ratio of 1 to 1, wherein the component A is prepared from the following components in parts by weight: 80-100 parts of polymer polyol, 0-5 parts of small molecular alcohol, 0.1-1 part of an antioxidant, 0.1-1 part of an ultraviolet light absorber, 0.1-1 part of a light stabilizer, 0.5-8 parts of a catalyst, 0.1-1 part of a defoaming agent, 0.1-1 part of a coupling agent and 0-20 parts of a plasticizer; the component B is prepared from the following components in parts by weight: 20-50 parts of polyisocyanate and 40-80 parts of a plasticizer. The polyurethane pouring sealant has the characteristics of being low in viscosity and hardness, few in foams, capable of being cured at the normal temperature, high in curing speed and easy to operate; a cured product has good oxidation resistance and insulation and humidity resistance and relatively good metal bonding force.

Description

technical field [0001] The invention relates to a polyurethane potting glue suitable for sealing electronic components and a preparation method thereof. Background technique [0002] With the development of electronic technology, electronic components are developing in the direction of integration and miniaturization. In order to protect electronic components and effectively isolate them from the external environment, it is necessary to use electronic potting glue to pot and seal them. Electronic potting glue can play the role of waterproof, moisture-proof, dust-proof, improve the insulation between internal components and lines, and improve the impact resistance. However, the existing potting adhesives often have problems such as high hardness, high viscosity, poor transparency after curing, many bubbles, poor insulation, weak adhesion to metal, and long curing time during actual use. [0003] In view of this, the present invention proposes a new type of electronic pottin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J11/06C08G18/32C08G18/67C08G18/76C08G18/48C08G18/62C08G18/66
Inventor 谭锦锦王捷
Owner BEIJING JINWEINA TECH CO LTD
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