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Conductive silver adhesive with low solid content and capable of being rapidly cured at medium and normal temperature

A technology of conductive silver glue and low solid content, applied in the field of conductive glue, can solve the problems of good conductivity of conductive silver glue, not too high curing temperature, short curing time, etc., to achieve low product cost, short curing time, increase coating Overlay effect

Active Publication Date: 2015-12-09
上海巨尔希电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention is to provide a kind of conductive silver adhesive with low solid content and fast curing at normal temperature, so as to solve the problem that the current conductive silver adhesive fails to achieve better conductivity, not too high curing temperature, shorter curing time and lower curing temperature at the same time. The silver content of the problem

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment

[0031] Silver nanowires with a length of 40 μm and a diameter of about 35 nm and silver powder of 10 μm are used as conductive fillers, E51 epoxy resin is used as resin, T31 is used as curing agent, and 2,4,6-tris-(dimethylaminomethyl)-phenol is used as Curing accelerator, terpineol as diluent, K550 as coupling agent, terephthalic acid as conduction accelerator, hydroxypropyl cellulose as plasticizer, nano silicon dioxide as thixotropic agent, tributyl phosphate as Defoamer, ICAM8401 as stabilizer. The concrete formula of slurry is:

[0032] Silver nanowires, 1%;

[0033] Silver powder, 24%;

[0034] E51 epoxy resin, 20%;

[0035] T31, 5%;

[0036] 2,4,6-tris-(dimethylaminomethyl)-phenol, 0.5%;

[0037] Terpineol, 2%;

[0038] K-550, 2%;

[0039] Terephthalic acid, 1%;

[0040] Hydroxypropylcellulose, 43%;

[0041] Nano silica, 1%;

[0042] Tributyl phosphate, 0.2%;

[0043] ICAM8401, 0.3%;

[0044] According to the amount of 1 kg of silver colloidal products, calc...

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Abstract

The invention discloses a conductive silver adhesive with low solid content and capable of being rapidly cured at medium and normal temperature. The conductive silver adhesive is prepared from 1%-2% of silver nanowires, 13%-29% of flake silver powder, 20%-30% of bisphenol A epoxy resin, 5%-10% of rapid medium and normal temperature curing agents, 0.5%-1% of rapid medium and normal temperature curing accelerant, 1%-3% of thinning agents, 1%-3% of K-570 or K-550, 0.5%-1% of terephthalic acid, 20%-56.3% of cellulose, 0.5%-1% of nano-silicon dioxide, 0.1%-0.5% of antifoaming agents and 0.1%-0.5% of ICAM8401 or ICAM8402. The conductive silver adhesive can be rapidly cured at medium and normal temperature and is low in silver content and low in cost, and therefore the application range of the conductive silver adhesive is greatly extended.

Description

technical field [0001] The invention belongs to the field of conductive adhesives, in particular to a conductive silver adhesive with low solid content and rapid curing at medium and normal temperatures. Background technique [0002] Previously, building a conductive path between two objects was mainly achieved by tin-lead soldering. However, the heavy metal pollution caused by tin-lead soldering and its high soldering temperature have limited its application in the field of electronic information. To solve this problem, people have developed conductive silver glue. Conductive silver glue is easy to use, excellent in performance, and less polluting. Therefore, it gradually replaces some functions of tin-lead soldering in the field of electronic information and becomes an important circuit construction material. It has great potential in microelectronic assembly, printed circuit, bonding, etc. widely used. The increased demand has stimulated the research of conductive silv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C09J11/04C09J11/06C09J11/08
Inventor 阮海波王然龙李璐刘碧桃关有为黎军军
Owner 上海巨尔希电子科技有限公司
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