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Metal foil laminate

A technology of metal foil and laminate, applied in the direction of metal layered products, layered products, synthetic resin layered products, etc., can solve the problems of reduced folding resistance, increased rebound of substrate materials, low rebound, etc., to achieve Excellent softness effect

Active Publication Date: 2017-06-06
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, problems such as "chip bump depression" occur due to deformation of the polyimide resin layer at the chip mounting temperature
Or, with fine patterning, there is a problem that the folding resistance is lowered
In addition, due to the miniaturization, weight reduction, and thinning of electronic equipment, when they are assembled into final products, they are mounted in more compact shapes such as U-shaped and U-shaped. The original force) increases, and failures such as abnormalities occur on the joints with final products such as panels
However, the current situation is that it is difficult to obtain a strong molded article with any of the resin compositions, and it is difficult to obtain the bending resistance, folding resistance, flexibility, and low resilience that are trade-offs with it. take into account

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0257] Under nitrogen flow, 211.3 g (1.10 moles) of trimellitic anhydride, 132.1 g (0.05 moles) of o-toluidine diisocyanate, 125.3 g (0.05 moles) of 4,4'-diphenylmethane diisocyanate, fluorine 0.6 g of potassium chloride and 2,500 g of N-methyl-2-pyrrolidone (purity: 99.9%) were heated up to 100° C., and reacted as they were for 5 hours. Then, it was made to react at 130 degreeC for 3 hours, N-methyl-2-pyrrolidone was added and the concentration was adjusted so that the solution viscosity might become 400 dPa*s, and it cooled to room temperature. The obtained polyamide-imide resin (referred to as polyamide-imide composition A) was dissolved in a polymerization solvent, and the resin characteristics of logarithmic viscosity, acid value, and number-average molecular weight are shown in Table 1.

[0258] Then, 24 g (6 mass % with respect to the total solid content) of a phenol novolak type epoxy resin (Mitsubishi Chemical Corporation JER154) was mixed, and the varnish for casting...

Embodiment 2

[0260] Only the trimellitic anhydride which is the acid component in Example 1 was changed to 1.02 mol, and the logarithmic viscosity and molecular weight of Table 1 were adjusted appropriately, and the polyamide-imide resin varnish was produced. The polyamideimide resin varnish obtained in Example 2 was completely dissolved in a solvent, and the resin properties of the obtained resin varnish are shown in Table 1.

[0261] Then, 12 g (3 mass % with respect to the total solid content) of a phenol novolak type epoxy resin (Mitsubishi Chemical Corporation JER154) was mixed, and the casting varnish was produced. Then, using the obtained casting varnish, a metal foil laminate was produced, and a flexible printed wiring board for evaluation of folding resistance, insolubility, Gurley flexural rigidity (indicator of low resilience), and mountability evaluation were produced. Each base film was used to evaluate each characteristic. The results of the characteristic evaluation are sho...

Embodiment 3

[0266] Under nitrogen flow, 161.4 g (0.84 mol) of trimellitic anhydride, 50.8 g (0.16 mol) of 3,3', 4,4'-benzophenone tetracarboxylic dianhydride, 3,3', 4,4'-biphenyltetracarboxylic dianhydride 15.5g (0.05 mol), o-toluidine diisocyanate 264.3g (1.00 mol), potassium fluoride 0.6g, and N-methyl-2-pyrrolidone (purity 99.9 %) 2230, the temperature was raised to 100°C, and it was directly reacted for 6 hours. Then, it was made to react at 130 degreeC for 4 hours, N-methyl-2-pyrrolidone was added and the concentration was adjusted so that the solution viscosity might become 300 dPa*s, and it cooled to room temperature. The obtained polyamide-imide resin (referred to as polyamide-imide composition B) was dissolved in a solvent, and the resin characteristics of logarithmic viscosity, acid value, and number-average molecular weight are shown in Table 1.

[0267] Then, 12 g (3 mass % with respect to the total solid content) of a phenol novolak type epoxy resin (Mitsubishi Chemical Corp...

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Abstract

The present invention realizes at the same time: the prevention of sinking into the substrate film layer of the chip when bonding the metal wiring and the chip (that is, the mountability), the trade-offs of bending resistance, folding resistance, flexibility, and bending of the substrate during mounting, etc. Reduction in springback, etc., which is considered a problem. Provided is a metal foil laminate, which is characterized in that it is a metal foil laminate comprising a base film and a metal foil on at least one surface of the metal foil, the heat-resistant resin composition containing Oxygen resin cross-linked polyimide resin, and the following (a) and (b): (a) when the total amount of polyimide resin and epoxy resin is set as 100% by mass, epoxy The mixing amount of the resin is not less than 0.1% by mass and not more than 10% by mass; (b) to the base film obtained by removing the metal foil from the metal foil laminate, adding N-methyl-2-pyrrolidone to the base film The concentration was changed to 0.5% by mass, and after heat treatment at 100° C. for 2 hours, the insolubility of the base film was 40% or more.

Description

technical field [0001] The present invention relates to a metal foil laminate in which a polyimide-based resin is laminated on at least one surface of a metal foil, and a flexible printed circuit board using the metal foil laminate. In particular, the present invention relates to a metal foil laminate suitable for use as a substrate for Chip on Film (hereinafter referred to as COF) on which electronic components such as IC (Integrated Circuit) and LSI (Large Scale Integration) are mounted. body. Background technique [0002] In general, polyimide-based resins are excellent in heat resistance, insulation, chemical resistance, and the like, and are widely used as insulating materials for electric and electronic equipment, and the like. In particular, it is widely used as a raw material for flexible printed wiring boards, and is widely used in circuit board materials and mounting substrate materials for various electronic devices, such as device mounting substrates for display...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/088B32B15/08C08G59/40C08G73/14C08L63/00C08L79/08H05K1/03
CPCC08G73/14C08L79/08C08G73/1067H05K1/032H05K1/0393H05K2201/0154B32B15/092B32B27/281B32B2457/08C08G59/4042C08L63/04C08L63/00
Inventor 多田谦太栗田智晴
Owner TOYOBO CO LTD
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